• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.429-430
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• 2007

FPA (Focal Plane Arrary)를 이용한 적외선 영상 획득 시스템에서 발생하는 주요 잡음 중 하나는 영상에 존재하는 공간적 고정 패턴 잡음(SFPN, Spatial Fixed Pattern Noise)이다. 이것이 발생하는 주된 요인은 배열을 이루고 있는 각 검출기들과, FPA 출력단에 있는 증폭기의 입출력 응답이 균일하지 않고, 시간이 흐름에 따라 그 응답특성이 변화하기 때문이다. 이 문제를 극복하기 위하여 일반적으로 교정기반 불균일 보정 방법(CBNUC, Calibration Based Nonuniformity Correction)과 장면기반 불균일 보정방법(SBNUC, Scene Based Nonuniformity Correction)이 사용된다. 본 논문은 CBNUC를 사용하는 시스템의 FPA 출력단 회로에 구성된 복수의 증폭기에 존재하는 이득의 차이 및 잡음에 의한 불균일을 보정하기 위한 보간 기법을 제안한다. 실험을 통하여 제안한 기법이 CBNUC 기반 적외선 영상 시스템에서 발생하는 규칙적인 패턴의 SFPN을 효율적으로 제거하는 것을 확인하였다. 또한, 제안한 기법은 CBNUC 기반 적외선 영상 시스템에서 주기적으로 수행해야하는 단일점보정 (OPC, One Point Correction)의 수행횟수를 줄이고, 연산량도 적어 실시간 시스템 구현이 가능하다.

• Proceedings of the IEEK Conference
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• 2001.06e
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• pp.25-28
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• 2001

This paper introduce a millimeter-wave radar system. As Fig 1 shows, This system consists of millimeter-wave radar front-end and digital signal processing parts through receive waves regarding up-coming obstacles. The system works as follow process; (1) Generate regular tripodal waves using the FMCW pulse generator (2) Transmit/Receive waves regarding up-coming obstacles (3) Analog filtering (4) FIFO memory interface (5) FFT(Fast Fourier Transform) (6) Calculation of distance / speed between cars (7) Object display and calibration. We have progress to solve the problem like as increase of traffic accidents causing damage and injuries due to the increased number of motor vehicles and long distance driving, and Need for a device to help drivers who are in trouble due to bad weather conditions. We are expect to Take the lead as a core technology in the ITS industry and to develop circuit and signal processing technologies related to millimeter-wave bandwidth.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.3-5
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• 2000

1.8V,4Gb DDR SDRAM설계 및 제작을 수행하였다. DRAM동작 시 발생하는 Bit Line간 CouplingNoise를 보상하기 위한 Twisted Open Bit Line 구조를 제안하였다. Low Voltage Operation으로 인한 Bit Line Sense Amplifier 의 동작 저하를 보상하기 위한 BL S/A Pre-Sensing 방식 및 Reference Bit Line Voltage Calibration 구조를 제안하였다. Chip면적 증가로 인한 동작속도 감소의 보상을 위해 Repeater Driver 구조를 Core 및 Periphery Circuit에 적용하여 동작 대비 Chip 면적의 증가를 최소화 하도록 하였다.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.955-956
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• 2007

차단기는 전력계통에서 사고시 고장점을 분리 차단하여 계통을 보호하고, 복구 완료시 전원을 투입하는 장치로 전력기기 중 가장 중요한 제품이며, 특히 저압 차단기는 실제 가정 및 소규모 공장에서 많이 사용되고 있어 안전성과 성능의 신뢰성이 가장 중요한 제품이므로 단락성능에 대한 성능평가가 이루어져야 한다. 이와 같은 단락성능평가를 위한 단락시험설비의 측정시스템은 시험 신뢰도의 확보를 위해 주기적으로 교정하여 사용하여야 한다. 본 논문에서는 측정시스템으로 구성된 각 계측기의 교정 결과를 이용하여 전체 측정시스템을 교정하고자 한다.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.40 no.1
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• pp.19-29
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• 2003

