• Economic and Environmental Geology
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• v.32 no.6
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• pp.561-573
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• 1999

Mesothermal gold deposits of the Heungdeok, Daewon and Ilsaeng mines in the Youngdong area occur in fault shear zones in Precambrian metamorphic rocks of central Sobaegsan Massif, Korea, and formed in single stage of massive quartz veins (0.3 to 3 m thick). Ore mineralogy is simple, consisting dominantly of pyrrhotite, sphalerite and galena with subordinate pyrite, chalcopyrite, electrum, tetrahedrite and native bismuth. Fluid inclusion data indicate that hydrothermal mineralization occurred at high temperatures (>240$^{\circ}$ to 400$^{\circ}$C) from $H_{2}O-CO_{2}(-CH_{4})$-NaCI fluids with salinities less than 12 wt. % equiv. NaC!. Fluid inclusions in vein quartz comprise two main types. These are, in decreasing order of abundance, type I (aqueous liquid-rich) and type II (carbonic). Volumetric proportion of the carbonic phase in type II inclusions varies widely in a single quartz grain. Estimated $CH_4$ contents in the carbonic phase of type II inclusions are 2 to 20 mole %. Relationship between homogenization temperature and salinity of fluid inclusions suggests a complex history of fluid evolution, comprising the early fluid's unmixing accompanying $CO_2$ effervescence and later cooling. Estimated pressures of vein filling are at least 2 kbars. The ore mineralization formed from a magmatic fluid with the ${\delta}^{34}S_{{\Sigma}S}$, ${\delta}^{18}O_{water}$ and ${\delta}D_{water}$ values of -2.1 to 2.2$\textperthousand$, 4.7 to 9.3$\textperthousand$ and -63 to -79$\textperthousand$, respectively. This study validates the application of a magmatic model for the genesis of mesothermal gold deposits in Youngdong area.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.31 no.1
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• pp.17-21
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• 2018

The natural frequency of a laminated cantilever microbeam was studied in the present investigation. The microbeam was made of quartz on a silicon chip, and its top and bottom surfaces were coated with thin(~30nm) gold films. An ultrasonic testing platform was employed to resonate the microbeam, and its time domain signal was optically measured. The natural frequency was quantified through the fast Fourier transform of the waveform, and the result showed good agreement with a theoretical estimation from the classical beam theory. This study is expected to provide a dynamic evaluation technique for micro/nanoscale materials and micromechanical structures.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.75-75
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• 2015

Strong interactions between electromagnetic radiation and electrons at metallic interfaces or in metallic nanostructures lead to resonant oscillations called surface plasmon resonance with fascinating properties: light confinement in subwavelength dimensions and enhancement of optical near fields, just to name a few [1,2]. By utilizing the properties enabled by geometry dependent localization of surface plasmons, metal photonics or plasmonics offers a promise of enabling novel photonic components and systems for integrated photonics or sensing applications [3-5]. The versatility of the nanoplasmonic platform is described in this talk on three folds: our findings on an enhanced ultracompact photodetector based on nanoridge plasmonics for photonic integrated circuit applications [3], a colorimetric sensing of miRNA based on a nanoplasmonic core-satellite assembly for label-free and on-chip sensing applications [4], and a controlled fabrication of plasmonic nanostructures on a flexible substrate based on a transfer printing process for ultra-sensitive and noise free flexible bio-sensing applications [5]. For integrated photonics, nanoplasmonics offers interesting opportunities providing the material and dimensional compatibility with ultra-small silicon electronics and the integrative functionality using hybrid photonic and electronic nanostructures. For sensing applications, remarkable changes in scattering colors stemming from a plasmonic coupling effect of gold nanoplasmonic particles have been utilized to demonstrate a detection of microRNAs at the femtomolar level with selectivity. As top-down or bottom-up fabrication of such nanoscale structures is limited to more conventional substrates, we have approached the controlled fabrication of highly ordered nanostructures using a transfer printing of pre-functionalized nanodisks on flexible substrates for more enabling applications of nanoplasmonics.

• Journal of Microbiology and Biotechnology
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• v.16 no.1
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• pp.141-144
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• 2006

An antibody layer was fabricated to detect Escherichia coli O157:H7. The micropattern of 16-mercaptohexadecanoic acid (16-MHDA) as alkylthiolate was formed on the gold surface by using the PDMS stamp with microcontact printing $({\mu}CP)$ techniques. In order to form antibody patterns on the template, protein G was chemically bound to the 16-MHDA patterns, and antibody was adsorbed on a self-assembled protein G layer. The formation of the 16-MHDA micropattern, self-assembled protein G layer and antibody pattern on Au substrate was confirmed by surface plasmon resonance (SPR) spectroscopy. Finally, the micropatterning method was applied to fabricate the antibody probe for detection of E. coli O157:H7, and monitoring of antigen by using this probe was successfully achieved.

• Journal of Microbiology and Biotechnology
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• v.17 no.1
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• pp.5-14
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• 2007

Nanotechnology is the creation and utilization of materials, devices, and systems through the control of matter on the nanometer. The technology has been applied to biodevices such as bioelectronics and biochips to improve their performances. Nanoparticles, such as gold (Au) nanoparticles, are the most widely used of the various other nanotechnologies for manipulation at the nanoscale as well as nanobiosensors. The immobilization of biomolecules is playing an increasingly important role in the development of biodevices with high performance. Nanopatteming technology, which is able to increase the density of chip arrays, offers several advantages, including cost lowering, simultaneous multicomponent detection, and the efficiency increase of biochemical reactions. A microftuidic system incorporated with control of nanoliter of fluids is also one of the main applications of nanotechnologies. This can be widely utilized in the various fields because it can reduce detection time due to tiny amounts of fluids, increase signal-to-noise ratio by nanoparticles in channel, and detect multi-targets simultaneously in one chamber. This article reviews nanotechnologies such as the application of nanoparticles for the detection of biomolecules, the immobilization of biomolecules at nanoscale, nanopatterning technologies, and the microfluidic system for molecular diagnosis.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.11-16
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• 2004

Electronic devices are getting smaller due to integration of electronic chip, and heat generated in electronic devices can cause loss of performance and/or reliability of the devices. In this research, metals such as gold, nickel and copper are plated onto a porous membrane by electroless plating method to make an efficient micro-heatsinks. Electroless plating includes sensitization and activation steps in pre-treatment steps. A polycarbonate(PC) membrane was sensitizied, activated and deposited in each metal solution for plating. Among manufactured microfibrils, heat transfer and radiation properties of Ni-microfibril with high surface area were more effective than those of $Au^-$ and Cu-microfibril.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Current Photovoltaic Research
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• v.4 no.4
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• Journal of Applied Reliability
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• v.7 no.1
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• pp.23-29
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• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.