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http://dx.doi.org/10.7844/kirr.2021.30.2.24

Dismantling of Components from Waste Printed Circuit Boards Using Stannic Chloride Solution  

Park, Yujin (Department of Energy and Resources Engineering, Korea Maritime and Ocean University)
Yoo, Kyoungkeun (Department of Energy and Resources Engineering, Korea Maritime and Ocean University)
Publication Information
Resources Recycling / v.30, no.2, 2021 , pp. 24-30 More about this Journal
Abstract
Dismantling tests were performed to separate components from waste printed circuit boards (PCBs) using HCl solution with Sn4+. Then, the effects of agitation speed, reaction temperature, initial Sn4+ concentration, and HCl concentration on the dismantling of components were investigated. No significant effect on the dismantling speed was observed upon changing the agitation speed from 100 to 300 rpm. However, the dismantling rate increased with increasing reaction temperature, Sn4+ concentration, and HCl concentration. In the all-component dismantling tests, when the dismantling ratio increased to 100%, no solder was observed on the boards, and the Sn4+ concentration was ~1,500 mg/L. The dismantling ratio of the components from the PCB increased to 100% within 2 h when 1 mol/L HCl solution with 10,000 mg/L Sn4+ was used at an agitation speed and temperature of 200 rpm and 90 ℃, respectively.
Keywords
Waste printed circuit boards; Dismantling; Hydrochloric acid leaching; Stannic chloride;
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