• Title/Summary/Keyword: crystalline Si film

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GaOOH 선구체의 스핀코팅에 의한 GaN 박막의 성장 (Growth of GaN Thin-Film from Spin Coated GaOOH Precursor)

  • 이재범;김선태
    • 한국재료학회지
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    • 제17권1호
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    • pp.1-5
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    • 2007
  • GaN thin fan were grown by spin coated colloidal GaOOH precursor. Polycrystalline GaNs with crystalline size of $10{\sim}100nm$ were grown on $SiO_2$ substrate. The shape of crystallite above $900^{\circ}C$ had the hexagonal plate and column type. X-ray diffraction patterns for them correspond to those of the hexagonal wurtzite GaN. With increasing droplets. i.e, thickness of deposited layers, XRD intensity increased. PL (photoluminescence) spectrum consisted with an weak near band-edge emission at 3.45 eV and a broad donor-acceptor emission band at 3.32 eV. From the low temperature PL measurement on GaN grown at $800^{\circ}C$ that the shallow donor-acceptor recombination induced emission was more intense than the near band-edge excitonic emission.

An Ultra Low-Power and High-Speed Down-Conversion Level Shifter Using Low Temperature Poly-Si TFTs for Mobile Applications

  • Ahn, Soon-Sung;Choi, Jung-Hwan;Choi, Byong-Deok;Kwon, Oh-Kyong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1279-1282
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    • 2006
  • An ultra low-power down-conversion level shifter using low temperature poly-crystalline silicon thin film transistors is proposed for mobile applications. The simulation result shows that the power consumption of the proposed circuits is only 17% and the propagation delay is 48% of those of the conventional cross-coupled level shifter without additional area. And the measured power consumption is only 21% of that of the crosscoupled level shifter.

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마이크로머시닝 기술을 이용한 압전형 마이크로스피커 (Piezoelectric Microspeaker by Using Micromachining Technique)

  • 서경원;이승환;유금표;민남기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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    • pp.45-46
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    • 2005
  • The piezoelectric ZnO thin films were deposited onto Al/Si substrate in order to figure out the crystalline and the residual stress of deposited films. As the $Ar/O_2$ gas ratio is increased, c-axis orientation of deposited films is significantly enhanced and also the residual stresses of ZnO films are all compressive. They are decreased from -1.2 GPa to -950 MPa as the $Ar/O_2$ gas ratio is increased. A diaphragm-based piezoelectric microspeaker fabricated on ONO films shows about 14 mPa output pressure at 1 kHz with $8V_{peak-to-peak}$.

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국내 신재생에너지기술개발 현황 및 정책동향 (The R&D policy and status of New and Renewable Energy in Korea)

  • 이창구;안종득;김희정;조용희
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 추계학술대회 논문집
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    • pp.341-345
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    • 2009
  • 최근 전세계적으로 신재생에너지에 대한 관심과 투자가 증폭되고 있으며, 우리나라에서도 그 간의 지속적인 연구개발 지원에 힘입어 국산기술 확보 및 산업화가 점차적으로 이루어지고 있는 것으로 분석되고 있다. 더욱이 신정부에서는 국정지표인 녹생성장의 실현방안으로 신재생에너지에 대한 지원을 대폭 확대하고 있어 관련 기술개발 투자도 지속적으로 확대될 것으로 보인다. 본 고에서는 이러한 국내 신재생에너지 기술개발 관련 정책 및 기술개발 동향에 대하여 알아보고, 특히 급속한 성장세 속에 2008년 전세계 태양전지생산량이 7.9GW1) 에 달한 태양광 분야는 우리나라가 강점을 갖고 있는 반도체, LCD 기술과 유사하여 국내의 축적된 기술과 인프라를 활용할 경우 조기에 세계수준의 기술력을 확보할 것으로 기대되고 있으며, 정부에서는 태양광 분야를 수출전략산업화 하기위해 집중적인 투자에 나서고 있다. 이러한 상황에서 그간의 기술개발 현황, 실적 및 향후 전망 등에 대하여 살펴보고자 한다.

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단결정 실리콘 TFT 제작을 위한 SLS 공정 (Sequential Lateral Solidification Process for Fabrication of Crystalline Silicon Thin Film Transistor)

  • 이윤재;박정호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 추계학술대회 논문집 학회본부 C
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    • pp.461-463
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    • 2000
  • This paper presents a low temperature excimer-laser-crystallization that produces directionally solidified microstructure in Si thin films. The process involves (1) a complete melting of selected area via irradiation through a patterned mask. and (2) a precisely controlled pulse translation of the sample with respect to the mask over a distance shorter than the superlateral growth(SLG) distance. (3) lateral growth extended over a number of iterative steps. Grains that grow continuously to the vertical direction were demonstrated. We discuss sequential lateral solidification principle, experiment.

