• 제목/요약/키워드: de-embedding

검색결과 45건 처리시간 0.043초

RF MEMS 인덕터의 특성 추출을 위한 De-embedding방법 (Accurate De-embedding Scheme for RF MEMS Inductor)

  • 이영호;김용대;김지혁;육종관
    • 한국전자파학회:학술대회논문집
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    • 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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    • pp.163-167
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    • 2003
  • In this paper, an air-suspension type RF MEMS inductor is fabricated, and an appropriate de-embedding scheme for 3-dimenstional MEMS structure is applied and verified with inductance calculation algorithm. With the presented de-embedding method, parasitics from contanct pads and feeding lines are effectively and accurately de-embedded using open and short calibration procedure, and only spiral and posts can be characterized as a high-Q inductor structure. The validity of the de-embedding method is verified by the comparison of the measured and calculated inductances of two 1.5 and 2.5 turn square spiral inductors. The open-short de-embedded inductance error is below 5% each case in comparison with the calculated value based on H.M. Greenhouse's algorithm.

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De-embedding 방법을 이용한 Pogo Pin의 신호 전달 특성 분석 (Characteristic Analysis of Signal Transmission for Pogo Pin using De-embedding Method)

  • 류대현;김진희;배현주;푸보;나완수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2011년도 제42회 하계학술대회
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    • pp.1668-1669
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    • 2011
  • 본 논문에서는 Pogo Pin의 신호 전달 특성을 Ansys사의 Full wave simulation tool(HFSS)를 사용하여 분석하였고, 측정을 위해서 필요한 interface(Guide PCB)의 특성은 2-port de-embedding 방법을 이용하여 제거하였다. Guide PCB의 특성이 제거된 Pogo Pin만의 시뮬레이션 결과와 circuit simulator인 Agilent사의 ADS를 사용하여 Guide PCB의 특성을 de-embedding한 결과를 비교 검증하였고, Pogo Pin의 시뮬레이션 결과와 PCB의 특성을 de-embedding한 결과가 0~8 GHz까지 일치하는 것을 확인하였다.

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A "Thru-Short-Open" De-embedding Method for Accurate On-Wafer RF Measurements of Nano-Scale MOSFETs

  • Kim, Ju-Young;Choi, Min-Kwon;Lee, Seong-Hearn
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권1호
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    • pp.53-58
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    • 2012
  • A new on-wafer de-embedding method using thru, short and open patterns sequentially is proposed to eliminate the errors of conventional methods. This "thru-short-open" method is based on the removal of the coupling admittance between input and output interconnect dangling legs. The increase of the de-embedding effect of the lossy coupling capacitance on the cutoff frequency in MOSFETs is observed as the gate length is scaled down to 45 nm. This method will be very useful for accurate RF measurements of nano-scale MOSFETs.

A De-Embedding Technique of a Three-Port Network with Two Ports Coupled

  • Pu, Bo;Kim, Jonghyeon;Nah, Wansoo
    • Journal of electromagnetic engineering and science
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    • 제15권4호
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    • pp.258-265
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    • 2015
  • A de-embedding method for multiport networks, especially for coupled odd interconnection lines, is presented in this paper. This method does not require a conversion from S-parameters to T-parameters, which is widely used in the de-embedding technique of multiport networks based on cascaded simple two-port relations, whereas here, we apply an operation to the S-matrix to generate all the uncoupled and coupled coefficients. The derivation of the method is based on the relations of incident and reflected waves between the input of the entire network and the input of the intrinsic device under test (DUT). The characteristics of the intrinsic DUT are eventually achieved and expressed as a function of the S-parameters of the whole network, which are easily obtained. The derived coefficients constitute ABCD-parameters for a convenient implementation of the method into cascaded multiport networks. A validation was performed based on a spice-like circuit simulator, and this verified the proposed method for both uncoupled and coupled cases.

Substrate 효과를 고려한 De-embedding Model (De-embedding Model including Substrate Effects)

  • 황의순;이동익;정웅
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1999년도 하계종합학술대회 논문집
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    • pp.895-898
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    • 1999
  • Recently, small signal modeling of CMOS device becomes more difficult because the design rule goes into deep submicron. De-embedding of substrate parameters is important in order to use CMOS devices at RF frequencies. In this paper, we suggest a new de-embedding model with refined physical meaning and accuracy. In GaAs IC’s, the substrate is almost an insulator but Si substrate has the semiconducting characteristics. It offers some troubles if it is treated like GaAs substrate. The conducting substrate is modeled with five resistances, which leads to very accurate modeling so long as the pad layout is symmetrical. Frequency range is up to 39㎓ and fitting accuracy is as small as 0.00037 on least square errors.

