• Title/Summary/Keyword: etching solution.

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WC Micro-shaft Fabrication Using Electrochemical Etching (전해 가공을 이용한 WC 미세축 제작)

  • 최세환;류시형;최덕기;주종남
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.6
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    • pp.172-178
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    • 2004
  • Tungsten carbide microshaft can be used as various micro-tools for MEMS because it has high hardness and high rigidity. In this study, experiments are performed to produce tungsten carbide micro-shaft using electrochemical etching. H$_2$SO$_4$ solution is used as electrolyte because it can dissolve tungsten and cobalt simultaneously. Optimal electrolyte concentration and machining voltage satisfying uniform shape, good surface quality, and high MRR of workpiece are experimentally found. By controlling the various machining parameters, a straight micro-shaft with 5 ${\mu}{\textrm}{m}$ diameter, 3 mm length, and 0.2$^{\circ}$taper angle was obtained.

Pickling of oxidized 304 Stainless Steel using Waste Acids from Etching Process of Silicon Wafer (실리콘 웨이퍼 에칭공정으로부터 발생(發生)된 폐산(廢酸)을 이용(利用)한 스테인리스 스틸의 산세거동(酸洗擧動) 연구(硏究))

  • Kim, Min-Seuk;Ahn, Jong-Gwan;Kim, Hong-In;Kim, Ju-Yup;Ahn, Jae-Woo
    • Resources Recycling
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    • v.17 no.2
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    • pp.36-45
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    • 2008
  • Pickling of oxidized 304 stainless steel has been investigated using rotating disk electrode in waste acid solutions generated from the etching process of silicon wafer in order to recycle them. The waste acid solution contained acetic, nitric, hydrofluoric acids, and silicon of $19.6g/L^{-1}$. Electrochemical behavior during the pickling was distinctively different between the original and silicon-removed acid solutions. Open circuit potential was continuously changed in the original solution, while it was discontinuously changed and fluctuated in the silicon-removed solution. Fast and abrupt removal of surface oxide layer with severe pitting was observed in the silicon-removed solution. It was found that solution temperature had the most influential effect on glossiness. Surface glossiness after pickling was decreased with solution temperature. At the same condition, the glossiness was higher in the original solution than in the silicon-removed solution.

Effects of Pretreatment Method on the Bonding Strength of 4-META/MMA-TBB Resin to Bovine Dentin (상아질 전처리방법이 4-META/MMA-TBB계 레진의 접착강도가 미치는 영향)

  • 김교한;김영빈
    • Journal of Biomedical Engineering Research
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    • v.16 no.4
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    • pp.533-542
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    • 1995
  • The present study investigated the effectiveness of pretreatment on dentin bonding. The adhesive resin was 5% 4-methacryloyloxyethyl trimellitate anhydride (4-META) in methyl methacrylate (MMA) combined with poly-MMA powder. Polymerization of this resin was initiated by tri-n-butyl borage (TBB). Ground bovine dentin samples were etched with either an aqueous solution of 10% citric (10-0 solution) (Group I) or aqueous solution of 10% citric acid and 3% ferric chloride(10-3 solution) (Group ll ). After etching, the primer (an aqueous solution of 35% hydroxyethyl methacrylate (HEM- A) and 5% glutaraldehyde was applied on the differently etched surfaces (Group III , Group IV). The 10-0 treatment showed the lowest tensile bond strength, followed by the 10-3 treatment, primer application after the 10-0 treatment and primer application after the 10-3 treatment. The relationship among the surface morphology after pretreatment, fractured surface morphology and tensile bond strength was examined. It revealed that the surface morphology change by different pretreatment influenced the bond strength and the resulting fractured surface morphology. The correlation of tensile bond strength with the fracture morphology was explained.

