• Title/Summary/Keyword: flex resistance

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A Study on Improvement of the low temperature flex resistance test method about high waterproof materials (고기능성 투습방수 소재의 저온굴곡 시험방법 개선 연구)

  • Lee, Minhee;Moon, Sunjeong;Ko, Hyeji;Hong, Seongdon
    • Journal of Korean Society for Quality Management
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    • v.46 no.3
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    • pp.425-440
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    • 2018
  • Purpose: This study is aimed at developing of the flex resistance testing process at low temperature with the waterproof fabric to suit the military environment, and is designed to fit for the purpose of the waterproof materials in order to optimize the test method by finding out matters to improve from existing the test method and through previous studies. Methods: The test method, which has been applied to flex resistance of existing water-repellent materials, was improved and consequently, differentiated test results could be obtained according to the test temperature, sample size, and flexing method. Results: The testing of the total of 8 samples revealed that performance of the military requirement could hardly be met just by presenting the materials or 2~3 layers when the quality criteria for high functional water repellent fabrics were applied. PTFE(Polytetrafluoroethylene) is preferred to PU(Polyurethane) to be used in the extremely low-temperature environment, but durability under the low-temperature environment may be varied depending on film thickness or laminating technique even if the materials of waterproof films are identical. Therefore, in addition to the material or texture, the test method capable of reflecting durability under the low-temperature environment shall be suggested, and the newly designed test method proposed in this study was shown to suggest differentiated quality criteria by the material. Conclusion: The water resistance measurement and the test method following flex resistance with expanded range of flex will enable the differentiable test of the samples according to the number of repetition. This study is meaningful in that it suggests a differentiable test method capable of establishing a basis of deciding suitable material when selecting military goods made of water repellent material by properly improving the test method.

Buckling resistance, torque, and force generation during retreatment with D-RaCe, HyFlex Remover, and Mtwo retreatment files

  • Yoojin Kim ;Seok Woo Chang;Soram Oh
    • Restorative Dentistry and Endodontics
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    • v.48 no.1
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    • pp.10.1-10.9
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    • 2023
  • Objectives: This study compared the buckling resistance of 3 nickel-titanium (NiTi) retreatment file systems and the torque/force generated during retreatment. Materials and Methods: The buckling resistance was compared among the D-RaCe (DR2), HyFlex Remover, and Mtwo R25/05 retreatment systems. J-shaped canals within resin blocks were prepared with ProTaper NEXT X3 and obturated by the single-cone technique with AH Plus. After 4 weeks, 4 mm of gutta-percha in the coronal aspect was removed with Gates-Glidden drills. Retreatment was then performed using DR1 (size 30, 10% taper) followed by DR2 (size 25, 4% taper), HyFlex Remover (size 30, 7% taper), or Mtrwo R25/05 (size 25, 5% taper) (15 specimens in each group). Further apical preparation was performed with WaveOne Gold Primary. The clockwise torque and upward force generated during retreatment were recorded. After retreatment, resin blocks were examined using stereomicroscopy, and the percentage of residual filling material in the canal area was calculated. Data were analyzed using 1-way analysis of variance with the Tukey test. Results: The HyFlex Remover files exhibited the greatest buckling resistance (p < 0.05), followed by the Mtwo R25/05. The HyFlex Remover and Mtwo R25/05 files generated the highest maximum clockwise torque and upward force, respectively (p < 0.05). The DR1 and DR2 files generated the least upward force and torque (p < 0.05). The percentage of residual filling material after retreatment was not significantly different between file systems (p > 0.05). Conclusions: NiTi retreatment instruments with higher buckling resistance generated greater clockwise torque and upward force.

Comparison of the cyclic fatigue resistance of VDW.ROTATE, TruNatomy, 2Shape, and HyFlex CM nickel-titanium rotary files at body temperature

