• Title/Summary/Keyword: metal structure communication

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Enhancement of Magneto-Optical Kerr Effect in Annealed Granular Films of Co-Au and $Co-AlO_x$

  • Abe, Masanori;Takeda, Eishi;Kitamoto, Yoshitaka;Shirasaki, Fumio;Todoroki, Norikazu;Gorodetzky, Gad;Ohnuma, Shigehiro;Masumoto, Tasuku;Inoue, Mitsuteru
    • The Korean Journal of Ceramics
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    • v.6 no.2
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    • pp.100-102
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    • 2000
  • Co fine particles were dispersed in Au metal and $AlO_x$ amorphous matrices by vacuum evaporation and rf-sputtering, respectively, thus forming granular composite films having chemical compositions of $Co_{0.59}-Au_{0.41}$ and $Co_{0.52}/(AlO_x$)_{0.48}$. The films were annealed at 200~$500^{\circ}C$ to increase the size of the Co particles, from 30$\AA$ to 180$\AA$ in the Au matrix and 40$\AA$ to 180$\AA$ in the $AlO_x$ matrix, as revealed by X-ray diffraction analysis. The Co metal in as-deposited films have saturation magnetization equivalent to that of bulk Co, which is unchanged by the annealing, showing that the Co metal is not oxidized by the annealing. Magneto-optical Kerr rotation measured at $\lambda$=400-900nm for the $Co_{0.59}-Au_{0.41}$ film as deposited is larger than that calculated for the composition. The rotation increases as the film is annealed at $200^{\circ}C$ and $300^{\circ}C$, approaching to that of bulk Co. The Kerr rotation for the $Co_{0.52}-(AlO_x)_{0.48}$ film as deposited is smaller than that calculated for the composition based on Bruggeman effective medium theory. However, the rotation increases much, exceeding the rotation of the bulk Co as annealed at $300^{\circ}C$ and $400^{\circ}C$. As a possible origin of the marked magneto-optical enhancement a weak localization of light in granular structure is suggested.

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The Fabrication of MOS Capacitor composed of $HfO_2$/Hf Gate Dielectric prepared by Atomic Layer Deposition (ALD 방법으로 증착된 $HfO_2$/Hf 박막을 게이트 절연막으로 사용한 MOS 커패시터 제조)

  • Lee, Dae-Gab;Do, Seung-Woo;Lee, Jae-Sung;Lee, Yong-Hyun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.5
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    • pp.8-14
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    • 2007
  • In this paper, $HfO_2$/Hf stacked film has been applied as the gate dielectric in MOS devices. The $HfO_2$ thin film was deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$ as precursors. Prior to the deposition of the $HfO_2$ film, a thin Hf metal layer was deposited as an intermediate layer. Round-type MOS capacitors have been fabricated on Si substrates with 2000${\AA}$-thick Al or Pt top electrode. The prepared film showed the stoichiometric components. At the $HfO_2$/Si interface, both Hf-Si and Hf-Si-O bonds were observed, instead of Si-O bond. The sandwiched Hf metal layer suppressed the growing of $SiO_x$ layer so that $HfSi_xO_y$ layer was achieved. It seems that the intermediate Hf metal layer has a benefit for the enhancement of electric characteristics of gate dielectric in $HfO_2$/Si structure.

Evanescent-mode Waveguide Band-pass Filter Applied by Novel Metal Post Capacitor (새로운 금속막대 커패시터를 적용한 감쇄모드 도파관 대역통과 여파기)

  • Kim, Byung-Mun;Yun, Li-Ho;Lee, Sang-Min;Hong, Jae-Pyo
    • The Journal of the Korea institute of electronic communication sciences
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    • v.17 no.5
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    • pp.775-782
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    • 2022
  • In this paper, a novel small-diameter cylindrical post capacitor inserted into an evanescent-mode rectangular waveguide (EMRWG) is proposed for easier tuning. In order to feed the EMRWG, the proposed structure uses a single ridge rectangular waveguide with the same width and height as the waveguide at the input and output ends. The inserted post capacitor are made up a circular groove formed in the center of the lower part of the broad wall of the EMRWG, and a concentric cylindrical post inserted into the upper part. First, the equivalent circuit model for the proposed structure is presented. When the EMRWG and the single ridge waveguide are combined, the joint susceptance and the turns ratio of the ideal transformer are calculated by two simulations using HFSS (3d fullwave simulator, Ansoft Co.) respectively. The susceptance and resonance characteristics of the inserted post were analyzed by using the obtained parameters and the characteristics of the EMRWG. A 2-post filter with a center frequency of 4.5 GHz and a bandwidth of 170 MHz was designed using a WR-90 waveguide, and the simulation results by using the HFSS and CST, equivalent circuit model were in good agreement.