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Track Distiribution of Recoil Protons in PN-3 Dosimeters Etched in NaOH Solution (NaOH 용액에 의해 부식된 PN-3 선량측정계에서의 되튕긴 양성자의 궤적 분포)

  • Yoo, Done-Sik;Sim, Kwang-Souk
    • Progress in Medical Physics
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    • v.2 no.2
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    • pp.129-139
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    • 1991
  • The method of etching tracks in PN-3 dosimeter has been applied to tracks of recoil protons from a neutron source. Both the etch and the detection response of PN-3 has been studied as a function of etched-track diameters against various parameters. We could obtain very useful informations about charge, energy, and mass of particles and the relationship between the track etching rate and the track forming procedure in order to analyze the particle recorded in the solid state track detector. The best etching condition could be found by means of changing the etching circumstances for various energies and particles in order to detect the charged particle accurately. It could be influenced widely that the polymer plastic detector could develep the detecting technique for the low energy level neutron and could be used as a neutron dosimeter in the radiation field such as the nuclear power station, the medical institute and the nondtructive testing institute.

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Comparison of Properties of Polymer Based Glass Lenses by Chemical Etching Reaction (고분자 안경 렌즈의 재질별 화학적 식각 반응성 비교)

  • Lee, Junghwa;Noh, Hyeran
    • Journal of Korean Ophthalmic Optics Society
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    • v.17 no.2
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    • pp.119-126
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    • 2012
  • Purpose: To study changes in coating and lens materials after chemically etched different polymer based glass lenses in short-term and ambient condition using hydrofluoric acid. Methods: Vinyl ester polymer (Lens A) and thiourethane polymer (Lens B), both dyed in gray 70%, were etched in hydrofluoric acid solution for 5, 10, or 15 min. The mechanical properties, degrees of damages in hard coating, anti-reflection coating, and other coatings, rates of refractive index and light transmission of both polymer types were evaluated. Results: Rates of refractive index of both lens types were not changed significantly after chemical etching. However, anti-reflection coatings and hard coatings were removed and lens surfaces were damaged. As a results, UV light transmission of lenses increased and mechanical properties decreased. Chemical etching notably changed various properties of thiourethane polymer materials. Conclusions: Depending on types of polymer materials, chemical reactions by hydrofluoric acid were dissimilar. Thus, various properties of les materials were altered differently.

Microscopy Study for the Batch Fabrication of Silicon Diaphragms (실리콘 Diaphragm의 일괄 제조공정을 위한 Microscopy Study)

  • 하병주;주병권;차균현;오명환;김철주
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.29A no.1
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    • pp.33-40
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    • 1992
  • Several etching phenomena were observed and analyzed in diaphragm process performed on 4-inch (100) Si wafers for sensor application. In case of deep etching to above 300$\mu$m depth, the etch-defects appeared at etched surface could be classified into three categories such as hillocks, reaction products, and white residues. It was known that the hillock had a pyramidal shape or trapizoidal hexahedron structure depending on the density and size of the reaction products. The IR spectra showed that the white residue, which was due to the local over-saturation of Si dissolved in solution, was mostly Si-N-O compounds mixed with a small amount of H and C etc. Also, the difference in both the existence of etch-defects and etch rate distribution over a whole wafer was investigated when the etched surfaces were downward, upward horizontally and erective in etching solutions. The obtained data were analyzed through flow pattern in the etching bath. As the results, the downward and erective postures were favorable in the etch rate uniformity and the etch-defect removal, respectively.

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Formation of Aluminum Etch Tunnel Pits with Uniform Distribution Using UV-curable Epoxy Mask (UV-감응형 에폭시 마스크를 사용한 균일한 분포의 터널형 알루미늄 에치 피트 형성 연구)

  • Park, Changhyun;Yoo, Hyeonseok;Lee, Junsu;Kim, Kyungmin;Kim, Youngmin;Choi, Jinsub;Tak, Yongsug
    • Applied Chemistry for Engineering
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    • v.24 no.5
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    • pp.562-565
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    • 2013
  • The high purity Al foil, which has an enlarged surface area by electrochemical etching process, has been used as an anode for an aluminum electrolytic capacitor. Etch pits are randomly distributed on the surface because of the existence of surface irregularities such as impurity and random nucleation of pits. Even though a large surface area was formed on the tunnel-etched Al, its applications to various fields were limited due to non-uniform tunnel morphologies. In this work, the selective electrochemical etching of aluminum was carried out by using a patterned mask fabricated by photolithographic method. The formation of etch pits with uniform distribution has been demonstrated by the optimization of experimental conditions such as current density and etching solution temperature.

