• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.350-350
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• 2013

Sol-gel법을 이용하여 p-Si 기판위에 yttrium이 도핑된 ZnO (YZO)를 성장하였다. ZnO의 precursor로는 zinc acetate dihydrate를, yttrium의 source로는 yttrium acetate hydrate를 사용하였으며, 용매와 안정제로는 각각 2-methoxy ethanol과 monoethanolamine (MEA)를 사용하였다. yttrium의 doping 농도에 따른 영향을 알아보기 위하여 1~4 at.%로 제작된 YZO sol을 각각 p-type Si 기판에 성장하였으며, 이 후 furnace를 이용하여 500oC에서 1시간 동안 열처리하였다. 성장된 YZO 박막의 표면과 두께를 SEM을 통하여 확인하였으며, XRD를 통한 구조적인 특성을 분석한 결과 모든 박막에서 뚜렷한 c-축 배양성을 갖는 ZnO (0002)피크를 확인하였다. Hall effect를 통하여 YZO는 모두 n-type 특성을 나타낸다는 것을 확인하였으며, 광학적인 특성은 PL을 통해서 분석하였다. n-YZO/p-Si 이종접합의 전류-전압 특성을 분석한 결과 뚜렷한 정류특성을 나타내었다.

• Journal of the Korean institute of surface engineering
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• v.24 no.4
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• pp.206-214
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• 1991

In the basic study of selective electroless Ni plating of Si wafers, plating rate and physical properties are investigated to obtain optimum conditions of contact hole filling. Si wafers are excellently activated in the concentration of 0.5M IF, 1mM PdCl2, 2mM EDTA at $70^{\circ}C$, 90sec. The optimum condition of Ni-B deposition on p-type Si wafers is 0.1M NiSO4, 0.11M Citrate, $70^{\circ}C$, pH6.8, 8mM DMAB. The main factor in the sheet resistences variation of films is amorphous and on heat treating matrix was transformed into a stable phase (Ni+Ni3B) at $300-400^{\circ}C$. But pH or DMAB concentration in the plating solution doesn't play role of heat-affected phase change.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.2
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• pp.128-131
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• 2009

Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used Monte-Carlo method. We simulated the effect of channeling by Al implantation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the effect of varying the implantation energies and the corresponding doses on the distribution of Al in 4H-SiC. The controlled implantation energies were 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2{\times}10^{14}$ to $1{\times}10^{15}\;cm^{-2}$. The Al ion distribution was deeper with increasing implantation energy, whereas the doping level increased with increasing dose. The effect of post-implantation annealing on the electrical properties of Al-implanted p-n junction diode were also investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.510-513
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• 2003

Our Zn diffusion into n-type $GaAs_{0.40}P_{0.60}$ used ampoule-tube method to increase IV. N-type epitaxial wafers were preferred by $H_2SO_4$-based pre-treatment. $SiO_2$ thin film was deposited by PECVD for some wafers. Diffusion times and diffusion temperatures respectability are 1, 2, 3 hr and 775, $805^{\circ}C$. LED chips were fabricated by the diffused wafers at Fab. The peak wavelength of all chips showed about $625{\sim}650\;nm$ and red color. The highest IV is about 270 mcd at the diffusion condition of $775^{\circ}C$, 3h for the wafers which didn't deposit $SiO_2$ thin films. Also, the longer diffusion time is the higher IV for the wafers which deposit $SiO_2$ thin films.

• Korean Journal of Environmental Agriculture
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• v.26 no.4
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• pp.286-296
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• 2007

To increase phosphate (P) availability in soils, the efficiency of silicate (Si) in reducing P adsorption was investigated by competitive adsorption tests under changing conditions of pH, ion concentrations, and order of anion addition along with single adsorption properties of each ion at $20^{\circ}C$. In the single ion adsorption study, P and Si ions showed the opposite reaction patterns: phosphate adsorption decreased with increasing pH and attained adsorption maximum however, silicate adsorption increased with increasing pH without attaining adsorption maximum. Phosphorus and Si adsorption were influenced by pH in the range of 5.0 - 9.0 and the type and amount of P and Si concentration. Silicate added to soil before P or in a mixture with P significantly reduced P adsorption above pH 7.0; however, there was no significant Si-induced decreased in P adsorption at pH 5.0 when anions were added as mixture. The efficiency of Si in reducing P adsorption increased with increasing Si concentration and pH. The effect of P on Si adsorption was relatively small at pH 5.0 and no effect of P on silicate adsorption was observed at pH 9.0. The presence of Si strongly depressed P adsorption when Si was added before P compared to P and Si added as a mixture. These results suggest that application of Si may decrease P adsorption and increase the availability of P in soils. Furthermore, a Si source would be better to add before P application to enhance the availability of P in soils.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.682-684
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• 2003