Electrochemical Properties of Spinel LiMn2O4 Prepared Through Different Synthesis Routes (스피넬형 양극활물질 LiMn2O4의 합성방법에 따른 전기화학적 특성 비교)

  • Lee, Ki-Soo;Bang, Hyun-Joo;Sun, Yang-Kook
    • Journal of the Korean Electrochemical Society
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    • v.10 no.1
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    • pp.48-51
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    • 2007
  • In order to investigate the effects of particle size and specific surface area(BET area) of spinel powder, $LiMn_2O_4$ were synthesized using metal oxide precursor by co-precipitation method(CoP) and solid state reaction (SSR) .X-ray diffraction(XRD) patterns revealed that the both prepared powder has a well developed spinel structure with Fd3m space group. The $LiMn_2O_4$ prepared by co-precipitation showed spherical morphology with narrow size distribution. However, the $LiMn_2O_4$ prepared by solid state reaction showed relatively smaller particles with irregular shape. The measured BET areas of the powers are $0.8m^2g^{-1}$ (CoP) and $3.6m^2g^{-1}$(SSR). The electrochemical performance of the Prepared $LiMn_2O_4$ powders was evaluated using coin type cells(CR2032) at elevated temperature ($55^{\circ}C$). The $LiMn_2O_4$ prepared by co-precipitation showed the better cycling performance(82.3%capacity retention at $50^{th}$ cycle) than that of the $LiMn_2O_4$(68.3%) prepared by solid state reaction at elevated temperature.

A Design of Heat-Sink and DMX512 Communication Control for High-Power LEDs (고출력 LED 방열 및 DMX512 통신 제어 설계)

  • Kim, Ki-Yun;Ham, Kwang-Keun
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.38C no.8
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    • pp.725-732
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    • 2013
  • Recently, various applications for LED lightings are growing continuously due to their better performances such as low power consumption, longer life time, operation speed, controllability, high quality color rendering, and sustainability. However, in developing the high-powered LEDs illumination system, heat-sink problem is one of the important obstacle. In this paper, a heat-sink design with multi-layered structure for high-powered LEDs is proposed, which is composed of metal core PCB, heat-pipes, heat-sink plates, and fans. And also, in this paper, a design for LED controls using DMX512 protocols through RS-485 communications is proposed, which is considered as de facto international standard in LEDs illumination control and is widely used in landscape lighting and stage lighting. In this paper, LED control and its application techniques are introduced and the method of wireless remote control for main controller is proposed.

Design of Dual loop PLL with low noise characteristic (낮은 잡음 특성을 가지기 위해 이중 루프의 구조를 가지는 위상고정루프 구현)

  • Choi, Young-Shig;Ahn, Sung-Jin
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.20 no.4
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    • pp.819-825
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    • 2016
  • In this paper, a phase locked loop structure with parallel dual loop which have a different bandwidth has been proposed. The bandwidths depending on transfer functions are obtained through dual loops. Two different bandwidths of each loop are used to suppress noise on the operating frequency range. The proposed phase locked loop has two different voltage controlled oscillator gains to control two different wide and narrow loop filters. Furthermore, it has the locking status indicator to achieve an accurate locking condition. The phase margin of $58.2^{\circ}$ for wide loop and $49.4^{\circ}$ for narrow loop is designed for stable operation and the phase margin of $45^{\circ}$ is maintained during both loops work together. It has been designed with a 1.8V 0.18um complementary metal oxide semiconductor (CMOS) process. The simulation results show that the proposed phase locked loop works stably and generates a target frequency.

A New Manufacturing Technology and Characteristics of Trench Gate MOSFET (새로운 트렌치 게이트 MOSFET 제조 공정기술 및 특성)

  • Baek, Jong-Mu;Cho, Moon-Taek;Na, Seung-Kwon
    • Journal of Advanced Navigation Technology
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    • v.18 no.4
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    • pp.364-370
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    • 2014
  • In this paper, high reliable trench formation technique and a novel fabrication techniques for trench gate MOSFET is proposed which is a key to expend application of power MOSFET in the future. Trench structure has been employed device to improve Ron characteristics by shrinkage cell pitch size in DMOSFET and to isolate power device part from another CMOS device part in some power integrated circuit. A new process method for fabricating very high density trench MOSFETs using mask layers with oxide spacers and self-align technique is realized. This technique reduces the process steps, trench width and source and p=body region with a resulting increase in cell density and current driving capability and decrease in on resistance.

