• Title/Summary/Keyword: high hole mobility

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Si-core/SiGe-shell channel nanowire FET for sub-10-nm logic technology in the THz regime

  • Yu, Eunseon;Son, Baegmo;Kam, Byungmin;Joh, Yong Sang;Park, Sangjoon;Lee, Won-Jun;Jung, Jongwan;Cho, Seongjae
    • ETRI Journal
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    • v.41 no.6
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    • pp.829-837
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    • 2019
  • The p-type nanowire field-effect transistor (FET) with a SiGe shell channel on a Si core is optimally designed and characterized using in-depth technology computer-aided design (TCAD) with quantum models for sub-10-nm advanced logic technology. SiGe is adopted as the material for the ultrathin shell channel owing to its two primary merits of high hole mobility and strong Si compatibility. The SiGe shell can effectively confine the hole because of the large valence-band offset (VBO) between the Si core and the SiGe channel arranged in the radial direction. The proposed device is optimized in terms of the Ge shell channel thickness, Ge fraction in the SiGe channel, and the channel length (Lg) by examining a set of primary DC and AC parameters. The cutoff frequency (fT) and maximum oscillation frequency (fmax) of the proposed device were determined to be 440.0 and 753.9 GHz when Lg is 5 nm, respectively, with an intrinsic delay time (τ) of 3.14 ps. The proposed SiGe-shell channel p-type nanowire FET has demonstrated a strong potential for low-power and high-speed applications in 10-nm-and-beyond complementary metal-oxide-semiconductor (CMOS) technology.

Hole Injection Layer by Ion Beam Assisted Deposition for Organic Electroluminescence Devices

  • Choi, Sang-Hun;Jeong, Soon-Moon;Koo, Won-Hoe;Baik, Hong-Koo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1619-1622
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    • 2005
  • The ultra thin hole injection layer (HIL) was deposited on an indium-tin-oxide (ITO) anode by using an ion beam assisted d eposition (IBAD) for the fabrication of an polymeric electroluminescence device for the first time. The device with the HIL deposited by IBAD has higher external quantum efficiency than the device with the HIL by conventional thermal evaporation. It is found that the deposited HIL by IBAD has high surface coverage on ITO anode in a few nm regions because the HIL prepared has high adatom mobility by ion beam energy.

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Performance enhancement of Organic Thin Film Transistor using $C_{60}$ hole injection layer ($C_{60}$(buckminsterfullurene) 홀주입층을 적용한 유기박막트랜지스터의 성능향상)

  • Yi, Moon-Suk
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.5
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    • pp.19-25
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    • 2008
  • In this study, we fabricated Organic Thin Film Transistors(OTFTs) with $C_{60}$ hole injection layer between organic semiconductor(pentacene) and metal electrode, and we compared the electrical characteristics of OTFTs with/without $C_{60}$. When the $C_{60}$ hole injection layer was introduced, the mobility and the threshold voltage were improved from 0.298 $cm^2/V{\cdot}s$ and -13.3V to 0.452 $cm^2/V{\cdot}s$ and -10.8V, and the contact resistance was also reduced. When the $C_{60}$ is inserted, the hole injection was enhanced because the $C_{60}$ prevent the unwanted chemical reaction between pentacene and Au. Furthermore, we fabricated the OTFTs using Al as their electrodes. When the OTFTs were made by only aluminum electrode, the channel were not mostly made because of the high hole injection barrier between pentacene and aluminum, but when the $C_{60}$ layer with an optimal thickness was applied between aluminum and pentacene, the device performances were obviously enhanced because of the vacuum energy level shift of Al and the consequent decrease of the hole injection barrier which was induced by the interface dipole formation between $C_{60}$ and Al. The mobility and $I_{ON}/I_{OFF}$ current ratio of OTFT with $C_{60}/Al$ electrode were 0.165 $cm^2/V{\cdot}s$ and $1.4{\times}10^4$ which were comparable with the normal Au electrode OTFT.

