• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.51 no.6
• /
• pp.271-277
• /
• 2002

In this paper, a MEMS silicon package is newly designed, fabricated for HMIC, and characterized for microwave and millimeter-wave device applications. The proposed package is fabricated by using two high resistivity silicon substrates and surface/bulk micromachining technology. It has a good performance characteristic such as -20㏈ of $S_11$/ and -0.3㏈ of $S_21$ up to 20㎓, which is useful in microwave region. It has also better heat transfer characteristics than the commonly used ceramic package. Since the proposed silicon MEMS package is easy to fabricate and wafer level chip scale packaging is also possible, the production cost can be much lower than the ceramic package. Since it will be a promising low-cost package for mobile/wireless applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.5
• /
• pp.415-420
• /
• 2007

Generally, a diode package consists of the synthetic resin that has good durability but low thermal conductivity. The surface mounted type fast recovery diode was fabricated by using ceramic package. Its main manufacture processes are composed of soldering, sillicon coating and side termination. And it has various advantages that diode is small, easy manufacture and fast cooling. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5.28 ns, 1322 V, 1.08 V, $0.45\;{\mu}A$, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.26 no.4
• /
• pp.330-334
• /
• 2013

We developed a package of remote phosphor structure having blue LED chips and phosphors physically separated, and the characteristics were evaluated according to different classifications of phosphor coatings. Remote phosphor was produced by screen printing coating on glass substrate with phosphor content rated paste and heat treatment. After mounting Remote phosphor, which has been classified according to number of coatings, on top of blue LED chips, luminous flux, luminous efficacy, CCT and CRI were measured. The measurement results showed the most suitable characteristics of white LED package as a general light source when the content rate of phosphor in Remote phosphor was 80 wt.% with 3 layers of coatings and thickness over $12{\mu}m$.

• Journal of Industrial Technology
• /
• v.24 no.A
• /
• pp.9-15
• /
• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• Journal of Sensor Science and Technology
• /
• v.25 no.3
• /
• pp.173-177
• /
• 2016

Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.89-94
• /
• 2019

Glass base sealant is required as a ceramic-ceramic joining material between α-alumina insulation cap and β-alumina electrolyte tube in the development of NaS battery cell package for electrical energy storage system. The fabrication of glass frit by thermal quenching method, phase analysis, particle size analysis, coefficient of thermal expansion and surface roughness according to the glass compositions were analyzed for the fabrication of glass sealing paste for ceramic-ceramic joining. Also, a new evaluation method of the adhesion strength of glass sealant at the small area in ceramic-ceramic joining component was proposed using conventional Dage bond tester that was used to measure the adhesion of solder ball joint.

• Journal of the Korean Ceramic Society
• /
• v.26 no.6
• /
• pp.829-835
• /
• 1989

Devitrifing solder glasses in a specific group of glass ceramic materials are extensively used in hermetically sealing alumina electronics packages. Preferred frit glass compositions of this study consist of 37~40wt% PbO, 35~40wt% ZnO, 18~20wt% B2O3, 1~3wt% SiO2, 0~6wt% TiO2. The coated frit glasses crystallize during firing and form a strong hermetic seal. DTA and X-ray diffraction were used to characterize crystallization of the glass frit. Frit seal containing 2wt% TiO2 has crystallization temperature of 550~57$0^{\circ}C$ with surface nucleation. Frit seal containing 6wt% TiO2 has crystallization temperature of 515~5$25^{\circ}C$ with bulk nucleation, and the main crystalline phase was perovskite lead titanate having minus expansion coefficient. The average activation energy for the crystallization calculated from Ozawa equation was 65$\pm$10kcal/mol.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.04a
• /
• pp.9-25
• /
• 2001

Fairchild has been developing a new class IPM called SPM consisting of dramatic Packaging technology to achieve the lowest cost rind better performance for low power home appliances and industrial AC drive applications. The first Fairchild SPM development with IGBT 600V/15A for washing machine application started in 1999 and was completed successfully. Fairchild SPMs are going to be the best solution for low power inverter-driven AC drive system after 2001. The new SPM Packages like SPM ∥ and SPIM for the next generation IPM with the highest competitiveness (cost & performance) shall be continuouslly developed.

• ETRI Journal
• /
• v.39 no.6
• /
• pp.866-873
• /
• 2017

We propose a multilayered-substrate-based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost-effective, low-temperature co-fired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity of the multilayered substrate. Because the height of the pad on the top plane of the die and the signal line on the substrate are the same, the length of the bond wires can be shortened. A large number of thermal vias with a high thermal conductivity are embedded in the multilayered substrate to increase the heat dissipation rate of the package. The packaged silicon carbide Schottky barrier diode satisfies the reliability testing of a high-temperature storage life and temperature humidity bias. At $175^{\circ}C$, the forward current is 7 A at a forward voltage of 1.13 V, and the reverse leakage current is below 100 lA up to a reverse voltage of 980 V. The measured maximum reverse current ($I_{RM}$), reverse recovery time ($T_{rr}$), and reverse recovery charge ($Q_{rr}$) are 2.4 A, 16.6 ns, and 19.92 nC, respectively, at a reverse voltage of 300 V and di/dt equal to $300A/{\mu}s$.

• Journal of the Institute of Electronics Engineers of Korea TC
• /
• v.39 no.2
• /
• pp.101-107
• /
• 2002

High performance packages must protect circuits from the internal leakaged-electromagnetic fields as well as the surrounding. In this paper, we characterized an electromagnetically-shielded millimeter-wave ceramic package from 20 to 40 ㎓ using FEM(Finite Element Method). From these calculation results, the parasitic resonance is observed at 33.4 ㎓. We use metal-filled via-holes at the ceramic package walls and resonance has been suppressed in a frequency range from 20 to 40 ㎓. These calculation results will be helpful for MMIC packaging using electromagnetically-shielded millimeter-wave ceramic packages.