• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.1787-1788
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• 2006

In this paper, a noisy passive telemetry sensor system using Unscented Kalman Filter (UKF) is proposed. To overcome these trouble problems such as a power limitation and a estimation complexity that the general passive telemetry sensor system including IC chip has, the principle of inductive coupling was applied to the modelling of a passive telemetry sensor system (PTSS) and its noisy capacitive parameter was estimated by the UKF algorithm. Specialty, to show the effective tracking performance of the UKF, we compared with the tracking performance of Recursive Least Square Estimation (RLSE) using linearization

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2004.04a
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• pp.495-498
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• 2004

In this paper, passive telemetry capacitive humidity sensor system using a RLSE(Recursive Least Square Estimation) technique Is proposed. To overcome the problem like power limits and complications that general passive telemetry sensor system including IC chip has, the principle of inductive coupling is applied to model the sensor system. Specially, by applying the forgetting factor, we show that the accuracy of its estimation can be improved even in the case of time varying parameter and also the convergence time can be reduced.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2004.10a
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• pp.515-520
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• 2004

In this paper, a passive telemetry RF capacitive humidity sensor system using a RLSE(Recursive Least Square Estimation) technique is proposed. To overcome these trouble problems such as a power limitation and a estimation complexity that the general passive telemetry sensor system including It chip has, the principle of inductive coupling was applied to the modeling of a passive telemetry RF capacitive humidity sensor system and its capacitance was estimatedd by the RLSE algorithm. Specially, by introducing the optimal forgetting factor, we showed that the accuracy of its estimation was improved even in the time varying system and also the convergence time was reduced.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.9
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• pp.1615-1620
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• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.3
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• pp.269-274
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• 2022

We prepared carbon nanotube (CNT) paper by a vacuum filtration method for the use of a chip-typed resistor as a precision passive device with a constant resistance. Hybrid resistor composed of the CNT resistor with a negative temperature coefficient of resistance (T.C.R) and a metal alloy resistor with a positive T.C.R could lead to a constant resistance, because the resistance increase owing to the temperature increase at the metal alloy and decrease at the CNT could counterbalance each other. The constant resistance for the precision passive devices should be maintained even when a heat was generated by a current flow resulting in resistance change. Performance reliabilities of the CNT resistor for the precision passive device applications such as electrical load limit, environmental load limit, and life limit specified in IEC 60115-1 must be ensured. In this study, therefore, the rated power determination and T.C.R tests of the CNT paper were conducted. -900~-700 ppm/℃ of TCR, 0.1~0.2 A of the carrying current capacity, and 0.0625~0.125 W of the rated power limit were obtained from the CNT paper. Consequently, we confirmed that the application of CNT materials for the precision hybrid passive devices with a metal alloy could result in a better performance reliability with a zero tolerance.

• ETRI Journal
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• v.30 no.3
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• pp.347-354
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• 2008

In this paper, the design of a low-power 512-bit synchronous EEPROM for a passive UHF RFID tag chip is presented. We apply low-power schemes, such as dual power supply voltage (VDD=1.5 V and VDDP=2.5 V), clocked inverter sensing, voltage-up converter, I/O interface, and Dickson charge pump using Schottky diode. An EEPROM is fabricated with the 0.25 ${\mu}m$ EEPROM process. Power dissipation is 32.78 ${\mu}W$ in the read cycle and 78.05 ${\mu}W$ in the write cycle. The layout size is 449.3 ${\mu}m$ ${\times}$ 480.67 ${\mu}m$.

• Journal of Advanced Marine Engineering and Technology
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• v.36 no.1
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• pp.157-165
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• 2012

In this study, a short-wavelength transmission line employing periodically arrayed capacitive devices (PACD) was studied for application to miniaturized on-chip passive component on monolithic microwave integrated circuit (MMIC). The transmission line employing PACD showed shorter wavelength and lower characteristic impedance than conventional microstrip transmission line. The wavelength transmission line employing PACD structure was 8% of the conventional microstrip transmission line on GaAs substrate. Using the theoretical analysis, basic characteristic of the transmission line employing PACD (e.g., loss, effective dielectric constant, effective propagation constant, bandwidth ) were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components on MMIC. Above results indicate that the transmission line employing PACD is a promising candidate for a development of miniaturized passive components on MMIC.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.1
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• pp.68-75
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• 2007

A single chip NFC transceiver supporting not only NFC active and passive mode but also 13.56MHz RFID reader and tag mode was designed and fabricated. The proposed NFC transceiver can operate as a RFID tag even without external power supply which has dual antenna structure for initiator and target. The area increment due to additional target antenna is negligible because the target antenna is constructed by using a shielding layer of initiator antenna. The analog front end circuit of the proposed NFC transceiver consists of a transmitter and receiver of reader/writer block supporting NFC initiator or RFID reader mode, and a tag circuit for target of passive NFC mode or RFID tag mode. The maximum baud rate of the proposed NFC device is 212kbps by using UART serial interface. The chip has been designed and fabricated using a Magnachip's $0.35{\mu}m$ double poly 4-metal CMOS process, and the effective area of the chip is 2200um by 3600um.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.4
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.