• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.905-908
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• 1999

In this paper, we present a polysilicon actuator on silicon wafer using surface micromachining technology which employs an electrostatic stepwise driven Scratch Drive Actuator to generate a force that can move an external object. For optical applications, we propose wavelength selector using distributed feedback structures and this micro actuator.

• Journal of Sensor Science and Technology
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• v.7 no.2
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• pp.103-110
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• 1998

Pyroelectric infrared detectors based on La-modified $PbTiO_{3}$ (PLT) thin films have been fabricated by RF magnetron sputtering and rnicrornachining technology. The detectors form $Pb_{l-x}La_{x}Ti_{1-x/4}O_{3}$ (x=0.05) thin film ferroelectric capacitors epitaxially grown by RF magnetron sputtering on Pt/MgO (100) substrate. The sputtered PLT thin film exhibits highly c-axis oriented crystal structure that no poling treatment for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency. Polymide is coated on top of the sensing elements to support the fragile structure and the backside of the MgO substrate is selectively etched to reduce the heat loss. The sensing element exhibited a very high detectivity D* of $8.5{\times}10^{8}cm{\cdot}\sqrt{Hz}/W$ at room temperature and it is about 100 times higher than the case of micromachining technology is not used. A sensing system that detects the position as well as the existence of a human body is realized using the array sensor.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1547-1552
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• 2003

In this paper, we present a planar single-crystalline silicon x-axis micro-gyroscope fabricated with a perfectly aligned vertical actuation combs on one silicon wafer, using the extended SBM technology. The fabricated x-axis micro-gyroscope has the resolution of 0.1 deg/sec, the bandwidth of 100 Hz. These research results allow integrating 6 axes inertial measurement (3 accelerations and 3 angular rates) on the same silicon substrate using the same process for the first time.

• Journal of Advanced Marine Engineering and Technology
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• v.25 no.3
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• pp.631-635
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• 2001

The major problems associated with the manufacturing processes of the microaccelerometer based on the tunneling current concept is the residual stress. This paper deals with finite element analysis of residual stress causing pop up phenomenon which are induced in micromachining processes for a microaccelerometers sensor using silicon on insulator(SOI) wafer. After heating the tunnel gap up to $100^{\circ}C$and get it through cooling process and the additional beam up to $80^{\circ}C$get it through the cooling process. We learn the residual stress of each shape and compare the results with each other, after heating the tunnel gap up to $400^{\circ}Cduring$ the Pt deposition process. The equivalent stresses produced during the heating process of focused ion beam(FIB) cut was also to be about $0.02~0.25Pa/^{\circ}C$and cooling process the gradient of residual stresses of about $8.4\{times}10^2Pa/{\mu}m$ still at cantilever beam and connected part of paddle. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensors.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.12
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• pp.153-159
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• 1997

A thermally-driven polysilicon microactuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS(tetraethylorthosilicate) oxide as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And newly developed HF GPE(gas-phase etching) process was also employed to eliminate the troublesome stiction problem using anhydrous HF gas and CH$_{3}$OH vapor, and successfully fabricated the microactuators. The actuation is incurred by the thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon microactuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10V and 50Hz square wave. The actuating characteris- tics are also compared with the simulalted results considering heat transfer and thermal expansion in the polysilicon layer. This microactuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.222-229
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• 2009

A noble infrared sensor was studied for passenger conditional detection in vehicle, This research relates to uncooled infrared sensors for detecting the presence, type and temperature of occupants in vehicle. It sense that the occupants purpose to control the smart airbag for safety in the case of adult or child and to control the automatic air conditioning for convenience. This paper described the design and the fabrication of microbolometers which were composed of 2 by 8 elements using the surface micromachining technology. The characteristics of the array were investigated in the spectral region of $8{\sim}12{\mu}m$. The fabricated detectors exhibited the thermal mass of $7.05{\times}10^{-9}\;J/K$, the thermal conductance of $1.03{\times}10^{-6}\;W/K$, the thermal time constant of 6.8 ms, the responsivity of $2.96{\times}10^4\;V/W$ and the detectivity of $1.01{\times}10^9\;cmHz^{1/2}/W$, at the chopper frequency of 10 Hz and the bias current of $4.4{\mu}A$. We could successfully detect the human body condition in the divided zone. As a results, we concluded that microbolometer optimized in this research could be useful for the application of passenger conditional detection in vehicle.

