• 제목/요약/키워드: lead-frame

검색결과 333건 처리시간 0.028초

Preparation of Adhesion Promoter for Lead Frame Adhesion and Application to Epoxy Composite

  • Kim, Jung Soo;Kim, Eun-jin;Kim, Dong Hyun
    • Elastomers and Composites
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    • 제57권2호
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    • pp.48-54
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    • 2022
  • A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

LED 및 반도체 소자 리드프레임 패키징용 Cu/STS/Cu 클래드메탈의 기계적/열전도/전기적 특성연구 (Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame)

  • 이창훈;김기출;김용성
    • Journal of Welding and Joining
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    • 제30권3호
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    • pp.32-37
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    • 2012
  • Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

타발금형펀치의 국부 좌굴해석 및 설계변경 (Local Buckling Analysis of the Punch in stamping Die and Its Design Modification)

  • 김용연;이동훈
    • 한국정밀공학회지
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    • 제16권3호통권96호
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    • pp.25-29
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    • 1999
  • The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

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좌굴해석을 이용한 리드프레임 타발용 펀치의 보강설계 (Design of the Stiffened Punch for Stamping of Lead Frame by Buckling Analysis)

  • 고대철;이인수;안병환;김병민
    • 한국정밀공학회지
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    • 제23권9호
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    • pp.68-75
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    • 2006
  • The lead frame manufactured by stamping process plays an important role in connecting semiconductor to PCB board. As a result of the miniaturization of semiconductor, its corresponding lead frame punch has been narrow. In case of the punch with high slenderness ratio such as lead frame punch, the punch can be broken suddenly due to buckling. To prevent the fracture of lead frame punch, some manufacturers have experientially attached stiffeners to weak parts of punch. The purpose of this study, therefore, is to suggest the guideline far design of stiffened punch. The optimal position and the number of stiffeners to be attached to punch are investigated by elastic buckling analysis. The elastic buckling analysis consists of the eigenvalue buckling analysis and nonlinear buckling analysis. The critical buckling load of elastic buckling analysis is compared with that of buckling test. Finally, the guideline far attaching stiffeners is suggested through analysis of cross section of lead frame punch such as moment of inertia and eccentricity.

반도체 리드프레임 펀치의 좌굴에 관한 보강설계 (The Reinforced Design for the Buckling of Semiconductor Lead Frame Punch)

  • 이인수;고대철;김병민
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.1008-1011
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    • 2005
  • It is necessary for the design of lead frame punches in blanking to consider buckling because inner lead pitch of lead frame has been narrowed by miniaturization and high accumulation of semiconductor. In addition, if process variables change in press stamping process, the lift of punches is no longer influenced in wear and punches can be broken suddenly. To prevent the fracture of fine pitch lead frame punches, having considered applying reinforcement to it, this paper verified the design with buckling analysis. This study presents the optimal position and number of reinforcement to be attached to punches. Finally this study presents design rules of attaching reinforcement.

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Lead-Frame 에칭공정에서 분무특성을 이용한 에칭특성의 예측 (The Prediction of Etching Characteristics Using Spray Characteristics in Etching Process of Lead-Frame)

  • 정흥철;최경민;김덕줄
    • 대한기계학회논문집B
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    • 제30권4호
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    • pp.381-388
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    • 2006
  • The objective of this study is to predict the etching characteristics using spray characteristics for the optimization on the etching process of Lead-Frame. The etching characteristics such as etching factor, uniformity were investigated on the actual operating conditions. The correlation between the etching characteristics and the spray ones obtained by measurement were analyzed to simulate the etching characteristics according to actual conditions of lead-frame etching process. These conditions of lead-frame process were spray pressure, distance from nozzle tip to substrate, pipe pitch, and nozzle pitch. To improve the etching characteristics in the lead-frame process, effects of the various operating conditions should be understood in detail. The spray characteristics obtained by experiment using PDA system were simulated by the Monte-Carlo method. The etching process model was coded by Java language. It was found that simulation results generally agreed well with the measured results of etching characteristics in lead-frame etching process. The optimal operating parameters were successfully found under variable conditions.

Development of a Very Small LED Lamp with a Low-Thermal-Resistance Lead Frame for an LCD Backlight Unit

  • Yu, Soon-Jae;Kim, Do-Hyung;Choi, Yong-Seok;Kim, Hee-Tae
    • Journal of Information Display
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    • 제10권2호
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    • pp.49-53
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    • 2009
  • In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.

리드 프레임 타발공정의 전단특성에 관한 연구(1) -전단 공정 인자의 영향 (A Study on the Characteristics of the Precision Blanking of Lead Frame (1): Influences of Blanking Process Variables)

  • 임상헌;서의권;심현보
    • 소성∙가공
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    • 제10권5호
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    • pp.425-432
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    • 2001
  • In order to investigate the influences of process parameters on the shape of lead frame, experimental study has been carried out. In the experiment, dimensional accuracy of the die sets, measurement accuracy has been managed carefully enough to simulate actual lead frame blanking process. With the blanking of square-shaped specimen, the effects of clearance, strip holding pressure and bridge width on the shape of blanked profile have been investigated. Experimental results show that the burnish ratio is increased as the clearance decreases. the strip holding pressure increases, and bridge width increases. Although the results seems to be similar to the ordinary blanking, the lead frame blanking shows a subtle different characteristics to the ordinary blanking due to the narrow bridge width.

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LED 리드프레임 패키징용 Cu/STS/Cu 클래드 메탈의 기계 및 열전도 특성의 온도 안정성 연구 (Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame)

  • 김용성;김일권
    • Journal of Welding and Joining
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    • 제31권5호
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    • pp.77-81
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    • 2013
  • We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

고강도 전자소자 리드프레임용 Cu/STS/Cu 클래드 메탈제조 및 물리적특성에 대한 열안정성 연구 (Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties)

  • 김일권;손문의;김용성
    • Journal of Welding and Joining
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    • 제32권5호
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    • pp.80-86
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    • 2014
  • We have successfully fabricated high strengthening Cu/STS/Cu 3 layered clad metal of $70kgf/mm^2$ grade for electric device lead frame, and investigated thermal effect of the mechanical and physical properties on the Cu/STS/Cu 3 layered clad metal lead frame material at different temperatures ranging from RT to $200^{\circ}C$. The fabricated clad metal shows a good thermal stability under 6% degrading of mechanical tensile strength and hardness change at $200^{\circ}C$ and also physical properties show stable thermal and electrical conductance of over $220W/m{\cdot}K$ and 58.44% IACS upto the $200^{\circ}$. The results confirm that fabricated high strengthening Cu/STS/Cu 3 layered clad metal can be applied for the high performed electrical lead frame devices.