• Title/Summary/Keyword: ion plating

Search Result 321, Processing Time 0.028 seconds

Surface Characterization According to the Bias Voltage of the TiAgN Coating Film Layer Formed by the AIP Process (AIP법으로 형성된 TiAgN 코팅필름의 바이어스전압에 따른 표면 특성 분석)

  • Baek, Min-Sook;Yoon, Dong-Joo;Kang, Byeong-Mo;Jeong, Woon-Jo;Kim, Byung-Il
    • Korean Journal of Materials Research
    • /
    • v.25 no.5
    • /
    • pp.253-257
    • /
    • 2015
  • The implanting of metal products is performed with numerous surface treatments because of toxicity and adhesion. Recently, the surface modification of metal products has been actively studied by coating the surface of the TiC or TiN film. We prepared a Ti(10%)Ag Target which may be used in dental oral material by, using the AIP(arc ion plating) system TiAgN coating layer that was deposited on Ti g.23. The purpose of this study was to establish the optimal bias voltage conditions of the coated TiAgN layer formed by the AIP process. The TiAgN coatings were prepared with different bias voltage parameters (0V to -500V) to investigate the effect of bias voltage on their mechanical and chemical properties. The SEM(scanning electron microscope), EDS(energy dispersive X-ray spectrometer), XRD(X-ray diffraction), micro-hardness, and potentiodynamic polarization were measured and the surface characteristics of the TiAgN coating layers were evaluated. The TiAgN coating layer had different mechanical characteristics based on the bias voltage, which also showed differences in thickness and composition.

Syntheses and Mechanical Properties of Quaternary Cr-Si-O-N Coatings by Hybrid Coating System (하이브리드 코팅시스템에 의한 Cr-Si-O-N 코팅막 합성 및 기계적 성질)

  • Lee, Jeong-Doo;Wang, Qi Min;Kim, Kwang-Ho
    • Journal of the Korean institute of surface engineering
    • /
    • v.43 no.5
    • /
    • pp.238-242
    • /
    • 2010
  • In the present work, the influence of oxide on the Cr-Si-N coatings was investigated for the Cr-Si-O-N coatings on AISI 304 and Si wafer deposited by hybrid system, which combines the DC magnetron sputtering technique and arc ion plating (AIP) using Cr and Si target in an $Ar/N_2/O_2$ gaseous mixture. As the O content in the Cr-Si-N coatings increased, the diffraction patterns of the Cr-Si-O-N coatings showed CrN and $Cr_2O_3$ phases. However, as the O content increased to 28.8 at.%, diffraction peak of $Cr_2O_3$ was disappeared in the Cr-Si-O-N coating. The $d_{200}$ value was decreased with increasing of O content. The average grain size increased from about 40 nm to 65 nm as the O content increased. The maximum micro-hardness of the Cr-Si-O-N coating was obtained 4507 Hk at the O content of 24.8 at.%. The average friction coefficient of the Cr-Si-O-N coatings was gradually decreased by increasing the O content and the average friction coefficient decreased from 0.37 to 0.25 by increasing the O content. These results indicated that amorphous phase was increased in the Cr-Si-O-N coatings by increasing of O content.

Low Cost Via-Hole Filling Process Using Powder and Solder (파우더와 솔더를 이용한 저비용 비아홀 채움 공정)

  • Hong, Pyo-Hwan;Kong, Dae-Young;Nam, Jae-Woo;Lee, Jong-Hyun;Cho, Chan-Seob;Kim, Bonghwan
    • Journal of Sensor Science and Technology
    • /
    • v.22 no.2
    • /
    • pp.130-135
    • /
    • 2013
  • This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

Current Efficiency and Composit ion of Zn-Cr and Zn-Cr-X Ternary Alloy Electrodeposits (고속도금된 Zn-Cr 및 Zn-Cr-X 3원합금의 전류효율 및 조성)

  • Ye G.C.;Kim D.Y.;Ahn D.S.
    • Journal of the Korean institute of surface engineering
    • /
    • v.36 no.3
    • /
    • pp.256-262
    • /
    • 2003
  • The current efficiency and the composition of Zn-Cr and Zn-Cr-X (X : Co, Mn) alloy electrodeposits were investigated by using chloride bath with EDTA auditive and flow cell plating system. The current efficiency of Zn-Cr alloy decreased with increasing current density, while it increased with the content of Co and Mn of the Zn-Cr-X alloy bath in high current density region. The Cr content in Zn-Cr alloy increased from 1.4-2.7 to $28wt\%$ with increasing current density and the phase structure of the alloys changed from $\eta-Zn$ through $\eta-Zn+\gamma'-ZnCr\;to\;\gamma'-ZnCr$ with Increasing Cr content of the alloys. The Co content in Zn-Cr-Co alloys increased with Co content of the bath, while Cr content of the alloy increased or decreased in low current density region $(10-75A/dm^2)$ or high current density region $(75-100A/dm^2)$, respectively. $\gamma-ZnCo$ phase was formed in the Zn-Cr-Co alloy with above $9.0wt\%$ Co. The content of Mn and Cr in Zn-Cr-Mn alloys increased or decreased with the increase of current density in high current density region, respectively while Cr content of the alloy decreased noticeably with the increase of Mn content in the bath. Two phases of $\delta_1-ZnMn$ and $\gamma'-ZnCr$ were formed in the Zn-Cr-Mn alloy with above $8.6wt\%$ Mn.

