Antibody Layer Fabrication for Protein Chip to Detect E. coli O157:H7, Using Microcontact Printing Technique |
KIM HUN-SOO
(Department of Chemical and Biomolecular Engineering, and Interdisciplinary Program of Integrated Biotechnology, Sogang University, Technology Planning Team, Corporate R&D Center, Samsung SDI Co. Ltd,)
BAE YOUNG-MIN (Department of Chemical and Biomolecular Engineering, and Interdisciplinary Program of Integrated Biotechnology, Sogang University) KIM YOUNG-KEE (Department of Chemical Engineering, Hankyong National University) OH BYUNG-KEUN (Department of Chemical and Biomolecular Engineering, and Interdisciplinary Program of Integrated Biotechnology, Sogang University) CHOI JEONG-WOO (Department of Chemical and Biomolecular Engineering, and Interdisciplinary Program of Integrated Biotechnology, Sogang University) |
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