• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.297-304
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• 2012

Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Carbon letters
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• v.15 no.1
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• pp.32-37
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• 2014

Multi-walled carbon nanotube (MWCNT)/epoxy composites are prepared by a vacuum assisted resin transfer molding (VARTM) method. The mechanical properties, fracture surface morphologies, and thermal stabilities of these nanocomposites are evaluated for epoxy resins with various amounts of MWCNTs. Composites consisting of different amounts of MWCNTs displayed an increase of the work of adhesion between the MWCNTs and the matrix, which improved both the tensile and impact strengths of the composites. The tensile and impact strengths of the MWCNT/epoxy composite improved by 59 and 562% with 0.3 phr of MWCNTs, respectively, compared to the epoxy composite without MWCNTs. Thermal stability of the 0.3 phr MWCNT/epoxy composite increased compared to other epoxy composites with MWCNTs. The enhancement of the mechanical and thermal properties of the MWCNT/epoxy nanocomposites is attributed to improved dispersibility and strong interfacial interaction between the MWCNTs and the epoxy in the composites prepared by VARTM.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.10a
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• pp.64-67
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• 1995

Transfer Molding is currently the most widely used process for encapsulation integrated circuits(;IC). Although the process has been introduced over 20 years ago, generating billions of parts each year, it is far from being optimized. With each new mold, epoxy mold, epoxy mold compound, and lead-frame, lengthy period and expensive qualification runs have to be performed to minimized defects ranging from wire sweep, incomplete fill, and internal voids etc. This studies describes how simulation can be applied to transfer molding to yield acceptable design and processing parameter. The non-isothermal filling of non-newtonian reactive epoxy molding compound(;EMC) in a multi-cavity mold is analyzed. Sensitivity analysis is conducted to investigate the influence of process deviations on the final molded profile. This study trend is carried out by following some heuristic process guidelines.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Journal of Adhesion and Interface
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• v.12 no.4
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• pp.138-143
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• 2011

Recently epoxy resin compositions having backbone of novolac derivatives with biphenylene compounds have been used as materials of eco-freindly EMC (Epoxy Molding Compound), because the cured epoxy resin compositions show the self-extinguishing without flame retardant additives. In this study, epoxy resin compositions were prepared and cured using novolac derivateves with biphenylene. Their propeties - structures of phenol derivatives and reactivity, thermal expansion, modulus, and thermal degradation - were obtained by DSC, DMA, TMA, TGA method. When both epoxy resin and hardenr had the biphenyl novolac structure, epoxy resin compositions showed low thermal expansion, good mechanical property, and combustion retardation.

• Proceedings of the Korean Society of Computer Information Conference
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• 2011.06a
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• pp.351-354
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• 2011

The electrical degradation phenomena of epoxy composites to be used as a molding material for transformers were studied. The electrets were first manufactured by applying high voltages to five kinds of specimens given a mixing rate, and then TSC(Thermally Stimulated Current) values at the temperature range of $-160{\sim}200[^{\circ}C]$ were measured from a series of experiments. The behaviour of carrier and its origin in epoxy composites were examined, respectively. And various effects of electrical degradation on epoxy composites were also discussed in this study.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.144.2-144.2
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• 2010

Bipolar plate는 고분자 전해질 연료전지(PEMFC)에서 핵심 부품 중의 하나이고, 전해질 막이나 촉매 등에 비해서는 상대적으로 쉽게 접근할 수 있기 때문에 많은 연구가 수행되고 있다. Bipolar plate를 제조하는 기술은 크게 금속을 프레스 가공하는 방법, graphite 판을 직접 밀링하는 방법 및 고분자/카본계의 press molding 법 등 3가지로 분류되며, 본 연구에서는 3번째 방법에 의해서 bipolar plate를 대량 생산하는 방법에 대해 연구하였다. 고분자 매트릭스는 에폭시계 수지를 사용하였고, 카본계 재료는 graphite 분말과 carbon nanotube를 사용하였다. 이들 재료들을 일정한 비율로 혼합한 후 differential scanning calorimetry(DSC)를 사용하여 열분석 하였고, 그 결과를 Kissinger equation에 대입하여 경화반응 속도론을 연구하였다. 또한, 경화된 에폭시/탄소 복합재료의 전기전도도, 유리전이온도, 표면에너지 특성 등을 분석하였다.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.168-173
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• 2010

Flame retardant halogen containing compounds have been replaced as environmentally safe material which does not contain hazardous materials generating toxic gas. Self-extinguishing epoxy resin compositions have been studied in order to produce eco-friendly epoxy molding compound, which is used as insulating materials in semiconductor. We developed self-extinguishing epoxy resin compositions which do not contain halogen compounds with new epoxy resin (E3). The new epoxy molding compound (EMC-1) showed high flame resistance (UL-V0) and high thermal resistance ($451.9^{\circ}C$ at 5 wt% loss) enough to use as eco-friendly material.