• Transactions of Materials Processing
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• v.20 no.8
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• pp.588-594
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• 2011

A new manufacturing process is presented for automotive drive plate using a boron-containing carbon steel sheet, which is hot-formed and press quenched. Particular attention was given to the capability of the process in minimizing dimensional change.

• 전기의세계
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• v.30 no.4
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• pp.227-230
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• 1981

The variation of sheet resistance and the reduction of masking oxide thickness with the flow rate of nitrogen gas has been measured in Boron predeposition process with Planar Diffusion source, BN-975. At 900.deg. C, the sheet resistance varied as much as 75% when the nitrogen flow rate was changed from 0.4 liters/min to 2.0 liters/min. At 975.deg. C, however, only 12% of sheet resistance variation was observed under the same flow rate change. The reduction of masking oxide thickness at 975.deg. C for a 5 min predeposition was 600 nm when the nitrogen flow rate was 0.4 liters/min. When the flow rate incresased to 1.9 liters/min, however, only 100nm of masking oxide was consumed in a similar predeposition process.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.252.1-252.1
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• 2013

Hexagonal boron nitride (h-BN) is a two dimensional material which has high band-gap, flatness and inert properties. This properties are used various applications such as dielectric for electronic device, protective coating and ultra violet emitter so on. 1) In this report, we were growing h-BN sheet directly on sapphire 2"wafer. Ammonia borane (H3BNH3) and nickel were deposited on sapphire wafer by evaporate method. We used nickel film as a sub catalyst to make h-BN sheet growth. 2) During annealing process, ammonia borane moved to sapphire surface through the nickel grain boundary. 3) Synthesized h-BN sheet was confirmed by raman spectroscopy (FWHM: ~30cm-1) and layered structure was defined by cross TEM (~10 layer). Also we controlled number of layer by using of different nickel and ammonia borane thickness. This nickel film supported h-BN growth method may propose fully and directly growing on sapphire. And using deposited ammonia borane and nickel films is scalable and controllable the thickness for h-BN layer number controlling.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.925-926
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• 2012

• Korean Journal of Materials Research
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• v.28 no.5
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• pp.279-285
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• 2018

Graphene is an interesting material because it has remarkable properties, such as high intrinsic carrier mobility, good thermal conductivity, large specific surface area, high transparency, and high Young's modulus values. It is produced by mechanical and chemical exfoliation, chemical vapor deposition (CVD), and epitaxial growth. In particular, large-area and uniform single- and few-layer growth of graphene is possible using transition metals via a thermal CVD process. In this study, we utilize polystyrene and boron oxide, which are a carbon precursor and a doping source, respectively, for synthesis of pristine graphene and boron doped graphene. We confirm the graphene grown by the polystyrene and the boron oxide by the optical microscope and the Raman spectra. Raman spectra of boron doped graphene is shifted to the right compared with pristine graphene and the crystal quality of boron doped graphene is recovered when the synthesis time is 15 min. Sheet resistance decreases from approximately $2000{\Omega}/sq$ to $300{\Omega}/sq$ with an increasing synthesis time for the boron doped graphene.

• Transactions of Materials Processing
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• v.32 no.3
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• pp.160-165
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• 2023

As the supply of eco-friendly vehicles increases, the application rate of hot stamping components is rising to reduce vehicle weight and improve safety. Although Al-Si coated steel sheets are commonly used in hot stamping processes, their manufacturing costs are elevated due to process patents and royalties. Various hot stamping studies have been conducted to reduce these production costs. In this study, we derived a process control method for suppressing the oxide layer of hot stamping parts using uncoated boron steel sheets. Firstly, hat-shaped parts were hot stamped under atmospheric conditions to analyze the tendency of oxide layer formation by location. Then, the Gleeble system was used to observe oxide layer formation based on oxygen content under various atmospheric conditions. Finally, the oxide layer thickness was quantitatively measured using SEM images.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.4
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• pp.260-264
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• 2010

In this paper, Ni silicide is formed on boron cluster ($B_{18}H_{22}$) implanted source/drains for shallow junctions of nano-scale CMOSFETs and its thermal stability is improved, using vacuum annealing. Although Ni silicide on $B_{18}H_{22}$ implanted Si substrate exhibited greater sheet resistance than on the $BF_2$ implanted one, its thermal stability was greatly improved using vacuum annealing. Moreover, the boron depth profile, using vacuum post-silicidation annealing, showed a shallower junction than that using $N_2$ annealing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.708-712
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• 2004

Shallow $p^+-n$ junctions were formed by ion implantation and dual-step annealing processes. The dopant implantation was performed into the crystalline substrates using BF$_2$ ions. The annealing was performed with a rapid thermal processor and a furnace. FA+RTA annealing sequence exhibited better junction characteristics than RTA+FA thermal cycle from the viewpoint of junction depth and sheet resistance. A new simulator is designed to model boron diffusion in silicon. The model which is used in this simulator takes into account nonequilibrium diffusion, reactions of point defects, and defect-dopant pairs considering their charge states, and the dopant inactivation by introducing a boron clustering reaction. Using initial conditions and boundary conditions, coupled diffusion equations are solved successfully. The simulator reproduced experimental data successfully.

• Laser Solutions
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• v.15 no.1
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• pp.1-5
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• 2012

Recently ultra high strength steels(UHSS) has been widely applied to the structural or safety components in the automotive industry. Specially, hot stamping boron steel 22MnB5 has shown the crash-resistant characteristics when applying to bumpers and pillars. Lap joint Laser welding of the hot stamped and die quenched sheets of Boron steel was carried out using 3kW Nd/YAG laser. The appropriate Lap joint laser welding conditions were founded separately for four lap joint combinations. The lower sheest is a hot stamped sheet in common and the upper sheet is selected among the hot stamped steel and high strength steels such as SPCC, 370MPa, and 590MPa grade high strength steels. Cross bead sections and local hardening and softening were observed as well as tensile-shear test results.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1112-1115
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• 2005

In this study, we performed excimer laser activation on Phosphorus or Boron doped a-Si (amorphous silicon) film. We've got a very low sheet resistance (Rs), Rs was 60 ohm/sq. with phosphorus doping and was 65 ohm/sq. with boron doping at each optimized laser irradiation condition. We've found Rs on activated thin film showed an unprecedented behavior in both cases, because Rs had a strong dependency on the crystallinity of the activated Si film.