Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Manufacture of Surface Mounted Device Type Fast Recovery Diode with Ceramic Package

세라믹 패키지를 이용한 표면실장형 다이오드의 제작과 특성평가

  • 전명표 (요업기술원 첨단소재 부품팀) ;
  • 조상혁 (요업기술원 첨단소재 부품팀) ;
  • 한익현 (요업기술원 첨단소재 부품팀) ;
  • 조정호 (요업기술원 첨단소재 부품팀) ;
  • 김병익 (요업기술원 (KICET) 첨단소재 부품팀) ;
  • 유인기 (코브 테크놀로지)
  • Published : 2007.05.01
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Abstract

Generally, a diode package consists of the synthetic resin that has good durability but low thermal conductivity. The surface mounted type fast recovery diode was fabricated by using ceramic package. Its main manufacture processes are composed of soldering, sillicon coating and side termination. And it has various advantages that diode is small, easy manufacture and fast cooling. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5.28 ns, 1322 V, 1.08 V, $0.45\;{\mu}A$, respectively.

Keywords

References

  1. F. Cappelluti, F. Bonani, M. Fruno, G. Ghione, R. Carta, L. Bellemo, C. Bocchiola, and L. Merlin, 'Physics based mixed mode reverse recovery modeling and optimization of Si PiN and MPS fastr recovery diodes', Microelectronics Journal, Vol. 37, p. 190, 2002 https://doi.org/10.1016/j.mejo.2005.09.026
  2. 김상철, 김은동, '전력반도체 기술 및 시장동향', 전기재료학회논문지, 15권, 3호, p. 19, 2002
  3. 김성진, '금속 가드링에 SiC 쇼트키 다이오드의 항복전압에 미치는 영향', 전기재료학회논문지, 18권, 10호, p. 877, 2005
  4. 김병길, 백종무, 이재성, 배영호, '양성자가 주입된 NPT형 전력용 다이오드의 전류 전압 특성', 전기재료학회논문지, 19권, 1호, p. 9, 2006 https://doi.org/10.4313/JKEM.2006.19.1.007
  5. 이혁모, '환경친화적 무연솔더링 접합 기술 동향', 전기재료학회논문지, 16권, 7호, p. 22, 2003