• 한국생산제조학회지
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• 제21권2호
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• pp.297-304
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• 2012

Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Carbon letters
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• 제15권1호
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• pp.32-37
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• 2014

Multi-walled carbon nanotube (MWCNT)/epoxy composites are prepared by a vacuum assisted resin transfer molding (VARTM) method. The mechanical properties, fracture surface morphologies, and thermal stabilities of these nanocomposites are evaluated for epoxy resins with various amounts of MWCNTs. Composites consisting of different amounts of MWCNTs displayed an increase of the work of adhesion between the MWCNTs and the matrix, which improved both the tensile and impact strengths of the composites. The tensile and impact strengths of the MWCNT/epoxy composite improved by 59 and 562% with 0.3 phr of MWCNTs, respectively, compared to the epoxy composite without MWCNTs. Thermal stability of the 0.3 phr MWCNT/epoxy composite increased compared to other epoxy composites with MWCNTs. The enhancement of the mechanical and thermal properties of the MWCNT/epoxy nanocomposites is attributed to improved dispersibility and strong interfacial interaction between the MWCNTs and the epoxy in the composites prepared by VARTM.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1995년도 추계학술대회 논문집
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• Journal of Welding and Joining
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• 제18권2호
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• 접착 및 계면
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• 제12권4호
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• pp.138-143
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• 2011

특수한 방향족 화합물인 biphenylene 성분이 도입된 novolac 유도체를 기본 골격으로 하는 에폭시 수지 경화물은 난연제의 도움 없이도 자기소화성을 발현하며, 최근에 친환경 EMC (Epoxy Molding Compound) 소재로 상용화되고 있다. 본 연구에서는 이들을 골격으로 하는 에폭시수지와 경화제로 이루어진 경화물을 제조하여 DSC, DMA, TMA, TGA로부터 phenol 유도체의 분자구조와 반응성, 열팽창성, 탄성율 및 열분해성 등을 검토하였다. 주제와 경화제의 골격구조로 biphenyl novolac 구조가 모두 함유할 때 저팽창성, 기계적 성능 및 연소지연성 등이 우수하게 나타났다.

• 한국컴퓨터정보학회:학술대회논문집
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• 한국컴퓨터정보학회 2011년도 제44차 하계학술발표논문집 19권2호
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• pp.351-354
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• 2011

The electrical degradation phenomena of epoxy composites to be used as a molding material for transformers were studied. The electrets were first manufactured by applying high voltages to five kinds of specimens given a mixing rate, and then TSC(Thermally Stimulated Current) values at the temperature range of $-160{\sim}200[^{\circ}C]$ were measured from a series of experiments. The behaviour of carrier and its origin in epoxy composites were examined, respectively. And various effects of electrical degradation on epoxy composites were also discussed in this study.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.144.2-144.2
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• 2010

Bipolar plate는 고분자 전해질 연료전지(PEMFC)에서 핵심 부품 중의 하나이고, 전해질 막이나 촉매 등에 비해서는 상대적으로 쉽게 접근할 수 있기 때문에 많은 연구가 수행되고 있다. Bipolar plate를 제조하는 기술은 크게 금속을 프레스 가공하는 방법, graphite 판을 직접 밀링하는 방법 및 고분자/카본계의 press molding 법 등 3가지로 분류되며, 본 연구에서는 3번째 방법에 의해서 bipolar plate를 대량 생산하는 방법에 대해 연구하였다. 고분자 매트릭스는 에폭시계 수지를 사용하였고, 카본계 재료는 graphite 분말과 carbon nanotube를 사용하였다. 이들 재료들을 일정한 비율로 혼합한 후 differential scanning calorimetry(DSC)를 사용하여 열분석 하였고, 그 결과를 Kissinger equation에 대입하여 경화반응 속도론을 연구하였다. 또한, 경화된 에폭시/탄소 복합재료의 전기전도도, 유리전이온도, 표면에너지 특성 등을 분석하였다.

• 접착 및 계면
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• 제11권4호
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• pp.168-173
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• 2010

할로겐 함유 난연 화합물은 인체에 무해하고 유해가스 발생이 없는 환경 친화적인 소재로 대체되어가고 있다. 반도체 소자의 밀봉용 소재로 사용되는 에폭시 수지 조성물도 친환경적인 소재로 만들기 위해서, 에폭시 수지의 자소화에 관해 많은 연구가 이루어지고 있다. 본 연구에서도 신규 에폭시 수지(E3)를 사용하여 할로겐계 화합물을 전혀 함유하지 않는 자소성 에폭시 수지 조성물을 제조하였다. 새로 만들어진 에폭시 수지 조성물(EMC-1)은 UL 난연 V0를 갖고 5 wt% 분해 온도가 $451.9^{\circ}C$로, 할로겐계 난연제나 삼산화안티몬 등을 첨가하지 않고도 난연성이 우수하고 열분해성, 내열성 등이 우수하게 나타나 친환경 소재로 적용할 수 있다.