Low Cost Via-Hole Filling Process Using Powder and Solder
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Hong, Pyo-Hwan
(School of Electronics Engineering, Kyungpook National University)
Kong, Dae-Young (School of Electronics Engineering, Kyungpook National University) Nam, Jae-Woo (School of Electronics Engineering, Kyungpook National University) Lee, Jong-Hyun (School of Electronics Engineering, Kyungpook National University) Cho, Chan-Seob (School of Electrical Engineering, Kyungpook National University) Kim, Bonghwan (Department of Electronics Engineering, Catholic University of Daegu) |
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