• Journal of Adhesion and Interface
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• v.20 no.4
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• pp.155-161
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• 2019

Understanding charge transport anisotropy at the interface of conjugated nanostructures basically gives insight into structure-property relationship in organic field-effect transistors (OFET). Here, the anisotropy of the field-effect mobility at the interface between 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS-pentacene) single crystal with cofacial molecular stacks in a-b basal plane and SiO gate dielectric was investigated. A solvent exchange method has been used in order for TIPS-pentacene single crystals to be grown on the surface of SiO₂ thin film, corresponding to the charge accumulation at the interface in OFET structure. In TIPS-pentacene OFET, the anisotropy ratio between the highest and lowest measured mobility is revealed to be 5.2. By analyzing the interaction of a conjugated unit in TIPS-pentacene with the nearest neighbor units, the mobility anisotropy can be rationalized by differences in HOMO-level coupling and hopping routes of charge carriers. The theoretical estimation of anisotropy based on HOMO-level coupling is also consistent with the experimental result.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.69-74
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• 2017

Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1116-1122
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• 2010

Metal interconnections of multilayer Al/Ni and TiW/seed-Ni/Ni were formed on glass, and the adhesion strength and nanoindentation response of the composite layers were evaluated. The Al/Ni multilayer was formed by an anodic bonding of glass to Al and subsequent electroless plating of Ni, while the TiW/Ni multilayer was fabricated by sputter deposition of TiW and seed-Ni onto glass and electroless plating of Ni. Because of the diffusion of aluminum into glass during the anodic bonding, anodically bonded glass/Al joint exhibited greater interfacial strength than the sputtered glass/TiW one. The Al/Ni on glass also showed excellent resistance against delamination by bending deformation compared to the TiW/seed-Ni/Ni on glass. From the nanoindentation experiment of each metal layer on glass, it was found that the aluminum layer had extremely low hardness and elastic modulus similar to the glass substrate and played a beneficial role in the delamination resistance by lessening stress intensification at the joint. The indentation data of the multilayers also supported superior joint reliability of the Al/Ni to glass compared to that of the TiW/seed-Ni/Ni to glass.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.109-114
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• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Fibers and Polymers
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• v.7 no.4
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• pp.372-379
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• 2006

The surface topography, tensile properties, and thermal properties of ramie fibers were investigated as reinforcement for fully biodegradable and environmental-friendly 'green' composites. SEM micrographs of a longitudinal and cross sectional view of a single ramie fiber showed a fibrillar structure and rough surface with irregular cross-section, which is considered to provide good interfacial adhesion with polymer resin in composites. An average tensile strength, Young's modulus, and fracture strain of ramie fibers were measured to be 627 MPa, 31.8 GPa, and 2.7 %, respectively. The specific tensile properties of the ramie fiber calculated per unit density were found to be comparable to those of E-glass fibers. Ramie fibers exhibited good thermal stability after aging up to $160^{\circ}C$ with no decrease in tensile strength or Young's modulus. However, at temperatures higher than $160^{\circ}C$ the tensile strength decreased significantly and its fracture behavior was also affected. The moisture content of the ramie fiber was 9.9 %. These properties make ramie fibers suitable as reinforcement for 'green' composites. Also, the green composites can be fabricated at temperatures up to $160^{\circ}C$ without reducing the fiber properties.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1661-1663
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• 2004

The effect of the triblock copolymer poly[styrene-b-(ethylene-co-butylene)-b-styrene](SEBS) on the formation of space charge of immiscible low density polyethylene/polystyrene(LDPE/PS) blends was investigated. The amount of charge accumulated in the 70/30(wt%) LDPE/PS blends decreased when the SEBS content increased up to 10 wt%. For compatibilzed and uncompatibilized blend, morphological observation showed that the addition of SEBS results in the domain size reduction of the dispersed PS phase and a better interfacial adhesion between LDPE and PS phases. The location of SEBS at a domain interface enables charges to migrate from one phase to the other via domain interface and therefore, results in a significant decrease in the amount of space charge for the LDPE/PS blends with SEBS.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.365-368
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• 2002

We investigated the influence of RTP annealing of multi-layered metal films deposited on oxides layer. Two types of oxides, BPSG and P-7205, were used as a bottom layer under multi-layered metal film. The bonding was not good in metal/BPSG/Si samples because adhesion between metal layer and BPSG oxide layer was poor by interfacial reaction during RTP annealing above 650$^{\circ}C$. On the other hand bonding was always good in metal/ P-TEOS /Si samples regardless of annealing temperature. We observed the interface between oxide and metal layers using AES and TEM. The phosphorus and oxygen profile in interface between metal and oxide layers were different in metal/BPSG/Si and metal/P-TEOS/Si samples. We have known that the properties of interface was improved in metal/BPSG/Si samples when the sample was annealed below 650$^{\circ}C$.

• Applied Chemistry for Engineering
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• v.10 no.7
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• pp.1008-1013
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• 1999

Mechanical properties and morphology of pectin/starch blend films depending upon the composition and plasticizer ratio were studied. Blends were prepared continuously in a twin-screw extruder. Films were prepared using a single-screw extruder with slit die. Most of the blends showed a good thermoplastic behavior, while the blends with very high ratio of pectin/starch had a poor thermoplasticity. Tensile properties of blend films were changed significantly by the amount of glycerol and relatively little by the ratio of pectin/starch. Differential scanning calorimetry(DSC) curves of wet blends showed a transition similar to glass transition temperature(Tg) at about $125^{\circ}C$. It was found by Scanning electron microscopy(SEM) study that there exists a good interfacial adhesion between pectin and starch.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.7 s.250
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• pp.779-786
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• 2006

Woven sisal textile reinforced composites were manufactured to evaluate fracture toughness, and tensile test. All specimens were immersed in water five times. All specimens are immersed in pure water during 9 days at room temperature, and dried in 1 day at $50^{\circ}C$. Two kinds of polymer matrices such as epoxy and vinyl-ester were used. Fractured surface were investigated to study the failure mechanism and fiber/matrix interfacial adhesion. It is shows that it can be enhanced to improve their mechanical performance to reveal the relationship between fracture toughness and water absorption fatigue according to different polymer matrices. Water uptake of the epoxy composites was found to increase with cycle times. Mechanical properties are dramatically affected by the water absorption cycles. Water-absorbed samples observed poor mechanical properties such as lower values of maximum strength and extreme elongation. The $K_{IC}$ values demonstrate a decrease in inclination with increasing cyclic times of wetting and drying fur the epoxy and vinyl-ester.

• Carbon letters
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• v.19
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• pp.1-11
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• 2016

In efforts to characterize and understand the properties and processing of phenylethynyl-terminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.