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http://dx.doi.org/10.5781/KWJS.2012.30.3.230

Study on the Mechanical Properties and Thermal Conductive Properties of Cu/STS/Cu Clad Metal for LED/semiconductor Package Device Lead Frame  

Lee, Chang-Hun (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Kim, Ki-Chul (Department of Material Design Engineering, Mokwon University)
Kim, Young-Sung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology)
Publication Information
Journal of Welding and Joining / v.30, no.3, 2012 , pp. 32-37 More about this Journal
Abstract
Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.
Keywords
Clad metal; Lead frame; LED; Semiconductor;
Citations & Related Records
Times Cited By KSCI : 6  (Citation Analysis)
연도 인용수 순위
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