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Young-Bae Kim, Jongsup Lee, Guen-Ahn Lee and Sangmok Lee "An Overview and Prospects for Hybrid Materials" Trends in Metals &Materials Engineering, 24, 4 (2011), 24-30 (in Korean)
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Chang-Hun Lee, Ki-Chul Kim and Young-Sung Kim "Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame", Journal of KWJS, 30-3 (2012), 230-235 (in Korean)
과학기술학회마을
DOI
ScienceOn
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E. Fred Schubert, "Light Emitting Diodes", 2nd Ed. p.13, Cambridge University Press, 2003
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D. J. Lee, D. H. Ahn, E. Y. Yoon, S. I. Hong, S. H. Lee and H. S. Kim, "Estimating interface bonding strength in clad metals using digital image correlation", Scripta Materialia 68 (2013), 893-896
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ScienceOn
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S. H. Kee, W. J. Kim, J. P. Jung, "Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead frames", Surface & Coatings Technology 235 (2013), 778-783
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ScienceOn
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Y. H. Cho, B. J. Kwon, "Main issur and technology trend of domestic and international LED lignt", Korea institute of S&T evaluation and planning, 2010-2 (2010), 109-134 (in Korean)
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S. J. Yoo, D. H. Kim, "Super thin 0.25 mm thickness white LED lamp with PCB type lead frame", journal of the korean institute of electrical and electronic material engineers, 23-1(2010), 34-37 (in Korean)
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ScienceOn
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B. J. Kim, M. H. Jeong, S. H. Hwang, H. Y. Lee, S. W. Lee, K. D. Chun, Y. B. Park, Y. C. Joo, "Relationship between tensile characteristics and Fatigue failure by folding or bending in Cu foil on flexible substrate", J. Microelectron. Packag. Soc., 18-1 (2011), 55
과학기술학회마을
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J. S. Jeong, K. H. Shin, J. H. Kim, "Estimation of mechanical properties of Sn-xAg-0.5Cu lead-free solder by tensile test", Jounal of KWJS, 29-1 (2011), 41-45 (in Korean)
과학기술학회마을
DOI
ScienceOn
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Soon-Jae Yu, Do-Hyung Kim, Yong-Seok Choi and Heetae Kim, "Development of a very small LED lamp with a low-thermal-resistance lead frame for an LCD backlight unit", J. Information Display, 10-2 (2009), 49-52
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R. Kisiel, M. Jarosz, "Thermal properties of SiCceramics substrate interface made by silver glass composition", Electronics Technology(ISSE), 34th International spring seminar on. (2011), 98-102
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