• Korean Chemical Engineering Research
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• v.45 no.4
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• pp.319-327
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• 2007

Incineration has been regarded as the best developed technology available for organically hazardous waste. However, permitting and siting incinerators to treat hazardous waste such as a waste containing PCBs is very difficult due to the public concerns associated with toxic air emissions. Recently, a lot of alternatives to an incineration have been developed and these technologies have the potential of alleviating public concerns by decreasing emissions of hazardous materials such as dioxins and furans. This paper reviews currently available alternative incineration technologies for various hazardous waste streams. Various categories of non-thermal and thermal alternative incineration technologies have been evaluated in terms of their process operating condition, applicability of a waste stream and their emission of secondary waste. Detailed descriptions of operating principles of several technologies are also provided.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.10 no.10
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• pp.4748-4765
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• 2016

We consider a virtualized cognitive radio (CR) network, where multiple virtual network operators (VNOs) who own different virtual cognitive base stations (VCBSs) share the same physical CBS (PCBS) which is owned by an infrastructure provider (InP), sharing the spectrum with the primary user (PU). The uplink scenario is considered where the secondary users (SUs) transmit to the VCBSs. The PU is protected by constraining the interference power from the SUs. Such constraint is applied by the InP through pricing the interference. A Stackelberg game is formulated to jointly maximize the revenue of the InP and the individual utilities of the VNOs, and then the Stackelberg equilibrium is investigated. Specifically, the optimal interference price and channel allocation for the VNOs to maximize the revenue of the InP and the optimal power allocation for the SUs to maximize the individual utilities of the VNOs are derived. In addition, a low‐complexity ±‐optimal solution is also proposed for obtaining the interference price and channel allocation for the VNOs. Simulations are provided to verify the proposed strategies. It is shown that the proposed strategies are effective in resource allocation and the ±‐optimal strategy achieves practically the same performance as the optimal strategy can achieve. It is also shown that the InP will not benefit from a large interference power limit, and selecting VNOs with higher unit rate utility gain to share the resources of the InP is beneficial to both the InP and the VNOs.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Bulletin of the Korean Chemical Society
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• v.20 no.6
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• pp.689-695
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• 1999

Supercritical fluid extraction (SFE), ultrasonic extraction (USE), and accelerated solvent extraction (ASE) were compared with the well known Soxhlet extraction for the extraction of polychlorinated biphenyls (PCBs) and polychlorinated dibenzo-p-dioxins(PCDDs) from the XAD-2 resin which was used to adsorb PCDDs in the atmosphere. XAD-2 resin spiked with five PCDDs was chosen as a sample. The optimum conditions for the extraction of PCDDs by SFE were turned out to be the use of CO2 modified with 10% toluene at 100 ℃ and 350 atm, with 5 min static extraction followed by 20 min dynamic extraction. SFE gave a good extraction rate with good reproducibility for PCDDs ranging from 68 to 98%. The ultrasonic extraction of PCDDs from XAD-2 was investigated and compared with other extractions. A probe type method was compared with a bath type. Two extraction solvents, toluene and acetone were compared with their mixture. The use of their mixture in probe type, with 9 minutes of extraction time, was found to be the optimum condition. The average recovery of the five PCDDs for USE was 82-93%. Accelerated solvent extraction (ASE) with a liquid solvent, a new technique for sample preparation, was performed under elevated temperatures and pressures. The effect of tem-perature on the efficiency of ASE was investigated. The extraction time for a 10 g sample was less than 15 min, when the organic solvent was n-hexaneacetone mixture (1 : 1, v/v). Using ASE, the average recoveries of five PCDDs ranged from 90 to 103%. SFE, USE, and ASE were faster and less laborious than Soxhlet extraction. The former three methods required less solvent than Soxhlet extraction. SFE required no concentration of the solvent extracts. SFE and ASE failed to perform simultaneous parallel extractions because of instrumental limitations.

• Resources Recycling
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• v.30 no.2
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• pp.24-30
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• 2021

Dismantling tests were performed to separate components from waste printed circuit boards (PCBs) using HCl solution with Sn4+. Then, the effects of agitation speed, reaction temperature, initial Sn4+ concentration, and HCl concentration on the dismantling of components were investigated. No significant effect on the dismantling speed was observed upon changing the agitation speed from 100 to 300 rpm. However, the dismantling rate increased with increasing reaction temperature, Sn4+ concentration, and HCl concentration. In the all-component dismantling tests, when the dismantling ratio increased to 100%, no solder was observed on the boards, and the Sn4+ concentration was ~1,500 mg/L. The dismantling ratio of the components from the PCB increased to 100% within 2 h when 1 mol/L HCl solution with 10,000 mg/L Sn4+ was used at an agitation speed and temperature of 200 rpm and 90 ℃, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.12
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• pp.1-6
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• 2018

This study examined the quality improvement of printed circuit boards (PCBs) in relation to the power consumption for radar. The radar examined is currently in production and being used by the military. The PCB converts 28 V DC to 5 V DC but frequently malfunctions. Therefore, cause analysis was carried out. As a result, the power consumed by a certain communication IC was very high, and the heat generated by the high power consumption caused damage to the surrounding parts. Accordingly, it was changed to an improved communication IC that meets all the radar system specifications. System tests were carried out for the changed communication IC to check the impact on the system, and environmental tests were performed, which proved that the performance required by the radar system is satisfactory. As a result of this improvement, there has been no history of failure in this PCB so far. Therefore, the quality of this PCB has been improved.

• Journal of Auto-vehicle Safety Association
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• v.13 no.2
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.1-5
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• 2024

In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.