1 |
Krumbein, S., 1988, "Metallic electromigration phenomena, components, hybrids, and manufacturing technology", IEEE Trans., Vol. 11, pp. 5~15.
|
2 |
Janssen, K., Gijsman, P., and Tummers, D., 1995, "Mechanistic aspects of the stabilization of polyamides by combinations of metal and halogen salts", Polymer Degradation and Stability, Vol. 49, pp. 127~133.
DOI
|
3 |
Minzari, D., Jellesen, M. S., Moller, P., and Ambat, R., 2011, "On the electrochemical migration mechanism of tin electronics", Corrosion Science, Vol. 53, pp. 3366~3379.
DOI
|
4 |
Oh, S., Kim, D., Hong, W., Kim, K., and Oh, C., 2019, "Copper electrochemical migration growth in an air HAST", Microelectronics Reliability, Vol. 100, pp. 1~6.
|
5 |
He, X., Azarian, M. H., and Pecht, M. G., 2011, "Evaluation of electrochemical migration on printed circuit boards with lead-free and tin-lead solder", Journal of Electronic Materials, Vol. 40, pp. 1921~1936.
DOI
|