• Journal of Korean Society of Forest Science
• /
• v.77 no.3
• /
• pp.294-302
• /
• 1988

The experiment was carried out to investigate the properties of bark extractives form Larix epilepsies and to evacuate their suitability as a bonding agent. The yield and reactivity were measured to examine the influence of temperature and time and the effect of carbonation and sulfonation. To define the possibility of practical application as wood adhesives the viscosity and gelation time were measured at 33% concentration. The results obtained were summarized as follows : 1. As the both yield and reactivity were high, extraction for 2 hours at $80^{\circ}C$ was the optimal temperature and time. 2. The highest effect achieved at 1% $Na_2CO_3$ about carbonation and 1% $Na_2SO_3$ : $NaHSO_3$ and 0.25% $Na_2SO_3$ about sulfonation. The sulfonation of 0.25% $Na_2SO_3$ increased the yield and reactivity most highly. 3. By using hot water as extraction liquid the yield was 17.2%, while the addition of 1% and 5% NaOH to the extraction liquid increased the yield to 38.6% and 44.6%, respectively. 4. Hot water extracts showed the highest reactivity(68.8%). The addition of 1% and 5% NaOH led to decrease in reactivity(49.3% and 25.8%, respectively). 5. At 33% concentration of the extracts the viscosity appeared very variable. Significantly high values of viscosity was measured in 1% NaOH solution, while very low values appeared for 5% NaOH solution. 6. The shortest gelation time was determined at pH 7 to 10 and the highest at pH 4. The use of paraformaldehyde resulted in gelation times longer than those of 37% formaldehyde solution. 7. Except the sulfonation extracts of hot water and 1% NaOH, the other extracts were found unsuitable due to high viscosity(1% NaOH extracts, sulfonation extracts) or to curing inability(5% NaOH extracts, sulfonation extracts of 5% NaOH). 8. From the three extract solutions which appeared to be suitable for use as bonding agents the hot water extracts and the sulfonation extracts of hot water were superior in extract reactivity, while the sulfonation extracts of 1% NaOH exceeded the other two extracts in extract yield.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• v.y2005m4
• /
• pp.305-308
• /
• 2005

This paper presents a fabrication of a full-stale combustion chamber of a liquid rocket engine for a ground hot firing test. Engine drawings for manufacturing were prepared after conceptual and detail designs. The combustor is composed of a head and a chamber. SUS316L is used for materials of the head because of the good quality in low temperature. Inner materials of the ablative cooling chamber is silica/phenolic and outer case materials is the SUS316L. Materials of the regenerative cooling chamber are C18200 and SUS316L. After lathe, general milling and MCT machinings, components were finished by electrolytic polishing. A brazing method was applied for bonding the injectors and the injector plate, the regenerative cooling chamber because of structure configurations.

• Polymer(Korea)
• /
• v.25 no.6
• /
• pp.774-781
• /
• 2001

In order to reuse the waste matters, the polyester hybrid composites were fabricated with the waste stone (WSP) and waste tire (WTC). Before mixing, the waste fillers were treated with the silane coupling agent [${\gamma}$-methacryloxy propyl trimethoxy silane(${\gamma}$-MPS)] for enhancing the dispersion of the fillers and interfacial bonding with polymer matrix. Mechanical properties and morphologies of the resulted hybrid composites were investigated with the filler content. The hybrid composites containing surface treated fillers have high initial thermal decomposition temperature and low weight loss compared to the untreated one. The highest mechanical properties of composites were obtained with the ${\gamma}$-MPS (2 wt%) treated fillers. The porosity of composite increased with the content of organic filler which can be reduced by the silane surface treatment of fillers. The pore size distribution of the composites varied with the waste filler content.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.182-182
• /
• 1999

