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http://dx.doi.org/10.5781/JWJ.2014.32.5.80

Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties  

Kim, Il-Gwon (Advanced Materials Engineering, Seoul National University of Science and Technology)
Son, Moon-Eui (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Kim, Young-Sung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Publication Information
Journal of Welding and Joining / v.32, no.5, 2014 , pp. 80-86 More about this Journal
Abstract
We have successfully fabricated high strengthening Cu/STS/Cu 3 layered clad metal of $70kgf/mm^2$ grade for electric device lead frame, and investigated thermal effect of the mechanical and physical properties on the Cu/STS/Cu 3 layered clad metal lead frame material at different temperatures ranging from RT to $200^{\circ}C$. The fabricated clad metal shows a good thermal stability under 6% degrading of mechanical tensile strength and hardness change at $200^{\circ}C$ and also physical properties show stable thermal and electrical conductance of over $220W/m{\cdot}K$ and 58.44% IACS upto the $200^{\circ}$. The results confirm that fabricated high strengthening Cu/STS/Cu 3 layered clad metal can be applied for the high performed electrical lead frame devices.
Keywords
High strength clad metal; Power device; Lead frame; Thermal effect; Physical property;
Citations & Related Records
Times Cited By KSCI : 6  (Citation Analysis)
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