The Design of a Wind Speed & Direction Module and a DSP Sensor Interface System for the Meteorological System (기상계측시스템을 위한 풍향.풍속모듈 및 DSP 센서 인터페이스시스템 설계)

  • Song, Do-Ho;Joo, Jae-Hun;Ock, Gi-Tae;Kim, Sang-Gab;Choi, Jung-Keyng
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.8
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    • pp.1478-1485
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    • 2007
  • In this paper, a meteorological system including a wind speed & direction module and the DSP(Digital Signal Processor) sensor interface circuit board are proposed. This DSP system accepts and process the informations from a wind speed & direction module, the atmospheric pressure sensor, the ambient air temperature sensor and transfers it to the PC monitoring system. Especially, a wind speed & direction module and a DSP hardware are directly designed and applied. A wind speed & direction module have a construction that it have four film type RID(Resistive Temperature Detectors) resistive sensor adhered around the circular metal body heated constantly by heating coil for obtaining vector informations about wind. By this structure, the module is enabled precise measurement having a robustness about vibration, humidity, corrosion. A sensor signal processing circuit is using TMS320F2812 TI(Texas Instrument) Corporation high speed DSP. An economical meteorological system could be constructed through the data from wind speed & direction module and by the fast processing of DSP interface circuit board.

Application in Conductive Filler by Low-Temperature Densification and Synthesis of Core-Shell Structure Powder for Prevention from Copper Oxidation (구리 산화 방지를 위한 Core-Shell 구조 입자 합성과 저온 치밀화를 통한 도전성 필러 응용)

  • Shim, Young Ho;Park, Seong-Dae;Kim, Hee Taik
    • Applied Chemistry for Engineering
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    • v.23 no.6
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    • pp.554-560
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    • 2012
  • Recently, it has been increasing trend to use conductive materials as electronics and communication technology in electronics industry are developing. The noble metal such as Ag, Pt, Pd etc. are mostly used as conductive materials, To reduce production cost, alternative materials with similar characteristics of noble metals are needed. Copper has advantages, i.e its electronic properties are similar to noble metals and low cost than noble metal, but its use has been restricted because of oxidation in air. In this study, the tin film was coated on copper by electroless plating to protect copper from oxidation and to confirm the effects of temperature, pH, amount of $SnCl_2$, and feeding speed in plating conditions. Additionally, we apply $Cu_{core}Sn_{shell}$ powder as conductive filler with low-temperature densification and analysis by SEM, XRD, FIB and 4-Point Probe techniques. As result of the study, tin film was coated well on copper and was protected from oxidation. After low-temperature densification treatment, the meted tin made chemical interconnections with copper. Accordingly, conductivity was increased than before condition. We hope $Cu_{core}Sn_{shell}$ powder to replace noble metals and use in the electronic field.

Atomic Layer Deposition Method for Polymeric Optical Waveguide Fabrication (원자층 증착 방법을 이용한 폴리머 광도파로 제작)

  • Eun-Su Lee;Kwon-Wook Chun;Jinung Jin;Ye-Jun Jung;Min-Cheol Oh
    • Korean Journal of Optics and Photonics
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    • v.35 no.4
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    • pp.175-183
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    • 2024
  • Research into optical signal processing using photonic integrated circuits (PICs) has been actively pursued in various fields, including optical communication, optical sensors, and quantum optics. Among the materials used in PIC fabrication, polymers have attracted significant interest due to their unique characteristics. To fabricate polymer-based PICs, establishing an accurate manufacturing process for the cross-sectional structure of an optical waveguide is crucial. For stable device performance and high yield in mass production, a process with high reproducibility and a wide tolerance for variation is necessary. This study proposes an efficient method for fabricating polymer optical-waveguide devices by introducing the atomic layer deposition (ALD) process. Compared to conventional photoresist or metal-film deposition methods, the ALD process enables more precise fabrication of the optical waveguide's core structure. Polyimide optical waveguides with a core size of 1.8 × 1.6 ㎛2 are fabricated using the ALD process, and their propagation losses are measured. Additionally, a multimode interference (MMI) optical-waveguide power-splitter device is fabricated and characterized. Throughout the fabrication, no cracking issues are observed in the etching-mask layer, the vertical profiles of the waveguide patterns are excellent, and the propagation loss is below 1.5 dB/cm. These results confirm that the ALD process is a suitable method for the mass production of high-quality polymer photonic devices.