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http://dx.doi.org/10.5781/KWJS.2013.31.5.77

Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame  

Kim, Young-Sung (Graduate School o NID Fusion Technology, Seoul National University of Science and Technology)
Kim, Il-Gwon (Advanced Materials Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of Welding and Joining / v.31, no.5, 2013 , pp. 77-81 More about this Journal
Abstract
We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.
Keywords
Clad metal; LED lead frame; Thermal stability; Thermal conductivity;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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