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http://dx.doi.org/10.21218/CPR.2016.4.4.140

Fabrication of Core-Shell Structure of Ni/Au Layer on PMMA Micro-Ball for Flexible Electronics  

Hong, Sung-Jei (Display Materials and Components Research Center, Korea Electronics Technology Institute)
Jeong, Gyu-Wan (JEONGEUI Industry Co. Ltd.)
Han, Jeong-In (Department of Chemical and Biochemical Engineering, Dongguk University-SEOUL)
Publication Information
Current Photovoltaic Research / v.4, no.4, 2016 , pp. 140-144 More about this Journal
Abstract
In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.
Keywords
Core-shell; PMMA Micro-ball; Conductive layer; Electroless-plating; Low temperature curing; Flexible electronics;
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