1 |
Nysaether J., Lai Z., Liu J., 'Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints', IEEE Trans. Adv. Pack. 23 (2000) 743-749
DOI
ScienceOn
|
2 |
Yim M.J., Paik K.W., 'Effect of non-conducting filler additions on ACA properties and the reliability of ACA flip chip on organic substrates', IEEE Trans. Comp. Pack. Techn. 24 (2001) 24-32
DOI
ScienceOn
|
3 |
Li L., Morris J., Liu J., Lai Z., Ljungkrona L., Lai C., 'Reliability and failure mechanism of isotropically conductive adhesive joints'. Proc. 45th Electr. Comp. & Techn. Conf. 1995, pp114-120
DOI
|
4 |
Olliff D., Gaynes M., Kodnani R., Zubelewicz A., 'Characterizing the failure envelope of a conductive adhesive', Symp. Adv. Pack. Mater. (1997), pp124-126
DOI
|
5 |
Liu, J. 'Recent advances in conductive adhesives for direct chip attach applications', Microsystem Technologies 5 (1998) 72-80
DOI
|
6 |
Lam D., Yang F., Tong P., 'Chemical kinetic model of interfacial degradation of adhesive joints', IEEE Trans. Comp. Pack. Techn. 22 (1999) 215-220
DOI
|
7 |
Liu, J., 'On the failure mechanism of anisotropically conductive adhesive joints on copper metallization', Int. J. Adhesion and Adhesives 16 (1996) 285-287
DOI
ScienceOn
|
8 |
Caers J.F.J.M., Zhao X.J., Wong E.H., Ong C.K., Wu Z.X., Ranjan R., 'Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives,' Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp1176-1180
|
9 |
MieBner R., Aschenbrenner R., Reichl H., 'Reliability study of flip chip on FR4 interconnections with ACA', Proc. 49th Electr. Comp. and Techn. Conf., 1999, San Diego, pp595-601
DOI
|
10 |
Wu S.X., Hu K.X., Yeh C.P., 'Contact reliability modeling and material behavior of conductive adhesives under thermomechanical loads' in 'Conductive adhesives for electronics packaging' (ed. J. Liu, Electrochemical Publications, 1999), chapter 6
|
11 |
Jongen R.J.J.M., Vandamme L.K.J., Bonne H.H., Vries de J.W.C., '1/f Noise as a Diagnostic Tool to Investigate the Quality of Anisotropic Conductive Adhesive (ACA) Bonds for Ball Grid Arrays (BGA's)', Fluctuation an Noise Letters, Volume 3, Number 1, March 2003, pp L31-L50
DOI
|
12 |
Wu Y.P., Alam M.O., Chan Y.C., Wu B.Y., 'Impact properties of flip chip interconnection using anisotropically conductive film on the glass and flexible substrate', Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp 544-548
|
13 |
Caers J.F.J.M., Zhao X.J., Lekens G., Dreesen R., Croes K., Wong E.H., 'Moisture Induced Failures in Flip Chip on Flex Interconnections using Anisotropic Conductive Adhesives' Proc International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong and Shenzhen, January 2003, pp 171-176
|
14 |
Vries de J., Janssen E.A., ' Humidity and reflow resistance of flip chip on foil assemblies with conductive adhesive joints', IEEE Trans. Comp. Pack. Techn., accepted for publication 2003
DOI
ScienceOn
|
15 |
Sturm J.C., Reeves C.M., IEEE Transaction Electron Devices 39(1), 81-88, 1992
DOI
ScienceOn
|
16 |
Chai T.C., Wong B.S., Bai W.M., Trigg A., Lam Y.K., 'A Novel Defect Detection Technique Using Active Transient Thermography for High Density Package and Interconnections', Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp920-925
|
17 |
Vries J. de, 'Failure mechanism of anisotropic conductive adhesive interconnections in flip chip Ics on flexible substrates', IEEE Trans. Comp. Pack. Techn., accepted for publication 2003
DOI
ScienceOn
|
18 |
Palm J., Maattanen J., Tuominen A., Ristolainen E., 'Reliability of pitch flip chip attachment on flex', Microelectronics Reliability Vol. 41, 2001, pp633-638:
DOI
ScienceOn
|
19 |
Rahim M.K., Suhling J.C., Copeland D.S.,Jaeger R.C.,Lall P. Johnson R.W., 'Characterization of Die Stresses in Flip Chip on Laminate Assemblies Using(111) Silicon Stress Test Chips', Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp905-919
|
20 |
Jokinen E., Seppala A., Pienimaa S., Ristolainen E., 'Reliability of ACF flip chip joint on flexible substrate', Proc. 37th IMAPS Nordic Conf. (2000) 192-196
|
21 |
Lai Z., Liu J., 'Anisotropically conductive adhesive flipchip bonding on rigid and flexible printed circuit systems', IEEE Trans-CPMT-B,Vol.19, 1996, pp. 644-660
DOI
ScienceOn
|
22 |
Rusanen O., Lenkkeri J., 'Thermal stress induced failures in adhesive flip chip joints”, Int. J. Microcircuits and Electr. Pack. 22 (1999) 363-369
|