• Journal of Sensor Science and Technology
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• v.6 no.6
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• pp.430-436
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• 1997

A piezoresistive acceleration sensor for 30 G has been fabricated by silicon micromachining method using SDB(silicon direct bonding) wafer. The structure of the piezoresistive acceleration sensor consists of a seismic square pillar type mass and four beams. This structure was fabricated by reactive ion etching and chemical etching using KOH-etchant. The rectangular square structure is used in order to compensate the deformation of the edges due to underetching. The fabricated sensor showed a linear output voltage-acceleration characteristics and its sensitivity was about $88{\mu}V/V{\cdot}g$ from 0 to 10 G.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.11
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• pp.1005-1009
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• 2008

A noble infrared $\lambda/4$ absorbing structure using metal reflector was studied for uncooled infrared sensors. This paper described the design and the fabrication of IR uncooled detectors which were composed of 21 by 21 elements using the surface micromachining technology. The characteristics of the array were investigated in the spectral region of 4.26 ${\mu}m$. The fabricated detectors exhibited the thermal mass of $9.75\times10^{-9}$ J/K, the thermal conductance of $1.31\times10^{-6}$ W/K, the thermal time constant of 7.4 ms, the responsivity of $1.07\times10^5$ V/W and the detectivity of $1.04\times10^9$ $cmHz^{1/2}/W$, at the chopper frequency of 10 Hz and the bias current of 9.22${\mu}A$. Finally the absorptance efficiency of $\lambda/4$ absorbing structure was about 23.2 % higher than that of absence absorbing structure.

• Journal of the Korean Society for Heat Treatment
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• v.32 no.4
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• pp.155-160
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• 2019

Diamond Like Carbon (DLC) is a metastable form of amorphous carbon that have superior material properties such as high mechanical hardness, chemical inertness, abrasion resistance, and biocompatibility. Furthermore, its material properties can be tuned by additional doping such as nitrogen or boron. However, either pure DLC or doped DLC show poor adhesion property that makes it difficult to apply contact processing technique. Therefore we propose ultrafast laser micromachining which is non-contact precision process without mechanical degradation. In this study, we developed precision machining process of DLC thin film using an ultrafast laser by investigating the process window in terms of laser fluence and laser wavelength. We have also demonstrated various patterns on the film without generating any microcracks and debris.

• Journal of Biomedical Engineering Research
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• v.44 no.6
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• pp.404-413
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• 2023

In this research, we studied the development of a SUS304 microneedle array based on microfabrication technology and the applicability of Parylene-C thin film, a medical polymer material. First of all, four materials commonly used in the field of medical engineering (SUS304, Ti, PMMA, and PEEK) were selected and a 5 ㎛ Parylene-C thin film was deposited. The applicability of Parylene-C coating to each material was confirmed through SEM analysis, contact angle measurement, surface roughness(Ra) measurement, and adhesion test according to ASTM standards for each specimen. Parylene-C thin film was deposited based on chemical vapor deposition (CVD), and a 5 ㎛ Parylene-C deposition process was established through trial and error. Through characteristic experiments to confirm the applicability of Parylene-C, SUS304 material, which is the easiest to apply Parylene-C coating without pretreatment was selected to develop a microneedle array based on CNC micromachining technology. The CNC micromachining process was divided into a total of 5 steps, and a microneedle array consisting of 19 needles with an inner diameter of 200 ㎛, an outer diameter of 400 ㎛, and a height of 1.4 mm was designed and manufactured. Finally, a 5 ㎛ Parylene-C coated microneedle array was developed, which presented future research directions in the field of microneedle-based drug delivery systems.