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RF 스퍼터를 이용하여 ZnO 증착 시 기판의 냉각율이 박막의 c-축 배향성에 미치는 영향 (Effects of Cooling Rate of Pre-heated Substrate on C-Axis Orientation of ZnO Prepared by RF Sputter Deposition)

  • 박성현;이능헌
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제55권12호
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    • pp.560-564
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    • 2006
  • ZnO thin films were prepared by RF magnetron sputter deposition on p-Si(100) wafer with various cooling rates of substrate temperature such as the substrates were pre-heated to $400^{\circ}C$ before the deposition and then cooled down naturally or slowly to $300^{\circ}C,\;200^{\circ}C,\;100^{\circ}C$, and R.T. by the temperature controller during the deposition. Crystalline and micro-structural characteristics of the films were investigated by XRD and SEM. ZnO films which cooled down naturally or slowly by the temperature controller during the deposition, especially the film were deposited with cooling down from $400^{\circ}C\;to\;200^{\circ}C$ slowly. showed the most outstanding c-axis preferred orientation.

Growth and Characteristics for $ZnGa_2Se_4$ thin film

  • Hong, Kwang-Joon;Lee, Sang-Youl
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.136-137
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    • 2006
  • The stochiometric mix of evaporating materials for the $ZnGa_2Se_4$ single crystal thin films were prepared from horizental furnace. To obtains the single crystal thin films, $ZnGa_2Se_4$ mixed crystal were deposited on throughly etched Si(100) by the Hot Wall Epitaxy (HWE) system. The temperates of the source and the substrate were $590^{\circ}C$ and $450^{\circ}C$, respectively. The crystalline structure of single crystal thin films was investigated by the double crystal X-ray diffraction(DCXD). Hall effect on this sample was measured by the method of van der Pauw and studied on carrier density and mobility dependence on temperature.

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열처리조건이 LaNiO3 졸-겔 박막의 배향성과 구조 및 저항성에 미치는 영향 (Effect of Heat-treatment Conditions on Orientation, Structures and Resistances of LaNiO3 Thin Films by Sol-gel process)

  • 박민석;김대영;서병준;김강언;정수태
    • 한국전기전자재료학회논문지
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    • 제17권8호
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    • pp.859-865
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    • 2004
  • LaNiO$_3$(LNO) thin films on (100) Si substrates are prepared by sol-gel method on heat treatment conditions, such as heat transfer direction, pyrolysis and annealing process, and annealing temperatures and times. The effect of heat treatment conditions on the (100) orientations, structures and resistances of the thin films are investigated by XRD, SEM(FESEM), and a lout probe method. Highly (100) orientation factor(0.97), a pseudocubic crystalline structure with a dense and uniform microstructure could be formed by the following conditions: 1) the heat transfer direction is from Si substrate to LNO, 2) the pyrolysis and annealing process are alternated, 3) the annealing temperature is $650^{\circ}C$ and 4) the annealing times is 3 minutes. The sheet resistance of thin films decreased with increasing of a annealing temperature and time, and a number of coating.

Bonded SOI wafer의 top Si과 buried oxide layer의 결함에 대한 연구 (Characteristic Study for Defect of Top Si and Buried Oxide Layer on the Bonded SOI Wafer)

  • 김석구;백운규;박재근
    • 한국재료학회지
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    • 제14권6호
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    • pp.413-419
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    • 2004
  • Recently, Silicon On Insulator (SOI) devices emerged to achieve better device characteristics such as higher operation speed, lower power consumption and latch-up immunity. Nevertheless, there are many detrimental defects in SOI wafers such as hydrofluoric-acid (HF)-defects, pinhole, islands, threading dislocations (TD), pyramid stacking faults (PSF), and surface roughness originating from quality of buried oxide film layer. Although the number of defects in SOI wafers has been greatly reduced over the past decade, the turn over of high-speed microprocessors using SOI wafers has been delayed because of unknown defects in SOI wafers. A new characterization method is proposed to investigate the crystalline quality, the buried oxide integrity and some electrical parameters of bonded SOI wafers. In this study, major surface defects in bonded SOI are reviewed using HF dipping, Secco etching, Cu-decoration followed by focused ion beam (FIB) and transmission electron microscope (TEM).

수소분리용 Pd-Cu 합금 분리막의 Cu Reflow 영향 (The Effect of Cu Reflow on the Pd-Cu Alloy Membrane Formation for Hydrogen Separation)

  • 문진욱;김동원
    • 한국표면공학회지
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    • 제39권6호
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    • pp.255-262
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    • 2006
  • Pd-Cu alloy membrane for hydrogen separation was fabricated by sputtering and Cu reflow process. At first, the Pd and Cu was continuously deposited by sputtering method on oxidized Si support, the Cu reflow process was followed. Microstructure of the surface and permeability of the membrane was investigated depending on various reflow temperature, time, Pd/cu composition and supports. With respect to our result, Pd-Cu thin film (90 wt.% Pd/10 wt.% Cu) deposited by sputtering process with thickness of $2{\mu}m$ was heat-treated for Cu reflow The voids of the membrane surface were completely filled and the dense crystal surface was formed by Cu reflow behavior at $700^{\circ}C$ for 1 hour. Cu reflow process, which is adopted for our work, could be applied to fabrication of dense Pd-alloy membrane for hydrogen separation regardless of supports. Ceramic or metal support could be easily used for the membrane fabricated by reflow process. The Cu reflow process must result in void-free surface and dense crystalline of Pd-alloy membrane, which is responsible for improved selectivity oi the membrane.