• 센서학회지
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• 제16권1호
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• pp.62-67
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• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1533_1534
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• 2009

This paper presents an atmospheric micro glow plasma-jet device. The device consists of four components; a thin Ni anode, a porous alumina insulater, a stainless steel cathode and an aluminum case. The Ni anode is fabricated using micromachining technology. The anode has 10 holes, of which the hole diameter and the depth are $250{\mu}m$ and $60{\mu}m$, respectively. The discharge test is performed in nitrogen gas at atmospheric pressure for 20 kHz AC bias. The breakdown voltage is 3.5 kV at gas flow rate of 4 L/min and the the plasma-jet is blown out to ambient at 5.5 kV. In order to verify the characteristics of plasma, the current and the voltage of device are measured. The maximum temperature of plasma is $37^{\circ}C$. The plasma is well generated and stable at high voltage.

• Transactions on Electrical and Electronic Materials
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• 제13권5호
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• pp.215-220
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• 2012

Miniature ultrasonic and tactile sensors on Si substrate have been proposed, fabricated and characterized to detect objects for a dexterous robot. The ultrasonic sensor consists of piezoelectric PZT thin film on a Pt/Ti/$SiO_2$ and/or Si diaphragm fabricated using a micromachining technique; the ultrasonic sensor detects the piezoelectric voltage as an ultrasonic wave. The sensitivity has been enhanced by improving the device structure, and the resonant frequency in the array sensor has been equalized. Position detection has been carried out by using a sensor array with high sensitivity and uniform resonant frequency. The tactile sensor consists of four or three warped cantilevers which have NiCr or $Si:B^+$ piezoresistive layer for stress detection. Normal and shear stresses can be estimated by calculation using resistance changes of the piezoresitive layers on the cantilevers. Gripping state has been identified by using the tactile sensor which is installed on finger of a robot hand, and friction of objects has been measured by slipping the sensor.

• 센서학회지
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• 제17권1호
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• pp.75-80
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• 2008

In this work, we optimized a microbolometer for application of a $CO_2$ detector by using MEMS technology. We fabricated a stable thermal isolation structure by varying the lengths of supporting legs which affect bolometer performance. We could fabricate more stable thermal isolation structure for the microbolometer through the results of ANSYS simulations, and minimize the fabrication processes by using bulk micromachining to use a $CO_2$ detector. The microbolometer shows a detectivity of $2.5{\times}109$ cmHz$^{1/2}$/W at a chopper frequency of 8 Hz and a bias current of $6.25\;{\mu}A$ with a vacuum package of about $3.0{\times}10.3$ torr. Therefore, we put to conclusion that the microbolometer optimized in this experiment could be useful for the application of a $CO_2$ detector.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.30-32
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• 2005

This paper reports on an LTCC-based packaging method using Au/Sn eutectic bonding process for RF MEMS applications. The proposed packaging structure was realized by a micromachining technology. An LTCC substrate consists of metal filled vertical via feedthroughs for electrical interconnection and Au/Sn sealing rim for eutectic bonding. The LTCC capping substrate and the glass bottom substrate were aligned and bonded together by a flip-chip bonding technology. From now on, shear strength and He leak rate will be measured then the fabricated package will be compared with the LTCC package using BCB adhesive bonding method which has been researched in our previous work.

• 한국레이저가공학회지
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• 제18권1호
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• pp.18-22
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• 2015

In this paper, controlling shape of optical fiber tip for endoscope was investigated for eliminating blind spot. The blind spot of endoscope is generated by divergence angle of optical fiber, so it is easy to generate blind spot when tightly focusing. In order to eliminate this region, fiber tip is necessary to be controlled as convex or concave. Illumination simulation of convex and concave type of fiber tip in the endoscope was in progress, so the distance of non- blind region was investigated in each case. As well as the simulation, the tip was fabricated as concave shape by UV laser machining. Then the beam radiation was measured to observe the blind region. The result showed that controlling the fiber tip as convex or concave shape makes the narrow blind region of illumination in endoscope.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1445-1447
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• 1995

A cell fusion device is designed and fabricated in order to electrofuse two cells between electrodes. Dielectrophoretic force is used to attract each cell and make a pearl chain of two cells. Two kinds of electrode structure are fabricated and tested the feasibility of the proposed device. The attraction of two radish cells or two Chinese cabbage cells on the electrodes is observed when AC voltage(1MHz, $V_{p-p}$=8V) is applied to the electrodes. The possibility of cell fusion device is shown through experiments.

• 센서학회지
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• 제14권1호
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• pp.16-21
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• 2005

This paper presents the development of the optical switch using magnetic behavior of magnetic fluids, which is expected to be used broadly in high-speed information communication. The magnetic fluids for switching an incident light, have the magnetic characteristics of magnetic materials and fluidity of liquids, simultaneously. The relations are derived between the intensity of magnetic field and the angle of optical fiber which is bent by a behavior of magnetic fluid when the magnetic field is applied. When optical switch is implemented by the movement of liquid using magnetic fluid, the existing problem of durability for optical switch will be improved. Thus, this study shows the feasibility of the application for the optical switches using magnetic fluids.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.466-471
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• 2004

In focused-ion-beam (FIB) application of micromachining and device transplantation, four kinds of FIB processes, namely FIB sputtering, FIB-induced etching, redeposition, and FIB-induced deposition, are well utilized. As with FIB systems, scanning electron microscopes(SEMs) were extensively used in the semiconductor industry. They are the tools of choice for defect review and providing the image resolution needed for process monitoring. The enhanced capabilities of a dual-column on one chamber system are quickly becoming realized by the nano industry for performing a wide range of application.

• 센서학회지
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• 제19권1호
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• pp.31-35
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• 2010

High temperature micro pressure sensors were fabricated by using polycrystalline 3C-SiC piezoresistors grown on oxidized SOI substrates by APCVD. These have been made by bulk micromachining under $1{\times}1mm^2$ diaphragm and Si membrane thickness of $20{\mu}m$. The pressure sensitivity of implemented pressure sensors was 0.1 mV/$V{\cdot}bar$. The nonlinearity and the hysteresis of sensors were ${\pm}0.44%{\cdot}FS$ and $0.61%{\cdot}FS$. In the temperature range of $25^{\circ}C{\sim}400^{\circ}C$ with 5 bar FS, TCS (temperature coefficient of sensitivity), TCR (temperature coefficient of resistance), and TCGF (temperature coefficient of gauge factor) of the sensor were -1867 ppm/$^{\circ}C$, -792 ppm/$^{\circ}C$, and -1042 ppm/$^{\circ}C$, respectively.