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Development of a Very Small LED Lamp with a Low-Thermal-Resistance Lead Frame for an LCD Backlight Unit  

Yu, Soon-Jae (Department of Electronics, Sunmoon University)
Kim, Do-Hyung (Department of Electronics, Sunmoon University)
Choi, Yong-Seok (Itswell)
Kim, Hee-Tae (LCD Development Center, LCD Business, Samsung Electronics Co., Ltd.)
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Abstract
In this study, a very small LED packaging lead frame with a low thermal resistance was developed. The cost of the package process was reduced by the use of many small LED lamps, which increased the light emission efficiency. Compared to the large lead frame lamp, however, the optical property of the small LED packaging lead frame lamp was not sufficiently improved because its reflection structure was changed and its reflection area was reduced. The luminous efficiency of the LED lamp reaches 58 lm/W at the current density of 0.16 A/$cm^2$. Using the LED lamps, 46-inch LCD BLU was manufactured. The BLU-made LED lamps have a low power consumption of 146 W and have a slim (10-mm-thick) BLU, keeping good uniformity in terms of brightness, and maintaining good thermal properties.
Keywords
light-emitting diode (LED); LCD backlight unit; lead frame; LED chip;
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