The chemisorption effect of CO on the Ni/Cu(001) surface was investigated using LEED(Low Energy Electron Diffraction) and EELS(Electron Energy Loss Spectrscopy0 under the UHV conditions. after mounting the Cu(001) single crystal in the UHV chamber (base pressure 1$\times$10-10Torr), a clean surface was obtained after a few cycles of repeated Ar+ ion sputtering and annealing at about 40$0^{\circ}C$. The epitaxial thin Ni films were formed on the Cu(001) by evaporation from 99.999% Ni block. The pseudomorphic growth and the orderness of the thin Ni films were monitored by c(2$^{\circ}C$2) LEED pattern. CO adlayers on Ni epitaxial thin films were prepared by dosing pure CO has through a leak valve. After CO adsorpton at room temperature, two pairs of peaks were observed by EELS, whose relative intensities are changed as the film thickness is varied and time is elapsed. These two pair of peaks are likely related to different bonding sites (-top and bridge sites) of C-Ni as well as C-O vibration. Experimental results and qualitative interpretation of the spectra wille be discussed. The possibility of using EELS in combination with probe species (CO) to investigate the nature of thin film growth is mentioned. We will report the experimental result of O2 dosage on Ni film and interaction of CO and O2.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.2
• /
• pp.112-117
• /
• 2008

Vertical interconnection scheme using novel silicon-through-via for 3D MEMS devices or stacked package is proposed and fabricated to demonstrate its feasibility. The suggested silicon-through-via replaces electroplated copper, which is used as an interconnecting material in conventional through-via, with doped silicon. Adoption of doped silicon instead of metal eliminates thermal-mismatch-induced stress, which can make troubles in high temperature MEMS processes, such as wafer bonding and LP-CVD(low pressure chemical vapor deposition). Two silicon layers of $30{\mu}m$ thickness are stacked on the substrate. The through-via arrays with spacing $40{\mu}m$ and $50{\mu}m$ are fabricated successfully. Electrical characteristics of the through-via are measured and analyzed. The measured resistance of the silicon-through-via is $169.9\Omega$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.4
• /
• pp.237-240
• /
• 2016

The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

• Journal of the Korean Society of Safety
• /
• v.26 no.2
• /
• pp.13-19
• /
• 2011

The magnetic polishing is the useful method to finish using magnetic power of magnet. That method is one of precision polishing techniques and has an aim of the clean technology using for the pure of gas and inside of the clean pipe. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper deals with development of the magnetic abrasive using Sr-Ferrite. In this development, abrasive grain GC used to resin bond fabricated low temperature. And Sr-Ferrite of magnetic abrasive powder fabricated that Sr-Ferrite was crused into 200 mesh. The XRD analysis result show that only GC abrasive and Sr-Ferrite crystal peaks detected which explains resin bond was not any more chemical reaction. From SEM analysis it is found that GC abrasive and Sr-Ferrite were strong bonding with each other by bond. The magnetic polishing is performed by polishing the surface of pipe by attracting magnetic abrasives with magnetic fields. This can be widely applied for finishing machinery fabrications such as various pipes and for other safety processes. In this paper, we could have investigated in to the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• Resources Recycling
• /
• v.23 no.5
• /
• pp.12-20
• /
• 2014

Calcium ferrite is a major bonding material self-fluxed sintered ore, and it is used as a flux in the steelmaking process. Calcium ferrite is more effective binder for making sintered ore and flux for steel making because of it's low melting temperature. In this Study, calcium ferrite was made by using variety industrial by-products from steel plant. The property of calcium ferrites was investigated on the basis of test method using in the cement manufacturing process. Crystal analysis, compression test as well as thermal analysis were carried out to evaluate physical properties of calcium ferrite.

• Journal of Sensor Science and Technology
• /
• v.11 no.1
• /
• pp.54-59
• /
• 2002

This paper describes a new process technique for batch process of SOI(Si-on-Insulator) structures with buried cavities for MEMS(Micro Electro Mechanical System) applications by SDB(Si-wafer Direct Bonding) technology and electrochemical etch-stop. A low-cost electrochemical etch-stop method is used to control accurately the thickness of SOI. The cavities were made on the upper handling wafer by Si anisotropic etching. Two wafers are bonded with an intermediate insulating oxide layer. After high-temperature annealing($1000^{\circ}C$, 60 min), the SDB SOI structure with buried cavities was thinned by electrochemical etch-stop. The surface of the fabricated SDB SOI structure have more roughness that of lapping and polishing by mechanical method. This SDB SOI structure with buried cavities will provide a powerful and versatile substrate for novel microsensors arid microactuators.

• Journal of the Korean institute of surface engineering
• /
• v.36 no.5
• /
• pp.373-378
• /
• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.