A Study on Transport Characteristics of Hydrochloric Acid in an Anion Exchange Membrane (음이온 교환막에서 염산의 이동특성 연구)

  • 강문성;오석중;문승현
    • Membrane Journal
    • /
    • v.8 no.3
    • /
    • pp.148-156
    • /
    • 1998
  • Diffusion dialysis is a membrane process driven by concentration difference using ion-exchange membranes and has been employed for many years for the acid recovery from acidic waste generated in steel, metal-refining and dectro-plating industries. Theoretically acid flux increases in propomon to the acid concentration difference. At acid concentrations higher than 3 N HCl, however, the acid flux had not increased linearly with the concentration difference. In this paper the effects of acid concentrations on diffusion dialysis for hydrochloric acid recovery and the acid transport mechanism in an anion exchange membrane were studied by membrane sorption tests and diffusion clialysis cell tests. The experimental results showed that the molecular diffusion was a major transport mechanism in a low acid concentration range and the proton leakage through an anion exchange membrane played an important role at higher acid concentrations. Also osmotic water transport and membrane dehydration retarded the transport of protons and caused the permeate flux to decrease.

  • PDF

Influences of Electrodeposition Variables on the Internal Stess of Nanocrystalline Ni-W Films (나노결정질 Ni-W 합금전착의 내부응력에 미치는 공정조건 변수의 영향)

  • Kim, Kyung-Tae;Lee, Jung-Ja;Hwang, Woon-Suk
    • Corrosion Science and Technology
    • /
    • v.11 no.6
    • /
    • pp.275-279
    • /
    • 2012
  • Ni-W alloy deposits have lately attracted the interest as an alternative surface treatment method for hard chromium electrodeposits because of higher wear resistance, hardness at high temperature, and corrosion resistance. This study deals with influences of process variables, such as electodeposition current density, plating temperature and pH, on the internal stress of Ni-W nanocrystalline deposits. The internal stress was increased with increasing the applied current density. With increasing applied current density, the grain size of the deposit decreases and concentration of hydrogen in the deposit increases. The subsequent release of the hydrogen results in shrinkage of the deposit and the introduction of tensile stress in the deposit. Consequently, for layers deposited at high current density, cracking occurs readily owing to high tensile stress value. By increasing the temperature of the electrodeposition from $60^{\circ}C$ to $80^{\circ}C$, the internal stress was decreased. It seems that an increase in the number of active ions overcoming the activation energy at elevated temperature caused a decline in the concentration polarization and surface diffusion. It decreased the level of hydrogen absorption due to the lessened hydrogen evolution reaction. Therefore, the lower level of hydrogen absorption degenerated the hydride on the surface of the electrode, resulting in the reduction of the internal stress of the deposits. By increasing the pH of the electrodeposition from 5.6 to 6.8, the internal stress in the deposits were slightly decreased. It is considered that the decrease in internal stess of deposits was due to supply of W complex compound in cathode surface, and hydrogen ion resulted from decrease of activity.

Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling (펄스-역펄스 전착법을 이용한 SiP용 via의 구리 충진에 관한 연구)

  • Bae J. S.;Chang G H.;Lee J. H.
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.12 no.2 s.35
    • /
    • pp.129-134
    • /
    • 2005
  • Electroplating copper is the important role in formation of 3D stacking interconnection in SiP (System in Package). The I-V characteristics curves are investigated at different electrolyte conditions. Inhibitor and accelerator are used simultaneously to investigate the effects of additives. Three different sizes of via are tested. All via were prepared with RIE (reactive ion etching) method. Via's diameter are 50, 75, $100{\mu}m$ and the height is $100{\mu}m$. Inside via, Ta was deposited for diffusion barrier and Cu was deposited fer seed layer using magnetron sputtering method. DC, pulse and pulse revere current are used in this study. With DC, via cannot be filled without defects. Pulse plating can improve the filling patterns however it cannot completely filled copper without defects. Via was filled completely without defects using pulse-reverse electroplating method.