  • Gundogar, Mustafa;Uslu, Gulsah;Ozyurek, Taha;Plotino, Gianluca
    • Restorative Dentistry and Endodontics
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    • v.45 no.3
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    • pp.37.1-37.8
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    • 2020
  • Objectives: This study aims to compare the cyclic fatigue resistance of VDW.ROTATE, TruNatomy, 2Shape, and HyFlex CM nickel-titanium (NiTi) rotary files at body temperature. Materials and Methods: In total, 80 VDW.ROTATE (25/0.04), TruNatomy (26/0.04), 2Shape (25/0.04), and HyFlex CM (25/0.04) NiTi rotary files (n = 20 in each group) were subjected to static cyclic fatigue testing at body temperature (37℃) in stainless-steel artificial canals prepared according to the size and taper of the instruments until fracture occurred. The number of cycles to fracture (NCF) was calculated, and the lengths of the fractured fragments were measured. The data were statistically analyzed using a 1-way analysis of variance and post hoc Tamhane tests at the 5% significance level (p < 0.05). Results: There were significant differences in the cyclic fatigue resistance among the groups (p < 0.05), with the highest to lowest NCF values of the files as follows: VDW.ROTATE, HyFlex CM, 2Shape, and TruNatomy. There was no significant difference in the lengths of the fractured fragments among the groups. The scanning electron microscope images of the files revealed typical characteristics of fracture due to cyclic fatigue. Conclusions: The VDW.ROTATE files had the highest cyclic fatigue resistance, and the TruNatomy and 2Shape files had the lowest cyclic fatigue resistance in artificial canals at body temperature.

A Study on Practical Function of Neoprene Fabric Design in wearable Device for Golf Posture Training: Focus on Assistance Band with Arduino/Flex Sensor (네오프렌(Neoprene)소재로 구성된 골프자세 훈련용 웨어러블 디바이스의 실용적 기능에 관한 연구: Flex Sensor 및 아두이노를 장착한 보조밴드를 중심으로)

  • Lee, Euna;Kim, Jongjun
    • Journal of Fashion Business
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    • v.18 no.4
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    • pp.1-14
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    • 2014
  • Currently smart textile market is rapidly expanding and the demand is increasing integration of an electronic fiber circuit. The garments are an attractive platform for wearable device. This is one of the integration techniques, which consists of is the selective introduction of conductive yarns into the fabric through knitting, weaving or embroidering. The aim of this work is to develop a golf bend driven prototype design for an attachable Arduino that can be used to assess elbow motion. The process begins with the development of a wearable device technique that uses conductive yarn and flex sensor for measurement of elbow bending movements. Also this paper describes and discusses resistance value of zigzag embroidery of the conductive yarns on the tensile properties of the fabrics. Furthermore, by forming a circuit using an Arduino and flex sensor the prototype was created with an assistance band for golf posture training. This study provides valuable information to those interested in the future directions of the smart fashion industry.

Development of In-Flex System using the Flexibility Aluminum Clad Cable (가요성 알루미늄피 케이블을 이용한 인플렉스 시스템의 개발)

  • Jung, Soon-Won;Koo, Kyung-Wan
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.58 no.2
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    • pp.178-183
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    • 2009
  • The developed in-flex system completed the wiring work with the plug-in connection. To maintain electrical and mechanical stability, and an insulation between the conductors was strengthened by forming a partition. Moreover, the error according to a bad connection was prevented by separating the inlet from the outlet of the electric trace and thus the quick construction become possible. The metal reinforcing material was added outside the upper case and lower case. The fire-resistance efficiency was maximized in order to minimize a damage by the fire. As to the developed system, we found that it takes shorter time to complete installation than the rigid steel conduit wiring work, and that about 25 % of construction cost was saved because the labor costs decrease due to the shorter construction period of time.

Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections

  • Caers, J.F.J.M.;De Vries, J.W.C.;Zhao, X.J.;Wong, E.H.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.3
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    • pp.122-131
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    • 2003
  • In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.

Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding

  • Lee, Haksun;Choi, Kwang-Seong;Eom, Yong-Sung;Bae, Hyun-Cheol;Lee, Jin Ho
    • ETRI Journal
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    • v.38 no.6
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    • pp.1163-1171
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    • 2016
  • Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

In vitro comparison of the cyclic fatigue resistance of HyFlex EDM, One G, and ProGlider nickel titanium glide path instruments in single and double curvature canals