In this paper, we have designed the p-type SiGe MOSFET and analyzed the electrical characteristics over the temperature range of 300K and 77K. When the gate voltage is biased to -1.5V, the threshold voltage values are -0.97V and -1.15V at room temperature and 77K, respectively. We know that the operating characteristics of SiGe MOSFET is superior to the basic Si MOSFET which the threshold voltage is -1.36V.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.3
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• pp.474-477
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• 2003

In this paper, we have designed the p-type SiGe MOSFET and analyzed the electrical characteristics over the temperature range or 300K and 77K. When the gate voltage is biased to -1.5V, the threshold voltage values are -0.97V and -1.15V at room temperature and 77K, respectively. We know that the operating characteristics of SiGe MOSFET is superior to the basic Si MOSFET which the threshold voltage is -1.36V.

• Bulletin of the Korean Chemical Society
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• v.20 no.9
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• pp.1049-1055
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• 1999

Electrochemical oxidation of silicon (p-type Si(100)) at room temperature in ethylene glycol and in aqueous solutions has been performed by applying constant low current densities for the preparation of thin SiO2 layers. In-situ ac impedance spectroscopic methods have been employed to characterize the interfaces of electrolyte/oxide/semiconductor and to estimate the thickness of the oxide layer. The thicknesses of SiO2 layers calculated from the capacitive impedance were in the range of 25-100Å depending on the experimental conditions. The anodic polarization resistance parallel with the oxide layer capacitance increased continuously to a very large value in ethylene glycol solution. However, it decreased above 4 V in aqueous solutions, where oxygen evolved through the oxidation of water. Interstitially dissolved oxygen molecules in SiO2 layer at above the oxygen evolution potential were expected to facilitate the formation of SiO2 at the interfaces. Thin SiO2 films grew efficiently at a controlled rate during the application of low anodization currents in aqueous solutions.

• Korean Journal of Materials Research
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• v.14 no.3
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• pp.218-223
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• 2004

P-type $\beta$-FeSi$_2$ with a nominal composition of $Fe_{0.92}Mn_{0.08}Si_2$ powders has been produced by mechanical alloying process. As-milled powders were spray dried and consolidated by atmospheric plasma thermal spraying as a rapid sintering process. As-milled powders were of metastable state and fully transformed to $\beta$-$FeSi_2$ phase by subsequent isothermal annealing. However, as-thermal sprayed $Fe_{0.92}Mn_{0.08}Si_2$ consisted of untransformed mixture of $\alpha$-$Fe_2Si_{5}$ and $\varepsilon$-FeSi phases. Isothermal annealing has been carried out to induce transformation to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase. Isothermal annealing at $845^{\circ}C$ in vacuum gradually led to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase transformation, but some residual metallic $\alpha$ and $\varepsilon$ phases were unavoidable even after prolonged annealing. Thermoelectric properties of $\beta$-$FeSi_2$ materials before and after isothermal annealing were evaluated. Seebeck coefficient increased and electric conductivity decreased with increasing annealing time due to the phase transition from metallic phases to semiconducting phases. Thermoelectric properties showed gradual increment, but overall properties appeared to be inferior to those of vacuum hot pressed specimens.

• Journal of Korea Foundry Society
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• v.18 no.6
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• pp.541-549
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• 1998

Microstructural characteristics of hypereutectic Al-Si alloys during reheating at semi-solid temperature have been investigated. The size and morphology of primary Si particles in wedge-type mold-cast ingot has been compared with hot-rolled sheet and Si particulate reinforced Al composite. Effects of P and Sr addition on the morphological changes of primary Si particles have been also investigated. Observation of the solidification microstructures of the wedge-type mold-cast ingot at different cooling rates showed that alloying elements such as P and Sr affect the morphology of Si particles, especially in the area solidified at a slow cooling rate. Negligible change in the size of primary crystals was observed after reheating experiment, but ${\alpha}-halo$ formed around the Si particles and fine particles of Si precipitated in the surrounding area of the Si particles. In addition, there seemed to be no coarsening with increasing of holding time and the region of ${\alpha}-halo$ being decreased. Nucleation and recrystallization was accelerated with addition of alloying elements during hot rolling resulting in a decrease of primary Si particle size. In the case of extruded specimens, morphological change of primary Si particles was not observed after reheating. No ${\alpha}-halo$ formation was observed in Si reinforced Al composite because of the oxide film formed on the Si particles which acted as a diffusion barrier between substrate and the primary Si particles.