• Composites Research
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• v.28 no.5
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• pp.322-326
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• 2015

We developed the high-power LED beacon and investigated the applicability of composite materials for the light-weight design of LED beacon. By means of the application of composite materials, the vertical deformation could be reduced by 17% and the total weight of LED beacon 8.9 kg comparable to 20% light-weighting against aluminum beacon. In thermal radiation test, the maximum temperature of LED package was measured to $63.5^{\circ}C$ under ambient temperature ($20^{\circ}C$), which is acceptable considering both performance and lifespan of LED packages. In this study, the applicability of composite materials was demonstrated for light-weight design of high-power LED beacon.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.1
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• pp.17-23
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• 2021

Recent studies on recyclable materials in the packaging have an increased attention due to the eco-friendly policies of reducing carbon dioxide emissions in worldwide. Roasted coffee beans mostly packed in multi-layered films and papers according to their expiration date. To satisfy both recyclability and barrier properties, researches have been continued on paper-based packaging materials to enhance their properties. In this study, packaging materials for coffee beans are developed by laminating bioplastic films on papers. The tests of packaging materials were performed with mechanical properties, gas and water vaper permeability, recyclability and storage quality for coffee beans. Compared to other samples, the paper/bioplastics-based coffee package composed of starch coated papers and two bioplastics showed the lowest barrier properties, comparable mechanical strength and ability to maintain the quality of roasted coffee beans. Thus, it could be a good alternative for multi-layered packages for roasted coffee beans.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.1-8
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• 2006

Higher density integration and adoption of new materials in advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, metal interconnects respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic package. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in D.I. water and NaCl solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Pb was primarily ionized in both D.I. water and $Cl^{-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for ECM resistance of solder alloys.

• Transactions of Materials Processing
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• v.12 no.3
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• pp.236-243
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• 2003

Maintaining the required dimensional accuracy after springback becomes the main concern of sheet-forming die designers when formability is secured through beforehand tryouts. As a part to build guidelines for springback control in automobile frame forming, experiments are carried out to show the effects of process parameters, such as holding force, blank size, and lubrication, on corner angles of channels formed by U-bending or by square-cup drawing and trimming. The results predicted by a commercial FE package were compared with the experiment and the current limitations on springback evaluation were closely discussed.

• Journal of the Korean Home Economics Association
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• v.23 no.3
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• pp.137-147
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• 1985

The purpose of this study was to investigate 1) color concept development in preschool children, 2) general color preferences using colored parers, 3) specific color preference using colored chairs, and 4) to determine the relationships of sex and age to general color preference. The present experiment with materials developed through the pilot experiment, was conducted with 70 3, 4, and 5-year-old children attending the Child development research institute of Yonsei Univ. as subjects. Data were analyzed with SAS package using frequency, percentage, $\chi$\sup 2\-test, C\sup 2\ and visualized by SAS graph with tektronix 4113.

• Applied Science and Convergence Technology
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• v.26 no.6
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• pp.195-200
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• 2017

A mobile lab kart for plasma training is developed with a high vacuum pumping system, vacuum gauges and a glass discharge tube powered by a high voltage transformer connected to a household 60 Hz line. A numerical model is developed by using a commercial multiphysics software package, CFD-ACE+ to analyze the experimental data. Simulations for argon and nitrogen were carried out to provide fundamental discharge characteristics. Variations of the kart configuration were demonstrated: a glass tube with three electric probes, optical emission spectrometer attachment and infra red thermal imaging system to give more detailed analysis of the discharge characteristics.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• ETRI Journal
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• v.31 no.6
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• pp.749-754
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• 2009

The design and performance of an InGaAs/InP transimpedance amplifier and post amplifier for 40 Gb/s receiver applications are presented. We fabricated the 40 Gb/s transimpedance amplifier and post amplifier using InGaAs/InP heterojunction bipolar transistor (HBT) technology. The developed InGaAs/InP HBTs show a cut-off frequency ($f_T$) of 129 GHz and a maximum oscillation frequency ($f_{max}$) of 175 GHz. The developed transimpedance amplifier provides a bandwidth of 33.5 GHz and a gain of 40.1 $dB{\Omega}$. A 40 Gb/s data clean eye with 146 mV amplitude of the transimpedance amplifier module is achieved. The fabricated post amplifier demonstrates a very wide bandwidth of 36 GHz and a gain of 20.2 dB. The post-amplifier module was fabricated using a Teflon PCB substrate and shows a good eye opening and an output voltage swing above 520 mV.

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.33-37
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• 2013

In this study a new design concept of the Fabry-Perot filter, constructed with an anisotropic space layer and a couple of isotropic mirrors, was proposed based on the Maxwell equations and the characteristic matrix method. The single- and double-cavity Fabry-Perot filters were designed, and their optical properties were investigated with a developed software package. In addition, the dependence of the transmittance and phase shift for two orthogonal polarization states on the column angle of the anisotropic space layer and the incidence angle were discussed. We demonstrated that the polarization state of electromagnetic waves and phase shifts can be modulated by exploiting an anisotropic space layer in a polarization F-P filter. Birefringence of the anisotropic space layer provided a sophisticated phase modulation with varied incidence angles over a broad range, resulting in a wide-angle phase shift. This new concept would be useful for designing optical components with isotropic and anisotropic materials.