Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Cost-effective Power Module Package using Leadframe and Ceramic substrate

  • Jeon, O-S (Package Development Group/ Fairchild Korea) ;
  • Jeun, G-Y (Package Development Group/ Fairchild Korea) ;
  • Park, S-Y (Package Development Group/ Fairchild Korea) ;
  • Lee, K-H (Package Development Group/ Fairchild Korea) ;
  • Kim, B-G (Package Development Group/ Fairchild Korea)
  • Published : 2001.04.01
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Abstract

Fairchild has been developing a new class IPM called SPM consisting of dramatic Packaging technology to achieve the lowest cost rind better performance for low power home appliances and industrial AC drive applications. The first Fairchild SPM development with IGBT 600V/15A for washing machine application started in 1999 and was completed successfully. Fairchild SPMs are going to be the best solution for low power inverter-driven AC drive system after 2001. The new SPM Packages like SPM ∥ and SPIM for the next generation IPM with the highest competitiveness (cost & performance) shall be continuouslly developed.

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