Browse > Article
http://dx.doi.org/10.6117/kmeps.2022.29.3.031

A Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT)  

Park, Dong-Woon (Department of Mechanical Convergence Engineering, Hanyang University)
Yu, Myeong-Hyeon (Department of Mechanical Convergence Engineering, Hanyang University)
Kim, Hak-sung (Department of Mechanical Convergence Engineering, Hanyang University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.3, 2022 , pp. 31-35 More about this Journal
Abstract
Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.
Keywords
Surface mount technology; pad design; passive chip; SAC305; reliability;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Y. Wang, M. Olorunyomi, M. Dahlberg, Z. Djurovic, J. Anderson, and J. Liu, "Process and pad design optimization for 01005 passive component surface mount assembly", Soldering & Surface Mount Technology, 19(1), 34-44 (2007).   DOI
2 W. H. Chen, K. N. Chiang, and S. R. Lin, "Prediction of liquid formation for solder and non-solder mask defined array packages", Journal of Electronic Packaging, 124(1), 37-44 (2002).   DOI
3 K. C. K. Chuan, S. Sutiono, B. Senthil, K. G. T. Tiam, K. S. Sig, R. S. Kumar, Z. R. Fen, and C. Li-San, "Voids Reduction in Fine Pitch SiP Assembly Through Optimization of Reflow Parameters", IEEE 22nd Electronics Packaging Technology Conference (EPTC), 291-296 (2020).
4 M. Branzei, M. Vladescu, B. Mihailescu, L. Plotog, and G. Varzaru, "Investigations related to electrically conductive adhesives pastes usage on SMT lines", 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME), 355-360 (2018).
5 Y.-G. Kim and T.-H. Park, "SMT assembly inspection using dual-stream convolutional networks and two solder regions" 10(13), 4598 (2020).
6 L. Bai, X. Yang, and H. Gao, "Corner point-based coarse-fine method for surface-mount component positioning", 14(3), 877-886 (2017).
7 S. Yu, J. Sohn, S. Park, and B. J. Oh, "Efficient operation of a multi-functional surface mounting device", 33(3-4), 797- 800 (1997).
8 C. Marques, N. Lopes, G. Santos, I. Delgado, and P. Delgado, "Improving operator evaluation skills for defect classification using training strategy supported by attribute agreement analysis", 119, 129-141 (2018).
9 M.-H. C. Li, A. Al-Refaie, and C.-Y. Yang, "DMAIC approach to improve the capability of SMT solder printing process", 31(2), 126-133 (2008).
10 C. Y. Huang, Y. H. Lin, K. C. Ying, and C. L. Ku, "The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction", Soldering & Surface Mount Technology, 23(4), 211-223 (2011).   DOI
11 D. Li, L. Wang, and Q. Huang, "A case study of SOS-SVR model for PCB throughput estimation in SMT production lines", 2019 International Conference on Industrial Engineering and Systems Management (IESM),-6(2019)
12 M. Rusdi, M. Abdullah, M. Ishak, M. A. Aziz, M. Abdullah, P. Rethinasamy, and A. Jalar, "Three-dimensional CFD simulation of the stencil printing performance of solder paste", 108(9), 3351-3359 (2020).
13 E. H. Amalu, Y. Lui, N. Ekere, R. Bhatti, and G. Takyi, "Investigation of The Effects of Reflow Profile Parameters on Lead-free Solder Bump Volumes And Joint Integrity", AIP Conference Proceedings, 639-644 (2011).
14 N. C. Lee, "Optimizing the reflow profile via defect mechanism analysis", Soldering & Surface Mount Technology, 11(1), 13-20 (1999).   DOI