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Chang-Hun Lee, Ki-Chul Kim and Young-Sung Kim : Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame, Journal of KWJS, 30-3 (2012), 230-235 (in Korean).
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Young-Sung Kim and Il-Gwon Kim : Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame, Journal of KWJS, 31-5 (2013), 77-81 (in Korean)
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Hoon Cho, Byoung-Soo Lee, and Hyung-Ho Jo : Development of High Strength and High Conductivity Cu Alloys, Trends in Metals &Materials Engineering, 21-2 (2008), 21-26 (in Korea)
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Young-Bae Kim, Jongsup Lee, Guen-Ahn Lee and Sangmok Lee : An Overview and Prospects for Hybrid Materials, Trends in Metals &Materials Engineering, 24-4 (2011), 24-30 (in Korean)
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Byung-Koog Jang, Yoshio Sakka, Norio Yamaguchi, Hideaki Matsubara and Hyung-Tae Kim : Thermal conductivity of EB-PVD mol% films using the laser flash method, Journal of Alloys and Compounds, 509 (2001), 1045-1049
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E. Fred Schubert : Light Emitting Diodes, 2nd Ed. Cambridge University Press, 2003, 13
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D. J. Lee, D. H. Ahn, E. Y. Yoon, S. I. Hong, S. H. Lee and H. S. Kim : Estimating interface bonding strength in clad metals using digital image correlation, Scripta Materialia, 68 (2013), 893-896
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Seung Zeon Han, and Su-Hyeon Kim : Technological Trend in Thermo-mechanical Treatment of High Conductivity Copper Alloys, Trends in Metals & Materials Engineering, 21-2(2009), 27-33 (in Korea)
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Koya Nomura : R & D Kobe Steel Engineering Reports, 54-1 (2004) 115
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J.E.Lee, D.H.Bae, W.S. Chung, K.H.Kim, J.H.Lee, Y.R. Cho : Effects of annealing on the mechanical and interface properties of stainless steel/aluminum /copper clad-metal sheets, J. of Mater. Processing Technology, 187-188 (2007) 546-549
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Jong Su, Sun Ig Hong : Design of high strength Cu alloy interlayer for mechanical bonding Ti to steel and characterization of their tri-layered clad, Materials and Design, 51 (2013), 293-299
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Seung Zeon Han, Kwangjun Euh and Hyuk Chon Kwon : Technologies in Thermo-mechanical Treatment of High Strength and High Conductivity Copper alloys, Trends in Metals &Materials Engineering, 22-6 (2009), 12-18 (in Korean)
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S. J. Yoo, D. H. Kim : Super thin 0.25 mm thickness white LED lamp with PCB type lead frame, Journal of the korean institute of electrical and electronic material engineers, 23-1(2010), 34-37 (in Korean)
과학기술학회마을
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B. J. Kim, M. H. Jeong, S. H. Hwang, H. Y. Lee, S. W. Lee, K. D. Chun, Y. B. Park, Y. C. Joo : Relationship between tensile characteristics and Fatigue failure by folding or bending in Cu foil on flexible substrate, J. Microelectron. Packag. Soc., 18-1 (2011), 55
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J. S. Jeong, K. H. Shin, J. H. Kim : Estimation of mechanical properties of Sn-xAg-0.5Cu lead-free solder by tensile test, Journal of KWJS, 29-1 (2011), 41-45 (in Korean)
과학기술학회마을
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Soon-Jae Yu, Do-Hyung Kim, Yong-Seok Choi and Heetae Kim : Development of a very small LED lamp with a low-thermal-resistance lead frame for an LCD backlight unit, J. Information Display, 10-2 (2009), 49-52
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R. Kisiel, M. Jarosz : Thermal properties of SiCceramics substrate interface made by silver glass composition, Electronics Technology(ISSE), 34th International spring seminar on. 2011, 98-102
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J. H. Kang, S. O. Han : DC and AC characterization of metal conductivity using the van der pauw measurement method, The transactions of the Korean Institute of Electrical Engineers, 2007, 157-160 (in Korean)
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K. J. Hong, L. S. Hun : A study on the precision measurement of metal electrical resistivity, The transactions of the Korean Institute of Electrical Engineers, 2007, 37-39 (in Korean)
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