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Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections  

Caers, J.F.J.M. (Philips Electronics Singapore, Centre for Industrial Technology (CFT))
De Vries, J.W.C. (Philips Electronics, Centre for Industrial Technology (CFT))
Zhao, X.J. (Philips Electronics Singapore, Centre for Industrial Technology (CFT))
Wong, E.H. (Institute of Microelectronics (IME))
Publication Information
JSTS:Journal of Semiconductor Technology and Science / v.3, no.3, 2003 , pp. 122-131 More about this Journal
Abstract
In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.
Keywords
reliability; flip chip; soldering; post cure; delamination;
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