JSTS:Journal of Semiconductor Technology and Science

The Institute of Electronics and Information Engineers (대한전자공학회)
권호 표지

Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections

  • Caers, J.F.J.M. (Philips Electronics Singapore, Centre for Industrial Technology (CFT)) ;
  • De Vries, J.W.C. (Philips Electronics, Centre for Industrial Technology (CFT)) ;
  • Zhao, X.J. (Philips Electronics Singapore, Centre for Industrial Technology (CFT)) ;
  • Wong, E.H. (Institute of Microelectronics (IME))
  • Published : 2003.09.01
Download PDF
⟨ Previous Next ⟩

Abstract

In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.

Keywords

References

  1. Wu S.X., Hu K.X., Yeh C.P., 'Contact reliability modeling and material behavior of conductive adhesives under thermomechanical loads' in 'Conductive adhesives for electronics packaging' (ed. J. Liu, Electrochemical Publications, 1999), chapter 6
  2. Caers J.F.J.M., Zhao X.J., Wong E.H., Ong C.K., Wu Z.X., Ranjan R., 'Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives,' Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp1176-1180
  3. Liu, J., 'On the failure mechanism of anisotropically conductive adhesive joints on copper metallization', Int. J. Adhesion and Adhesives 16 (1996) 285-287 https://doi.org/10.1016/S0143-7496(96)00016-4
  4. MieBner R., Aschenbrenner R., Reichl H., 'Reliability study of flip chip on FR4 interconnections with ACA', Proc. 49th Electr. Comp. and Techn. Conf., 1999, San Diego, pp595-601 https://doi.org/10.1109/ECTC.1999.776240
  5. Olliff D., Gaynes M., Kodnani R., Zubelewicz A., 'Characterizing the failure envelope of a conductive adhesive', Symp. Adv. Pack. Mater. (1997), pp124-126 https://doi.org/10.1109/ISAPM.1997.581274
  6. Liu, J. 'Recent advances in conductive adhesives for direct chip attach applications', Microsystem Technologies 5 (1998) 72-80 https://doi.org/10.1007/s005420050145
  7. Lam D., Yang F., Tong P., 'Chemical kinetic model of interfacial degradation of adhesive joints', IEEE Trans. Comp. Pack. Techn. 22 (1999) 215-220 https://doi.org/10.1109/6144.774734
  8. Yim M.J., Paik K.W., 'Effect of non-conducting filler additions on ACA properties and the reliability of ACA flip chip on organic substrates', IEEE Trans. Comp. Pack. Techn. 24 (2001) 24-32 https://doi.org/10.1109/6144.910798
  9. Li L., Morris J., Liu J., Lai Z., Ljungkrona L., Lai C., 'Reliability and failure mechanism of isotropically conductive adhesive joints'. Proc. 45th Electr. Comp. & Techn. Conf. 1995, pp114-120 https://doi.org/10.1109/ECTC.1995.514370
  10. Palm J., Maattanen J., Tuominen A., Ristolainen E., 'Reliability of $80 {\mu}m$ pitch flip chip attachment on flex', Microelectronics Reliability Vol. 41, 2001, pp633-638: https://doi.org/10.1016/S0026-2714(01)00009-9
  11. Lai Z., Liu J., 'Anisotropically conductive adhesive flipchip bonding on rigid and flexible printed circuit systems', IEEE Trans-CPMT-B,Vol.19, 1996, pp. 644-660 https://doi.org/10.1109/96.533908
  12. Rusanen O., Lenkkeri J., 'Thermal stress induced failures in adhesive flip chip joints”, Int. J. Microcircuits and Electr. Pack. 22 (1999) 363-369
  13. Nysaether J., Lai Z., Liu J., 'Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints', IEEE Trans. Adv. Pack. 23 (2000) 743-749 https://doi.org/10.1109/6040.883767
  14. Jokinen E., Seppala A., Pienimaa S., Ristolainen E., 'Reliability of ACF flip chip joint on flexible substrate', Proc. 37th IMAPS Nordic Conf. (2000) 192-196
  15. Rahim M.K., Suhling J.C., Copeland D.S.,Jaeger R.C.,Lall P. Johnson R.W., 'Characterization of Die Stresses in Flip Chip on Laminate Assemblies Using(111) Silicon Stress Test Chips', Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp905-919
  16. Sturm J.C., Reeves C.M., IEEE Transaction Electron Devices 39(1), 81-88, 1992 https://doi.org/10.1109/16.108215
  17. Chai T.C., Wong B.S., Bai W.M., Trigg A., Lam Y.K., 'A Novel Defect Detection Technique Using Active Transient Thermography for High Density Package and Interconnections', Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp920-925
  18. Jongen R.J.J.M., Vandamme L.K.J., Bonne H.H., Vries de J.W.C., '1/f Noise as a Diagnostic Tool to Investigate the Quality of Anisotropic Conductive Adhesive (ACA) Bonds for Ball Grid Arrays (BGA's)', Fluctuation an Noise Letters, Volume 3, Number 1, March 2003, pp L31-L50 https://doi.org/10.1142/S0219477503001075
  19. Vries J. de, 'Failure mechanism of anisotropic conductive adhesive interconnections in flip chip Ics on flexible substrates', IEEE Trans. Comp. Pack. Techn., accepted for publication 2003 https://doi.org/10.1109/TCAPT.2004.825797
  20. Caers J.F.J.M., Zhao X.J., Lekens G., Dreesen R., Croes K., Wong E.H., 'Moisture Induced Failures in Flip Chip on Flex Interconnections using Anisotropic Conductive Adhesives' Proc International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong and Shenzhen, January 2003, pp 171-176
  21. Vries de J., Janssen E.A., ' Humidity and reflow resistance of flip chip on foil assemblies with conductive adhesive joints', IEEE Trans. Comp. Pack. Techn., accepted for publication 2003 https://doi.org/10.1109/TCAPT.2003.817647
  22. Wu Y.P., Alam M.O., Chan Y.C., Wu B.Y., 'Impact properties of flip chip interconnection using anisotropically conductive film on the glass and flexible substrate', Proc. 53rd Electr. Comp. & Techn. Conf., 2003, New Orleans, pp 544-548