Effects of the Additives on Etching Characteristics of Aluminum Foil (첨가제에 의한 알루미늄박의 에칭특성변화)

  • Kim, Seong-Gap;Shin, Dong-Cheol;Jang, Jae-Myeong;Lee, Jong-Ho;Oh, Han-Jun;Chi, Chung-Su
    • Korean Journal of Materials Research
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    • v.11 no.1
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    • pp.48-54
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    • 2001
  • The effects of additives in the HCI etching solution on etching behaviors of aluminum foil as dielectric film for electrolytic capacitors were investigated. The etch pits formed in 1M hydrochloric acid containing ethylene glycol as an additive contain more fine and homogeneous etch tunnels compared to those in 1 M hydrochloric acid only, which led to the increase in the effective internal surface area of aluminum foil. After anodizing of aluminum foil etched in etching solutions, the LCR meter results have shown that the capacitance of dielectric film etched in hydrochloric acid with ethylene glycol was increased remarkably compared to that etched in hydrochloric acid only.

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Acid Etching of Sapphire Substrate for Hetero-Epitaxial Growth (Hetero-Epi막 성장용 사파이어 기판의 산에칭)

  • Kim, Hyang Sook;Hwang, Jin Soo;Chong, Paul Joe
    • Journal of the Korean Chemical Society
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    • v.39 no.1
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    • pp.1-6
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    • 1995
  • The surface of a sapphire substrate used for hetero-epitaxy was chemically polished in a mixture of $H_3PO_4\;and\;H_2SO_4$ solution. The extent of etching for various crystal orientations was found to be dependent on the etching time at $315{\pm}2^{\circ}C$ and at the composition of $H_2SO_4 : H_3PO_4$=3 : 1. In addition, the etching rates of the substrates were investigated in the mixture of $H_2SO_4 : H_3PO_4$=3 : 1 by volume and in the temperature range of 280~320$^{\circ}C$. From the plot of log R against 1/T, the activation penergy ($(E_a)$) was found to be in the order of $({\bar1}012) > (10{\bar1}0) > (11{\bar2}0) > (0001)$ plane. After removing the surface layers of the sapphire with (0001), $({\bar1}012),\;(10{\bar1}0)\;and\;(11{\bar2}0)$ plane by a thickness of 64.6, 46.5, 16.2 and 5.1 ${\mu}m$, respectively, the morphology of the resulting surface was observed by SEM.

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MICROLEAKAGE OF VARIOUS COMPOSITE RESIN SYSTEMS (다양한 복합레진 시스템의 변연 누출도)

  • Kim, In-Soo;Min, Kyung-San;Shin, Dong-Hoon
    • Restorative Dentistry and Endodontics
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    • v.28 no.2
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    • pp.127-133
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    • 2003
  • The object of this study was to compare the microleakage between various composite resin systems of multistep, one-bottle, and self-etching systems using electrical conductivity. After making class V cavities ($4{\times}3{\times}1.5{\;}mm$ around CEJ), they were bulk filled with three kinds of resins of A3. Teeth were storaged in a saline solution for one day, after then, they were finished and polished using Sof-Lex system. Another stress of thermocycling was made for 500 times from $5^{\circ}{\;}to{\;}55^{\circ}C$ with each dwelling time of 10 seconds. Electrical conductivity (microamphere, $\mu\textrm{A}$) was checked four times: before and after cavity preparation, after filing, after thermocycling. One-way ANOVA and 95% Scheffe Post Hoc test was used for checking any statistical difference among groups. Another 95% Paired Samples T-test was also used for estimating any significant difference within group after cavity filling or thermocycling. The results were as follows: 1 Every specimen showed various range of microleakage after filing. There was, however, no difference between composite resin systems. 2. All composite resin systems showed marked increase in microleakage with a thermocycling (p<0.05), there was, however, no difference between composite resin systems. 3. Although there was no significant difference between groups (p=0.078), one-bottle and self-etching systems seemed to be unstable than multistep system. Within the limits of this study, it was concluded that much more consideration should be needed when using thermally unstable one-bottle and self-etching systems that have multi-advantages from simplified step. More studies will be needed to solve these kinds of problems.