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1-포트 측정을 기반으로 한 8-Term Error De-Embedding 기법 (De-Embedding Method Using 8-Term Error Based on 1-Port Calculation)

  • 송민수;김광호;나완수
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2015년도 제46회 하계학술대회
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    • pp.125-126
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    • 2015
  • 통신 시스템에서의 더 늘어난 대역폭(Band Width)의 수요로 인해 집적회로(Integrated Circuit)에서 더 높은 동작 주파수(Operating Frequency)를 필요로 하게 되었다. 고주파 영역에서는 SRF(Self Resonance Frequency) 문제와 소자 값의 정확성(Accuracy)에 대한 문제 때문에 정수소자(Lumped Element)를 이용하여 해석을 할 수 없으며 이로 인하여 어떠한 회로의 전기적 특성을 평가함에 있어서 전송선로(Transmission Line)를 이용하여 해석을 하는 것은 중요한 역할을 하게 되었다. 이러한 해석을 위해 순수한 내부 특성을 얻기 위하여 디 임베딩(De-Embedding)이라는 기법이 사용되고 있으나, 알려진 몇 가지의 방법들은 인터커넥터 부분을 완벽히 나타내지 못한다. 따라서 본 논문에서는 1-Port 측정을 기반으로 한 8-Term Error을 이용한 디 임베딩(De-Embedding) 방법을 이용하여 넓은 주파수 영역에서의 교정 값을 얻는 방법에 대하여 소개하고자 한다.

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연속적 차분 확장 기반 가역 DNA 워터마킹 (Consecutive Difference Expansion Based Reversible DNA Watermarking)

  • 이석환;권기룡
    • 전자공학회논문지
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    • 제52권7호
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    • pp.51-62
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    • 2015
  • 대용량의 DNA 정보 저장, DNA 서열 저작권 보호를 위한 DNA 워터마킹, 및 비밀 통신을 위한 DNA 스테가노그라픽에 대한 관심이 증대되면서, 원본 DNA 서열의 기능 유지와 복원이 가능한 가역성 DNA 워터마킹이 필요하다. 본 논문에서는 비부호영역 DNA 서열을 이용한 DE(Difference expansion) 기반 가역 DNA 워터마킹 기법을 제안한다. 가역 DNA 워터마킹에서는 생물학적 기능 변경이 없고, 문자 형태의 서열 내에 대용량의 데이터를 은닉하여야 하며, 원본 DNA 서열이 복원되어야 한다. 제안한 방법에서는 문자 서열을 십진수 형태의 수치계수로 변환한 다음, 인접 수치 계수 쌍의 DE 기반 다중비트 은닉 방법(DE-MBE, DE based multiple bits embedding)과 이전 은닉 수치계수를 예측으로 한 연속 DE 기반 다중비트 은닉 방법들(C-DE-MBE, consecutive DE based multiple bits embedding)에 의하여 워터마크가 은닉된다. 은닉 과정에서는 워터마크된 서열에 의하여 부호영역을 나타내는 허위 시작코돈 발생을 방지하기 위하여 비교 탐색을 수행한다. 실험 결과로부터 제안한 방법이 기존 방법에 비하여 높은 은닉 용량을 가지며, 허위 시작코돈이 발생되지 않으며, 기준 서열없이 원본 DNA 서열이 복원됨을 확인하였다.

EMBEDDING RIEMANNIAN MANIFOLDS VIA THEIR EIGENFUNCTIONS AND THEIR HEAT KERNEL

  • Abdalla, Hiba
    • 대한수학회보
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    • 제49권5호
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    • pp.939-947
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    • 2012
  • In this paper, we give a generalization of the embeddings of Riemannian manifolds via their heat kernel and via a finite number of eigenfunctions. More precisely, we embed a family of Riemannian manifolds endowed with a time-dependent metric analytic in time into a Hilbert space via a finite number of eigenfunctions of the corresponding Laplacian. If furthermore the volume form on the manifold is constant with time, then we can construct an embedding with a complete eigenfunctions basis.

Adaptive reversible image watermarking algorithm based on DE

  • Zhang, Zhengwei;Wu, Lifa;Yan, Yunyang;Xiao, Shaozhang;Gao, Shangbing
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • 제11권3호
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    • pp.1761-1784
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    • 2017
  • In order to improve the embedding rate of reversible watermarking algorithm for digital image and enhance the imperceptibility of the watermarked image, an adaptive reversible image watermarking algorithm based on DE is proposed. By analyzing the traditional DE algorithm and the generalized DE algorithm, an improved difference expansion algorithm is proposed. Through the analysis of image texture features, the improved algorithm is used for embedding and extracting the watermark. At the same time, in order to improve the embedding capacity and visual quality, the improved algorithm is optimized in this paper. Simulation results show that the proposed algorithm can not only achieve the blind extraction, but also significantly heighten the embedded capacity and non-perception. Moreover, compared with similar algorithms, it is easy to implement, and the quality of the watermarked images is high.

Chip Impedance Evaluation Method for UHF RFID Transponder ICs over Absorbed Input Power

  • Yang, Jeen-Mo;Yeo, Jun-Ho
    • ETRI Journal
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    • 제32권6호
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    • pp.969-971
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    • 2010
  • Based on a de-embedding technique, a new method is proposed which is capable of evaluating chip impedance behavior over absorbed power in flip-chip bonded UHF radio frequency identification transponder ICs. For the de-embedding, four compact co-planar test fixtures, an equivalent circuit for the fixtures, and a parameter extraction procedure for the circuit are developed. The fixtures are designed such that the chip can absorb as much power as possible from a power source without radiating appreciable power. Experimental results show that the proposed modeling method is accurate and produces reliable chip impedance values related with absorbed power.