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Analysis and Suppression of Parasitic Resonance in Millimeter-wave Ceramic Packages  

Seo, Jae-Ok (Dept.of Electronics Engineering, Ajou University)
Kim, Jin-Ryang (Dept.of Electronics Engineering, Ajou University)
Lee, Hae-Yeong (Dept.of Electronics Engineering, Ajou University)
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Abstract
High performance packages must protect circuits from the internal leakaged-electromagnetic fields as well as the surrounding. In this paper, we characterized an electromagnetically-shielded millimeter-wave ceramic package from 20 to 40 ㎓ using FEM(Finite Element Method). From these calculation results, the parasitic resonance is observed at 33.4 ㎓. We use metal-filled via-holes at the ceramic package walls and resonance has been suppressed in a frequency range from 20 to 40 ㎓. These calculation results will be helpful for MMIC packaging using electromagnetically-shielded millimeter-wave ceramic packages.
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Times Cited By KSCI : 2  (Citation Analysis)
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1 L. P. B. Katehi, 'The role of EM modeling in integrated packaging,' IEEE AP-S DIg., pp. 1005-1008, July. 1993   DOI
2 Hao-Hui Chen and Shyh-Jong Chung, 'Analysis of a Partially Sealed Package for Microstrip-Line Circuits,' IEEE Trans. on Microwave Theory and Techniques, Vol. 46, No. 12, pp.2124-2130, DEC. 1998   DOI   ScienceOn
3 Robert W. Jackson and Zhaoyang Wang, 'Circuit Based Model for Coupling Between MMICs in Multi-Chip Assemblies,' IEEE MTT-S Digest, No. III, pp. 1377-1380, 1997   DOI
4 I. D. Robertson, MMIC Design, IEEE, London, UK, 1995
5 HFSS (High Frequency Structure Simulator), ver 7.0, Ansoft
6 George E. Ponchak, Donghoon Chun Jong-Gwan Yook, and Linda P. B. Katehi, 'Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages,' IEEE Trans. on Advanced Packaging, Vol. 24, No. 1, pp. 76-80, FEB. 2001   DOI   ScienceOn
7 조남태, 심광보, 이선우, 구기덕, '고주파용 저온 동시소성 세라믹(LTCC) 칩 커플러 제조 : I. 전극형성에 대한 결합제 분해공정의 영향,' Journal of the Korean Ceramic Society, Vol. 36, No. 6, pp. 583-589, 1999   과학기술학회마을
8 S. Nelson, M. Youngblood, J. Pavio, B. Larson, R. Kottman, 'Optimum microstrip interconnects,' Proc. IEEE MITT-s Dig., Boston, MA, pp. 1071-1074, 1991   DOI
9 A Fathy, V. Pendrick, G.Ayers, B. Geller, Y. Narayan, B. Thaler, H. D. Chen, M. J. Libertore, J. Prokop, K. L. Choi, M. Swaminathan, 'Design of Embedded Passive Components in Low-temperature Cofired Ceramic on Metal(LTCC-M) Technology,' IEEE MTT-S Digest, Vol. III, pp. 1281-1284, 1998   DOI
10 Dipak Ceramic Package, Dielectric Laboratories, INC.
11 Rao R Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, Microelectronics Packaging Handbook, CHAPMAN & HILL Corporation
12 Jong-Gwan Yook, Linda P. B. Katehi, Rainee N Simons, and Kurt A. Shalkhauser,'Experimental and Theoretical Study of Parasitic Leakage/Resonance in a K/KA-Band MMIC Package,' IEEE Trans. on Microwave Theory and Techniques, Vol. 44, No. 12, pp. 2403-2410, DEC. 1996   DOI   ScienceOn
13 Tsugumichi Shibata, Shunji Kimura, Hideaki Kimura, Yuhki Imai, Yohtaro Umeda, Yukio Akazawa, '60Ghz-Bandwidth Distributed Baseband Amplifier IC in a Package Optimized for Isolation,' IEEE International Solid-State Circuit Conference, 1994   DOI
14 Jmaes Schellenberg, 'High-Efficiency, Packaged Ka-Band MMIC Operating at 24 Volts,' IEEE MTT-S Digest, Vol. 2, pp. 577-580, 1998   DOI
15 T. Satoh, T. Shimura, S. Ichikawa, A. Betti-Berutto, C. Poledrelli, Y. Furukawa, Y. Hasegawa, S. Kuroda and J. Fukaya, 'A Compact PA MMIC Module for K-Band High-Speed Wireless Systems,' IEEE MIT-S Digest, Vol. III, pp. 1333-1336, 2000   DOI