  • PDF

DETORQUE FORCE OF TiN-COATED ABUTMENT SCREW WITH VARIOUS COATING THICKNESS AFTER REPEATED CLOSING AND OPENING

  • Kim, Han-Su;Kim, Hee-Jung;Chung, Chae-Heon
    • The Journal of Korean Academy of Prosthodontics
    • /
    • v.45 no.6
    • /
    • pp.769-779
    • /
    • 2007
  • Statement of problem. When TiN coating is applied to the abutment screw, occurrence of greater preload and prevention of the screw loosening could be expected due to decrease of frictional resistance. However, the proper thickness of TiN coating on abutment screw has not been yet reported. Purpose. The purpose of this study is to find out the appropriate TiN coating thickness by evaluating the detorque force and the surface change of titanium abutment screw with various TiN coating thickness. Material and methods. 1. Material Thirty five non-coated abutment screws were prepared for TiN coating. TiN coatings were prepared by Arc ion plating method. Depending on the coating deposition time(CDT), experimental groups were divided into 6 groups(CDT 30min, 60min, 90min, 120min, 150min, 180min) and those of 1 group was not coated as a control group. Each group was made up of 5 abutment screws. 2. Methods FE-SEM(Field Emission Scanning Electron Microscoper) and EDX(Energy Dispersive X-ray Spectroscopy) were used to observe the surface of the abutment screw. Electric scales was used to measure the weight of the abutment screw after the repeated closing and opening of 10 trials. Detorque force was measured with digital torque gauge, at each trial. Results. 1. As the coating deposition time increased, the surface became more consistent and smooth. 2. As for the abutment screws that were TiN coated for more than 60 minutes, no surface change was found after the repeated closing and opening. 3. The TiN coated abutment screws showed less weight change than the non-coated abutment screws. 4. The TiN coated abutment screws showed higher mean detorque force than the noncoated abutment screws. 5. The abutment screw coated for 60 minutes showed the highest mean detorque force. Conclusion. The coating layer of proper thickness is demanded to obtain consistent and smooth coating surface, resistance to wear, and increased detorque force of the abutment screw. In conclusion, the coating deposition time of 60 minutes indicated improved mechanical property, when TiN coating was conducted on titanium abutment screw.

Evaluation of antibacterial activity and osteoblast-like cell viability of TiN, ZrN and $(Ti_{1-x}Zr_x)N$ coating on titanium

  • Ji, Min-Kyung;Park, Sang-Won;Lee, Kwangmin;Kang, In-Chol;Yun, Kwi-Dug;Kim, Hyun-Seung;Lim, Hyun-Pil
    • The Journal of Advanced Prosthodontics
    • /
    • v.7 no.2
    • /
    • pp.166-171
    • /
    • 2015
  • PURPOSE. The aim of this study was to evaluate antibacterial activity and osteoblast-like cell viability according to the ratio of titanium nitride and zirconium nitride coating on commercially pure titanium using an arc ion plating system. MATERIALS AND METHODS. Polished titanium surfaces were used as controls. Surface topography was observed by scanning electron microscopy, and surface roughness was measured using a two-dimensional contact stylus profilometer. Antibacterial activity was evaluated against Streptococcus mutans and Porphyromonas gingivalis with the colony-forming unit assay. Cell compatibility, mRNA expression, and morphology related to human osteoblast-like cells (MG-63) on the coated specimens were determined by the XTT assay and reverse transcriptase-polymerase chain reaction. RESULTS. The number of S. mutans colonies on the TiN, ZrN and $(Ti_{1-x}Zr_x)N$ coated surface decreased significantly compared to those on the non-coated titanium surface (P<0.05). CONCLUSION. The number of P. gingivalis colonies on all surfaces showed no significant differences. TiN, ZrN and $(Ti_{1-x}Zr_x)N$ coated titanium showed antibacterial activity against S. mutans related to initial biofilm formation but not P. gingivalis associated with advanced periimplantitis, and did not influence osteoblast-like cell viability.

Effect of Working Pressure and Substrate Bias on the Tribology Properties of the Cr-Al-N Coatings (Cr-Al-N 코팅의 마찰마모 특성에 미치는 공정압력과 바이어스 전압의 영향)

  • Choi, Seon-A;Kim, Seong-Won;Lee, Sungmin;Kim, Hyung-Tae;Oh, Yoon-Suk
    • Journal of the Korean institute of surface engineering
    • /
    • v.50 no.6
    • /
    • pp.473-479
    • /
    • 2017
  • CrN coatings have been used as protective coatings for cutting tools, forming tools, and various tribological machining applications because these coatings have high hardness. Cr-Al-N coatings have been investigated to improve the properties of CrN coatings. Cr-Al-N coatings were fabricated by a hybrid physical vapor deposition method consisting of unbalanced magnetron sputtering and arc ion plating with different working pressure and substrate bias voltage. The phase analysis of the composition was performed using XRD (x-ray diffraction). Cr-Al-N coatings were grown with textured CrN phase and (111), (200), and (220) planes. The adhesion strength of the coatings tested by scratch test increased. The friction coefficient and removal rate of the coatings were measured by a ball-on-disk test. The friction coefficient and removal rate of the coatings decreased from 0.46. to 0.22, and from $2.00{\times}10^{-12}m^2/N$ to $1.31{\times}10^{-13}m^2/N$, respectively, with increasing bias voltage. The tribological properties of the coatings increased with increasing substrate bias voltage.