Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Frame

LED 리드프레임 패키징용 Cu/STS/Cu 클래드 메탈의 기계 및 열전도 특성의 온도 안정성 연구

  • Kim, Young-Sung (Graduate School o NID Fusion Technology, Seoul National University of Science and Technology) ;
  • Kim, Il-Gwon (Advanced Materials Engineering, Seoul National University of Science and Technology)
  • 김용성 (서울과학기술대학교 NID대학원) ;
  • 김일권 (서울과학기술대학교 신소재공학과)
  • Received : 2013.10.29
  • Accepted : 2013.10.30
  • Published : 2013.10.31
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Abstract

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

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References

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