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http://dx.doi.org/10.7735/ksmte.2012.21.2.297

A Study on the RFID Tag Package Epoxy Molding through Leak Detection  

Ban, Chang-Woo (서울과학기술대학교 나노아이티공학과)
Hong, Seok-Kee ((재)서울테크노파크)
Jang, Dong-Young (서울과학기술대학교 국제융합학부 MSDE 프로그램)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.21, no.2, 2012 , pp. 297-304 More about this Journal
Abstract
Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.
Keywords
RFID(Radio Frequency Identification); Packaging; Leak rate; Epoxy; Molding; Sealing;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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