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http://dx.doi.org/10.3740/MRSK.2012.22.7.335

Formation of Copper Seed Layers and Copper Via Filling with Various Additives  

Lee, Hyun-Ju (School of Materials Science and Engineering, Pusan National University)
Ji, Chang-Wook (School of Materials Science and Engineering, Pusan National University)
Woo, Sung-Min (Education Program for Samsung Advanced Integrated Circuit, Pusan National University)
Choi, Man-Ho (Education Program for Samsung Advanced Integrated Circuit, Pusan National University)
Hwang, Yoon-Hwae (Department of Nanomaterials Engineering and BK 21 Nano Fusion Technology Division, Pusan National University)
Lee, Jae-Ho (Department of Materials Science and Engineering, Hongik University)
Kim, Yang-Do (School of Materials Science and Engineering, Pusan National University)
Publication Information
Korean Journal of Materials Research / v.22, no.7, 2012 , pp. 335-341 More about this Journal
Abstract
Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.
Keywords
Cu via filling; desmear treatment; additives; bottom-up super filling;
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