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http://dx.doi.org/10.6117/kmeps.2017.24.2.069

Effect of Post-Annealing Condition on the Peel Strength of Screen-printed Ag Film and Polyimide Substrate  

Bae, Byung-Hyun (VITZROTECH Co., Ltd.)
Lee, Hyeonchul (STATS ChipPAC Korea LTD.)
Son, Kirak (School of Materials Science and Engineering, Andong National University)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.2, 2017 , pp. 69-74 More about this Journal
Abstract
Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.
Keywords
Printed electronics; Adhesion; Peel test; Screen-printed Ag; Polyimide; Reliability;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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