Formation of Copper Seed Layers and Copper Via Filling with Various Additives |
Lee, Hyun-Ju
(School of Materials Science and Engineering, Pusan National University)
Ji, Chang-Wook (School of Materials Science and Engineering, Pusan National University) Woo, Sung-Min (Education Program for Samsung Advanced Integrated Circuit, Pusan National University) Choi, Man-Ho (Education Program for Samsung Advanced Integrated Circuit, Pusan National University) Hwang, Yoon-Hwae (Department of Nanomaterials Engineering and BK 21 Nano Fusion Technology Division, Pusan National University) Lee, Jae-Ho (Department of Materials Science and Engineering, Hongik University) Kim, Yang-Do (School of Materials Science and Engineering, Pusan National University) |
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