Strained-SiGe Complementary MOSFETs Adopting Different Thicknesses of Silicon Cap Layers for Low Power and High Performance Applications

  • Mheen, Bong-Ki;Song, Young-Joo;Kang, Jin-Young;Hong, Song-Cheol
    • ETRI Journal
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    • v.27 no.4
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    • pp.439-445
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    • 2005
  • We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low power and high performance CMOS applications. By simply adopting 3 and 7 nm thick Si-cap layers in n-channel and p-channel MOSFETs, respectively, the transconductances and driving currents of both devices were enhanced by 7 to 37% and 6 to 72%. These improvements seemed responsible for the formation of a lightly doped retrograde high-electron-mobility Si surface channel in nMOSFETs and a compressively strained high-hole-mobility $Si_{0.8}Ge_{0.2}$ buried channel in pMOSFETs. In addition, the nMOSFET exhibited greatly reduced subthreshold swing values (that is, reduced standby power consumption), and the pMOSFET revealed greatly suppressed 1/f noise and gate-leakage levels. Unlike the conventional strained-Si CMOS employing a relatively thick (typically > 2 ${\mu}m$) $Si_xGe_{1-x}$ relaxed buffer layer, the strained-SiGe CMOS with a very thin (20 nm) $Si_{0.8}Ge_{0.2}$ layer in this study showed a negligible self-heating problem. Consequently, the proposed strained-SiGe CMOS design structure should be a good candidate for low power and high performance digital/analog applications.

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Photoluminescence properties of N-doped and nominally undoped p-type ZnO thin films

  • Jin, Hu-Jie;Jeong, Yun-Hwan;Park, Choon-Bae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.04a
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    • pp.65-66
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    • 2008
  • The realization and origin of p-type ZnO are main issue for photoelectronic devices based on ZnO material. N-doped and nominally undoped p-type ZnO films were achieved on silicon (100) and homo-buffer layers by RF magnetron sputtering and post in-situ annealing. The undoped film shows high hole mobility of 1201 $cm^2V^{-1}s^{-1}$ and low resistivity of $0.0454\Omega{\cdot}cm$ with hole concentration of $1.145\times10^{17}cm^{-3}$. The photoluminescence(PL) spectra show the emissions related to FE, DAP and defects of $V_{Zn}$, $V_O$, $Zn_O$, $O_i$ and $O_{Zn}$.

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A Study of UWB Placement Optimization Based on Genetic Algorithm

  • Jung, Doyeon;Kim, Euiho
    • Journal of Positioning, Navigation, and Timing
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    • v.11 no.2
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    • pp.99-107
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    • 2022
  • Urban Air Mobility (UAM) such as a drone taxi is one of the future transportations that have recently been attracting attention. Along with the construction of an urban terminal, an accurate landing system for UAM is also essential. However, in urban environments, reliable Global Navigation Satellite Systems (GNSS) signals cannot be received due to obstacles such as high-rise buildings which causes multipath and non-line of sight signal. Thus, the positioning result in urban environments from the GNSS signal is unreliable. Consequently, we propose the Ultra-Wideband (UWB) network to assist the soft landing of UAM on a vertiport. Since the positioning performance of UWB network depends on the layout of UWB anchors, it is necessary to optimize the layout of UWB anchors. In this paper, we propose a two-steps genetic algorithm that consists of binary genetic algorithm involved multi objectives fitness function and integer genetic algorithm involved robust solution searching fitness function in order to optimize taking into account Fresnel hole effects.

High thermoelectric performance and low thermal conductivity in K-doped SnSe polycrystalline compounds

