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http://dx.doi.org/10.3795/KSME-A.2010.34.1.43

Creep Characteristics Verification of FE Model for SnPb Solder  

Han, Chang-Woon (Korea Electronics Technology Institute)
Park, No-Chang (Korea Electronics Technology Institute)
Oh, Chul-Min (Korea Electronics Technology Institute)
Hong, Won-Sik (Korea Electronics Technology Institute)
Song, Byeong-Seok (Korea Electronics Technology Institute)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.34, no.1, 2010 , pp. 43-48 More about this Journal
Abstract
The heat sink system for a main board in a network server computer is built on printed circuit board by an anchor structure, mounted by eutectic SnPb solder. The solder creeping is caused by a constant high temperature condition in the computer and it eventually makes fatal failures. The FE model is used to calculate the stress and predict the life of soldered anchor in the computer. In the model, Anand constitutive equation is employed to simulate creep characteristics of solder. The creep test is conducted to verify and calibrate the solder model. A special jig is designed to mitigate the flexure of printed circuit board and to get the creep deformation of solder only in the test. Test results are compared with analysis and calibration is conducted on Anand model's constants. Precise life prediction of soldered anchor in creep condition can be performed by this model.
Keywords
FE Model Verification; Creep; SnPb, Solder;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 0
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