1 |
Zwenger, C., and et al., "Silicon Wafer Integrated Fan-Out Technology Packaging," Advancing Microelectronics, Vol. 45(1), pp. 6-10, 2018.
|
2 |
Kim, W.G., "Cure Properties of Isocyanurate Type Epoxy Resin Systems for FO-WLP (Fan Out-Wafer Level Package) Next Generation Semiconductor Packaging Materials," J. of the Semiconductor & Display Technology, Vol. 18, pp. 19-26, 2019.
|
3 |
Sasajima, H., and et al., "New Development Trend of Epoxy Molding Compound for Encapsulation Semiconductor Chips", in Materials for Advanced Packaging, Wong, C.P. Ed., Chap. 9, pp 373-419, 2017.
|
4 |
Ueno, K., and et al., "Development of Liquid, Granule and Sheet Type Epoxy Molding Compounds for Fan-Out Wafer Level Package", Proceedings of 2017 IEEE 67th Electronic Components and Technology Conference, pp.285-291, 2017.
|
5 |
Kim, W.G., and Chun, H., "Cure Properties of Naphthalene-Base Epoxy Resin Systems with Hardeners and Latent Catalysts for Semiconductor Packaging Materials", Molecular Crystals and Liquid Crystals, Vol.579, pp.39-49,
DOI
|
6 |
Ogura, I. and Takahashi, Y., "Multi-Functional Epoxy Resins Performing High Thermal Resistance with Good Flow-ability based on Dimeric Naphthols", High Performance Polymers, Vol.22 (7), pp.834-847.
DOI
|
7 |
Chun, H. and et al., "The Naphthalene Type Epoxy Dimers and a method for the preparation thereof", Korea Patent 10-1264607(Registered Patent).
|
8 |
Chun, H. and et al., "The Naphthalene Type Epoxy Resins and the Epoxy Resin Compositions with them", Korea Patent 10-1189185(Registered Patent).
|
9 |
Kim, W.G., and Lee, J.Y., "Contributions of the Network Structure to the Cure Kinetics of Epoxy Resin Systems According to the Change of Hardeners", Polymer, Vol.43, pp.5713-5722, 2002.
DOI
|
10 |
Ryu, J.H., Choi, K.S., and W.G. Kim, "Latent Catalyst Effects in Halogen-Free Epoxy Molding Compounds for Semiconductor Encapsulation", J. Applied Polymer Science, Vol.96, pp.2287-2299, 2005.
DOI
|
11 |
Kim, W.G., "Cure Characteristics of Ethoxysilyl Bisphenol A Type Epoxy Resin Systems for Next Generation Semiconductor Packaging Materials," J. of the Semiconductor & Display Technology, Vol. 16, pp. 19-26, 2017.
|
12 |
Kim, W.G., and Chun, H., "Cure Properties of Alkoxysilylated Epoxy Resin Systems with Hardeners for Semiconductor Packaging Materials", Molecular Crystals and Liquid Crystals, Vol.636, pp.107-116.
DOI
|