  • Lin, Chan-Chieh;Ginting, Dianta;Kim, Gareoung;Ahn, Kyunghan;Rhyee, Jong-Soo
    • Current Applied Physics
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    • v.18 no.12
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    • pp.1534-1539
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    • 2018
  • SnSe single crystal showed a high thermoelectric zT of 2.6 at 923 K mainly due to an extremely low thermal conductivity $0.23W\;m^{-1}\;K^{-1}$. It has anisotropic crystal structure resulting in deterioration of thermoelectric performance in polycrystalline SnSe, providing a low zT of 0.6 and 0.8 for Ag and Na-doped SnSe, respectively. Here, we presented the thermoelectric properties on the K-doped $K_xSn_{1-x}Se$ (x = 0, 0.1, 0.3, 0.5, 1.5, and 2.0%) polycrystals, synthesized by a high-temperature melting and hot-press sintering with annealing process. The K-doping in SnSe efficiently enhances the hole carrier concentration without significant degradation of carrier mobility. We find that there exist widespread Se-rich precipitates, inducing strong phonon scattering and thus resulting in a very low thermal conductivity. Due to low thermal conductivity and moderate power factor, the $K_{0.001}Sn_{0.999}Se$ sample shows an exceptionally high zT of 1.11 at 823 K which is significantly enhanced value in polycrystalline compounds.

TIPS Anthracene Derivatives for Solution Process OTFT Materials : Large $\pi$-stacking area and Easy Crystallizability

  • Park, Jong-Won;Chung, Dae-Sung;Park, Jong-Hwa;Kim, Yun-Hi;Shim, Hong-Ku;Park, Chan-Eon;Kwon, Soon-Ki
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.98-100
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    • 2008
  • A series of new channel materials using triisopropylsilylethynyl anthracene(TIPSAN) derivatives are synthesized by well known reaction. The TIPSAN derivatives exhibit an excellent field-effect mobility with hole mobility as high as 0.1 cm2V-1s-1 by solution-process and slip stack structure of core and end groups with short $\pi-\pi$ stacking distance of $3.525{\sim}3.485\;{\AA}$ by single crystal structures.

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Extreme baking effect of interlayer on PLED's performance

  • Kim, Mu-Gyeom;Kim, Sang-Yeol;Lee, Tae-Woo;Park, Sang-Hun;Park, Jong-Jin;Pu, Lyong-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1775-1778
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    • 2006
  • Through baking process on an interlayer, known as hole transporting layer, varying baking temperature up to 300 degree, which is considered as extremely high for polymer light emitting device (PLED) system, we found interesting relationship between packing density and morphology affecting device performance. Granular morphology shows that as temperature increases, grain size is getting smaller to pack closely and make interlayer harden. Such denser interlayer has temperature dependency of its own mobility, even without clear evidence of degradation of material itself. Its fact proven in a single film also reflects on multilayered PLED's performance like IVL, efficiency, lifetime. It's found that, especially, to enhance lifetime is related with thermal stability of interlayer and its mobility dependency to meet better charge balance. Therefore, it gives us understanding not only baking effect of interlayer, but also material & device designing guide to enhance lifetime.

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In Vivo Three-dimensional Evaluation of the Functional Length of Glenohumeral Ligaments

  • Goto, Akira;Sahara, Wataru;Koishi, Hayato;Yoshikawa, Hideki;Sugamoto, Kazuomi
    • The Academic Congress of Korean Shoulder and Elbow Society
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    • 2009.03a
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    • pp.174-174
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    • 2009
  • The acromioclavicular-hook-plate is one of the surgical treatments for distal clavicle fracture and traumatic acromioclavicular (AC) joint dislocation. Although this procedure can obtain rigid and accurate anatomical reduction of the AC joint, secondary widening of the hook-hole in the acromion is often seen during postoperative follow-up. This complication is owing to the high-degree of mobility of the AC joint. Therefore, it is important to evaluate the effect on these complications due to the position of the hook-hole. The purpose of the present study is to investigate three-dimensionally the effect due to the position of the hook-hole during arm abduction motion. We studied in vivo and three-dimensional kinematics of the normal shoulder joint with use of a markerless bone-registration technique. Magnetic resonance images of 14 shoulders of 7 healthy volunteers were acquired in 7 positions between $0^{\circ}$ and $180^{\circ}$ of abduction. We created three-dimensional computer models of the bones and the acromioclavicular-hook-plate. Based on the three-dimensional kinematics data, we simulated the widening of the hook-hole each different positioning of the hook-hole. The widths of the hook-holes almost linearly increased. And these widths significantly increased, when we put the hook-hole on the acromion from AC joint to 20 mm and 25 mm posterior position.

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