Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
권호 표지
DOI QR코드

DOI QR Code

A Study on the RFID Tag Package Epoxy Molding through Leak Detection

기밀성 분석을 통한 RFID 태그 패키지 에폭시 몰딩 연구

  • 반창우 (서울과학기술대학교 나노아이티공학과) ;
  • 홍석기 ((재)서울테크노파크) ;
  • 장동영 (서울과학기술대학교 국제융합학부 MSDE 프로그램)
  • Received : 2011.10.20
  • Accepted : 2012.03.28
  • Published : 2012.04.15
Download PDF
⟨ Previous Next ⟩

Abstract

Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.

Keywords

References

  1. Khanna, P. K., Bhatnagar, S. K., and Gust, W., 1999, "Analysis of packaging and sealing techniques for microelectronics modules and recent advances," Microelectronic International, Vol. 16, No. 2, pp. 8-12.
  2. Kim, Y. H., Kim, Y. J., Kim, K. I., and Kim J. H., 2004, "A Capacitive Type Humidity Sensor Using a Polymide Film for Hermeticity Measurement of Micro Packages," J. of the Korean Sensors Society, Vol. 13, No. 4, pp. 132-136.
  3. Millar, S., Marc, P., Desmulliez, Y., and McCracken, S., 2010, "Leak Detection Methods for Glass Capped and Polymer sealed MEMS Packages," Symposium on Design Test Integration and Packaging of MEMS/MOEMS, pp. 10-15.
  4. John, C., and Pernicka, 2007, New Leak Test Method Increases Reliability of Hermetic Packages, Pernicka. co.
  5. Shinji, K., and Yushi, S., 2009, Materials for Advanced Packaging, Springer, Georgia Institute of Technology Atlanta, USA, pp. 339-364.
  6. HEMI SAGI, 2007, Advanced Leak Test Methods, ATC, Inc.
  7. Davy, J. G., 1975, "Calculation for Leak Rates of Hermetic Packages," IEEE Transactions on PARTS Hybrids and packaging, Vol. 11, No. 3, pp. 177-189. https://doi.org/10.1109/TPHP.1975.1135069
  8. Stanley, R., 1980, "A Rapid Cycle Method for Gross Leak Testing With the helium Leak Detector," IEEE Transactions on Components Hybrids and Manufacturing Technology, Vol. 3, No. 4, pp. 564-570. https://doi.org/10.1109/TCHMT.1980.1135652
  9. Richard, K., and Traeger, 1977, "Non-hermeticity of Polymeric Lid Sealants," IEEE Transactions on Parts, Hybrids, and Packaging, Vol. 13, No. 2, pp. 147-152. https://doi.org/10.1109/TPHP.1977.1135193
  10. Pal, N., 2001, "Accelerated Life Time Test Methods for New Package Technologies," 24th International Spring seminar in Electronics technology, Calimanesti-Caciulata(Romania), pp. 215-219.
  11. Yiping, W., 2004, "RFID Tag Manufacturing," Global SMT & Packaging, Vol. 4, No. 6, pp. 4-7.
  12. Ken, O., 2002, "Measurement of Water Absorption in Ball Grid Array Package," IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, pp. 164-168. https://doi.org/10.1109/6144.991189
  13. Hal, G., 2000, Hermeticity of Electronic Packages, William Andrew Publishing, LLC, Norwich, New York.
  14. An, B., Cai, X. H., and Chu, H. B., 2007, "Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive," 9th Int. IEEE CPMT Symp. on High Density Design, Packaging and Microsystem Integration, pp. 60-63.
  15. Robert, C. M., 1998, "Trends in IC Packaging and Advanced Assembly," Symposium on Electronic Packaging and Production, pp. 26-32.
  16. Imhoff, A. C., 1999, "Packaging Technologies for RFICs:Current Status and Future Trends," IEEE Radio Frequency Integrated Circuits Symposium, pp. 7-10.
  17. Kim, S. K., and Lim, E. M., 2011, "Dynamic Reliability of Board Level by Changing the Design Parameters of Flip Chips," Korean Society of Manufacturing Technology Engineers, Vol. 20, No. 5, pp. 559-563.

Cited by

  1. 패키징 소재 적용을 위한 RFID 태그 사이의 거리와 접촉 면적에 따른 인식률 분석 -제품의 수분함량을 중심으로- vol.23, pp.1, 2012, https://doi.org/10.20909/kopast.2017.23.1.1