• Journal of the Korean Society for Precision Engineering
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• v.33 no.6
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• pp.431-438
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• 2016

Recently, concerns about the environment are becoming more important because of global warming and the exhaustion of earth's resources. In the aviation and automobile industries, the application of light materials is increasingly important for eco-friendly and effective. Carbon Fiber Reinforced Plastics is a composite material which great formability and the high strength of carbon fiber. CFRP, which is both light and strong, is hard to manufacture. In addition, CFRP machining has a high chance of defects. This research discusses the development of a manufacturing system package for CFRP machining. It involving CFRP Drilling/Water-jet Manufacturing Machines, Inspection/Post-processing Systems, CNC platform for an EtherCAT servo Communication, Flexible Manufacturing Systems and CFRP machining Processes.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1511_1512
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• 2009

This paper presents a polarization switching antenna integrated with silicon RF MEMS SPDT switches in the form of a package. A low-loss quartz substrate made of SoQ (silicon-on-quartz) bonding is used as a dielectric material of the patch antenna, as well as a packaging lid substrate of RF MEMS switches. The packaging/antenna substrate is bonded with the bottom substrate including feeding lines and RF MEMS switches by BCB adhesive bonding, and RF energy is transmitted from signal lines to antenna by slot coupling. Through this approach, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects, which are all caused from the packaging methods, can be reduced. This structure is expected to be used as a platform for reconfigurable antennas with RF MEMS tunable components. A linear polarization switching antenna operating at 19 GHz is manufactured based on the proposed method, and the fabrication process is carefully described. The s-parameters of the fabricated antenna at each state are measured to evaluate the antenna performance.

• Archives of design research
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• v.16 no.2
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• pp.233-242
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• 2003

Whit trade increasingly taking place on the global stale, packaging becomes even more important However, there is only a fine line between the balance of waste created by damaged goods and waste created by over-packaging. A vast quantity of material is used by the packaging industry for the reason of bringing products safely to the customers. In this research I gathered 87 samples of various kinds of confectionery to analyse the actual conditions of the appropriate packaging. As a result, the rate of the needless space excluding actual contents comes to over 60% which clearly says that the most products are over-packaged. Despite assertions from the packaging industry that all packaging is necessary in reducing product waste, the research shows us the fact that it's over-packaged. What needs to be questioned, here, is the level of materials we use in packaging our products, and how we can continue to decrease that amount and recycle what we do use. In the future where materials and resources become more scarce, and therefore more expensive, and the methods of disposal become more costly and accountable, designers and manufacturers constantly need rethink and improve methods of packaging.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.112-117
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• 2008

Vertical interconnection scheme using novel silicon-through-via for 3D MEMS devices or stacked package is proposed and fabricated to demonstrate its feasibility. The suggested silicon-through-via replaces electroplated copper, which is used as an interconnecting material in conventional through-via, with doped silicon. Adoption of doped silicon instead of metal eliminates thermal-mismatch-induced stress, which can make troubles in high temperature MEMS processes, such as wafer bonding and LP-CVD(low pressure chemical vapor deposition). Two silicon layers of $30{\mu}m$ thickness are stacked on the substrate. The through-via arrays with spacing $40{\mu}m$ and $50{\mu}m$ are fabricated successfully. Electrical characteristics of the through-via are measured and analyzed. The measured resistance of the silicon-through-via is $169.9\Omega$.

• Korean Journal of Food Science and Technology
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• v.23 no.2
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• pp.217-223
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• 1991

A capillary method was used to evaluate the properties of mass transfer process and diffusion coefficients in the gel food. Amaranth dye was selected as a diffusant material to visualize the degree of diffusion procedure easily. After contacting cylinder containing agar gel with amaramth dye solution for some hours, the gel was cut to five segments by 0.5 cm in length. The diffusant concentration from the segments were measured by the spectrophotometer at 523 nm. Prediction models for the diffused quantities in gel food were established by the regression program of SPSS package program. Generally, diffusion coefficient can be calculated by Fick's second law, however, it will be determined by using numerical analysis method more easily. Finally the diffusion coefficients in this research were calculated by arithmetic mean of the measured values. As raising gel agent concentration, the mean diffusion coefficient tended to decrease because the obstruction effect came to become significant.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2005.06a
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• pp.457-463
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• 2005

KHNP(Korea Hydro and Nuclear Power Ltd., Co.) is developing a HIC transport package which is satisfying domestic and IAEA regulations and NETEC(Nuclear Environment Technology Institute) is conducting a conceptual design. In this study, the shielding thickness was calculated using the data from radionuclide assay program which is currently using in nuclear sites and Micro Shield code. Considering the structural safety, carbon steel was chosen as shielding material and the shielding thickness was calculated for 500 R/hr and 100 R/hr at HIC surface, respectively. Through the shielding analysis, it was evaluated that the regulation limit is satisfied when the shielding thickness is 22 cm for 500 R/hr and 17 cm for 100/hr.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.89-94
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• 2019

Glass base sealant is required as a ceramic-ceramic joining material between α-alumina insulation cap and β-alumina electrolyte tube in the development of NaS battery cell package for electrical energy storage system. The fabrication of glass frit by thermal quenching method, phase analysis, particle size analysis, coefficient of thermal expansion and surface roughness according to the glass compositions were analyzed for the fabrication of glass sealing paste for ceramic-ceramic joining. Also, a new evaluation method of the adhesion strength of glass sealant at the small area in ceramic-ceramic joining component was proposed using conventional Dage bond tester that was used to measure the adhesion of solder ball joint.

• Journal of the Korean Society of Food Culture
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• v.34 no.2
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• pp.233-239
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• 2019

This paper presents a literature review on the active technologies to regulate the levels of carbon dioxide and oxygen in Kimchi packaging. In this study, laser-etched pouches and $O_2$ scavengers were used for Kimchi packaging, and the efficiency of each packaging technique to regulate the $CO_2$ and $O_2$ levels inside Kimchi packages was investigated. When Kimchi was packaged with a laser-etched pouch, the $CO_2$ concentration in the sample with a high gas transmission rate was less than that in other pouches (p<0.05), and a low $CO_2$ level had little effect on the expansion of the package volume. Kimchi treated with an $O_2$ absorber exhibited a significantly lower (p<0.05) $O_2$ concentration inside the packages relative to the control. A low $O_2$ concentration inside the Kimchi package effectively inhibited the growth of total aerobic bacteria and lactic acid bacteria, as well as yeasts and molds on Kimchi. These results suggest that $O_2$ absorbers have a positive effect on the microbial quality of Kimchi. Therefore, packaging in a laser-etched pouch and the use of an $O_2$ scavenger could provide a novel packaging material for regulating the $CO_2$ and $O_2$ levels during Kimchi packaging.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.45-50
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• 2021

As the difficulty of flip chip products increases, there is a growing interest in the material of flux, which is safe from the solder wetting and reliability. In the case of no clean flux, there is merit in terms of process efficiency because there is no cleaning process. But Cu migration and delamination can be occurred if the residue remains after the reflow process. In this study, major element materials, solvent and activator, are changed and confirmed effect of non-wet and reliability in the package environment. Stability of materials were secured through storage stability evaluation, and we found out non-wet zero materials through the application of two types of solvent and activator with different boiling point and the increase of activator content. After reliability test, no delamination was found in the plane analysis, which secured the final composition of low residue flux.