This paper proposes a CMOS readout circuit for uncooled micro-bolometer arrays adopting a four-point step calibration technique. The proposed readout circuit employing an 11b analog-to-digital converter (ADC), a 7b digital-to-analog converter (DAC), and an automatic gain control circuit (AGC) extracts minute infrared (IR) signals from the large output signals of uncooled micro-bolometer arrays including DC bias currents, inter-pixel process variations, and self-heating effects. Die area and Power consumption of the ADC are minimized with merged-capacitor switching (MCS) technique adopted. The current mirror with high linearity is proposed at the output stage of the DAC to calibrate inter-pixel process variations and self-heating effects. The prototype is fabricated on a double-poly double-metal 1.2 um CMOS process and the measured power consumption is 110 ㎽ from a 4.5 V supply. The measured differential nonlinearity (DNL) and integrat nonlinearity (INL) of the 11b ADC show $\pm$0.9 LSB and $\pm$1.8 LSB, while the DNL and INL of the 7b DAC show $\pm$0.1 LSB and $\pm$0.1 LSB.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.40 no.3
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• pp.135-144
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• 2003

This work proposes on-chip full CMOS current and voltage references for high-speed mixed-mode circuits. The proposed current reference circuit uses a digital-domain calibration method instead of a conventional analog calibration to obtain accurate current values. The proposed voltage reference employs internal reference voltage drivers to minimize the high-frequency noise from the output stages of high-speed mixed-mode circuits. The reference voltage drivers adopt low power op amps and small- sized on-chip capacitors for low power consumption and small chip area. The proposed references are designed, laid out, and fabricated in a 0.18 um n-well CMOS process and the active chip area is 250 um x 200 um. The measured results show the reference circuits have the power supply variation of 2.59 %/V and the temperature coefficient of 48 ppm/$^{\circ}C$ E.

• Journal of Astronomy and Space Sciences
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• v.14 no.2
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• pp.312-319
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• 1997

The magnetometer is one of the most important payloads for scientific satellite to monitor the near-earth space environment. The electromagnetic variations of the space environment can be observed with the electric and magnetic field measurements. In practice, it is well known that the measurement of magnetic fields needs less technical complexities than that of electric fields in space. Therefore the magnetometer has long been recognized as one of the basic payloads for the scientific satellites. In this paper, we discuss the scientific fluxgate magnetometer which will be on board the KITSAT-3. The main circuit design of the present magnetometer is based on that of KITSAT-1 and -2 but its facilities have been re-designed to improve the resolution to about 5nT for scientific purpose. The calibration and noise level test of this circuit have been performed at the laboratory of the Tierra Tecnica company in Japan.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.1
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• pp.43-48
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• 2010

The heat sink system for a main board in a network server computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. The solder creeping is caused by a constant high temperature condition in the computer and it eventually makes fatal failures. The FE model is used to calculate the stress and predict the life of soldered anchor in the computer. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. The creep test is conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model's constants. Precise life prediction of soldered anchor in creep condition can be performed by this model.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.11 no.1
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• pp.14-23
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• 1997

In this paper, the results of the measurement and analysis of extremely low frequency(ELF) electric field in the vicinity of 154[kV] overhead transmission lines have been described. The planar-type electric field sensor has been fabricated by three dimensional structure with special consideration of taking the power frequency and lower components. The calibration experiments have been carried out according to the procedures of IEEE recommendation. The electric field measuring system has the frequency bandwidth of 7[Hz] to 2.7[MHz] and the response sensitivity of 0.094[mV/V/m]. Also the practical measurements of electric field under an 154[kV] double circuit overhead transmission lines have been made and analyzed. It was known that the lateral electric field profiles under an 154[kV] double circuit overhead transmission lines show the asymmetrical distributions owing to the environmental metal frame structures and their maximum electric field magnitude is less than 3[kV/m]. It can be concluded that the measured results of the electric fields satisfy with all limits or guidelines of the various authorized international institutes' recommendations.

• Journal of Sensor Science and Technology
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• v.25 no.1
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• pp.57-64
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• 2016

To understand a two-phase flow, a liquid film thickness is one of the important factors. A lot of researches have been performed to measure liquid film thickness with various approaches. Recently, an electrical conductance method which uses the conductivity of the liquid film has been widely applied on measuring the liquid film thickness. Though the electrical method has an advantage in high spatial resolution, as the conductivity of liquid can be affected by its temperature variation, the conventional electrical conductance methods have a limitation in being applied on varying temperature conditions where a heat transfer is involved. The purpose of this study is to develop a three-ring liquid film sensor that overcomes the limitation of the conventional method. The three-ring conductance method can measure the film thickness regardless of temperature variation by compensating the change of liquid conductivity. Considering its application on a wide range of conditions such as high temperature or curved surfaces, the sensor was fabricated on flexible printed circuit board (FPCB) in this study. This paper presents the concept of the measurement method, design procedure, prototype sensor fabrication and calibration results.