  • Yilmaz, Koray;Uslu, Gulsah;Ozyurek, Taha
    • Restorative Dentistry and Endodontics
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    • v.42 no.4
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    • pp.282-289
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    • 2017
  • Objectives: It was aimed to compare the cyclic fatigue resistances of ProGlider (PG), One G (OG), and HyFlex EDM (HEDM) nickel titanium glide path files in single- and double-curved artificial canals. Materials and Methods: 40 PG (16/0.02), 40 OG (14/0.03), and 40 HEDM (10/0.05) single-file glide path files were used in the present study. Sixty files were subjected to cyclic fatigue test by using double-curved canals and 60 files by using single-curved canal (n = 20). The number of cycles to fracture (NCF) was calculated and the length of the fractured fragment (FL) was determined by a digital micro-caliper. Twelve pieces of fractured files were examined with scanning electron microscope to determine fracture types of the files (n = 2). The NCF and the FL data were analyzed using one-way analysis of variance and post hoc Tukey test using SPSS 21 software (p < 0.05). Results: In all of the groups, NCF values were significantly lower in double-curved canals when compared to single-curved canals (p < 0.05). For both of single- and double-curved canals, NCF values of HEDM group in apical and coronal curvatures were found to be significantly higher than NCF values of PG and OG groups (p < 0.05). In both of single- and double-curved canals, NCF value of PG group was found significantly higher than OG group (p < 0.05). Conclusions: Within the limitations of this study, HEDM glide path files were found to have the highest cyclic fatigue resistance in both of single- and double-curved canals.

Color stability of bulk-fill and incremental-fill resin-based composites polished with aluminum-oxide impregnated disks

  • Koc-Vural, Uzay;Baltacioglu, Ismail;Altinci, Pinar
    • Restorative Dentistry and Endodontics
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    • v.42 no.2
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    • pp.118-124
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    • 2017
  • Objectives: This study aimed to evaluate the color stability of bulk-fill and nanohybrid resin-based composites polished with 3 different, multistep, aluminum-oxide impregnated finishing and polishing disks. Materials and Methods: Disk-shaped specimens (8 mm in diameter and 4 mm in thickness) were light-cured between two glass slabs using one nanohybid bulk-fill (Tetric EvoCeram, Ivoclar Vivadent), one micro-hybrid bulk-fill (Quixfil, Dentsply), and two nanohybrid incremental-fill (Filtek Ultimate, 3M ESPE; Herculite XRV Ultra, Kerr) resin-based composites, and aged by thermocycling (between $5-55^{\circ}C$, 3,000 cycles). Then, they were divided into subgroups according to the polishing procedure as SwissFlex ($Colt\grave{e}ne/Whaledent$), Optidisc (Kerr), and Praxis TDV (TDV Dental) (n = 12 per subgroup). One surface of each specimen was left unpolished. All specimens were immersed in coffee solution at $37^{\circ}C$. The color differences (${\Delta}E$) were measured after 1 and 7 days of storage using a colorimeter based on CIE Lab system. The data were analyzed by univariate ANOVA, Mann-Whitney U test, and Friedmann tests (${\alpha}=0.05$). Results: Univariate ANOVA detected significant interactions between polishing procedure and composite resin and polishing procedure and storage time (p < 0.05). Significant color changes were detected after 1 day storage in coffee solution (p < 0.05), except Quixfil/Optidisc which was color-stable after 7 days (p > 0.05). Polishing reduced the discoloration resistance of Tetric EvoCeram/SwissFlex, Tetric EvoCeram/Praxis TDV, Quixfil-SwissFlex, and all Herculite XRV Ultra groups after 7 days storage (p < 0.05). Conclusions: Discoloration resistance of bulk-fill resin-based composites can be significantly affected by the polishing procedures.

A Study on the Assembly Process and Reliability of COF (Chip-On-Flex) Using ACFs (Anisotropic Conductive Films) for CCM (Compact Camera Module) (ACF를 이용한 CCM (Compact Camera Module)용 COF(Chip-On-Flex) 실장 기술 및 신뢰성 연구)

  • Chung, Chang-Kyu;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.2
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    • pp.7-15
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    • 2008
  • In this paper, the Chip-On-Flex (COF) assembly process using anisotropic conductive films (ACFs) was investigated and the reliability of COF assemblies using ACFs was evaluated. Thermo-mechanical properties of ACFs such as coefficient of thermal expansion (CTE), storage modulus (E'), and glass transition temperature $(T_g)$ were measured to investigate the effects of ACF material properties on the reliability of COF assemblies using ACFs. In addition, the bonding conditions for COF assemblies using ACFs such as time, temperature, and pressure were optimized. After the COF assemblies using ACFs were fabricated with optimized bonding conditions, reliability tests were then carried out. According to the reliability test results, COF assemblies using the ACF which had lower CTE and higher $T_g$ showed better thermal cycling reliability. Consequently, thermo-mechanical properties of ACFs, especially $T_g$, should be improved for high thermal cycling reliability of COF assemblies using ACFs for compact camera module (CCM) applications.

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