• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2005년도 추계 학술발표회 제17권2호
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• pp.149-152
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• 2005

In recent years, the repair of damaged reinforced concrete members strengthened by the external bonding of fiber-reinforced polymer laminates has received considerable attention. This paper investigates shear capacity of RC beams strengthened in the shear span with the Glass-Fiber and Steel-Composite Plate(GSP) experimentally. There are 2 types of strengthening method by GSP in RC beams. Test results are compared with that of each reference specimen which is not strengthened with GSP.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.408-411
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• 2008

In an attempt to enhance luminance efficiency and to reduce discharge delays of test panels with aluminum fence-electrodes, various designs of the electrodes were prepared by chemically etching the aluminum foils bonded to soda-lime glass substrate via anodic bonding process. The effects of fence design on luminance and discharge characteristics were investigated and compared with conventional ac-PDPs. These results showed a possibility of using fence-type aluminum electrode at front plates of ac-PDDs without sacrificing its performance.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.379-380
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• 2008

This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.203-215
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• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• 한국정밀공학회지
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• 제2권3호
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• pp.41-46
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• 1985

The behavior of the burn-on in sand mold has been investigated by varying the pouring metal, bonding materials, additive materials and molding sand. The results obtained from thease experiments are as follows; 1) The burn-on layer of silica sand decreased in order of carbon steel, gray cast iron and stainless steel, and thease burn layer proceeded mostly by producing FeO. 2) The burning reaction of silica sand mold in carbon steel castings declined with increasingly bentonite content, but water-glass scarcely took part in the burn-on reaction. 3) The addition of feldspar and seacoal to silica sand promoted the inhibiting burn-on. 4) The burn-on layer of sand mold decreased of silica sand, chromite sand and olivine sand.

• 한국세라믹학회지
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• 제43권6호
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• pp.327-332
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• 2006

The effect of the processing parameters on the sintered density and strength of silica-bonded SiC (SBSC) ceramics was investigated for three types of batches with different particle sizes. The SBSC ceramics were fabricated by an oxidation-bonding process. The process involves the sintering of powder compacts in air so that the SiC particles bond to each other by oxidation-derived $SiO_2$ glass or cristobalite. A finding of this study was that a higher flexural strength was obtained when the starting powder was smaller. When a ${\sim}0.3_{-{\mu}m}$ SiC powder was used as a starting powder, a high strength of $257{\pm}42\;MPa$ was achieved at a relative density of ${\sim}80%$.

• 한국정밀공학회지
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• 제17권7호
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• pp.45-51
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• 2000

지난 세기부터 MEMS 제작 기술을 이용하여 만들어진 시스템들을 의학이나 생물학적인 용도로 응용하기 위한 많은 연구가 활발히 이루어져 왔다. 기술적인 측면에서 이러한 연구들은 MEMS 분야의 초창기에 강조되어 온 표면 및 몸체 미세 가공 기술(surface ＆ bulk micromachining)과 같은 미세 구조물 제작 기술의 발전에 힘입은 바 크다. 그러나 MEMS 기술이 점차 발전되어 오면서, 가공 기술이 고도화되고 미세 시스템의 구조가 점차 복잡해짐에 따라, 많은 연구들이 단순한 가공기술을 넘어 미세 시스템을 조립하고 집적화할 수 있는 기술, 접합 (bonding) 기술, 패키징 (packaging) 기술, 3차원 형상의 제작 기술, 실리콘(silicon)이나 유리(glass)가 아닌 다른 재료를 이용한 미세 가공 기술 등의 개발을 중심으로 이루어지고 있다.(중략)

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.501-502
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• 2006

In-plane type micro piezoelectric micro grippers with pneumatic lines for manipulation biological cells and micro parts were designed, fabricated, and characterized. Micro grippers were fabricated through the final micro-sanding process after wafer level bonding between the etched 4' Si wafer with pneumatic channels and 4' glass wafer. Displacements between two jaws of fabricated micro grippers were linearly increased with applying voltages to piezoelectric actuator. In the case of applying 80 V, the displacement between two jaws was $160{\mu}m$. Using fabricated micro grippers, manipulation tests for biological cell and micro parts with the sizes less than $100{\mu}m$ are in process.

• 센서학회지
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• 제15권1호
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• pp.28-33
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• 2006

Optical-fiber sensors have been developed to determine the concentrations of glucose and lactic acid in blood samples. Fluorescence dye [tris(2,2'-biphenyridine)-ruthenium(II)-chloride (RuBPY)] was entrapped by using a silicon to the unclad tip of a glass optic fiber. Enzymes like glucose oxidase (GOD) and lactate oxidase (LOD) have been immobilized by acrylamide resin adhesive, adsorption with zeolite or covalent bonding with aminopropyl-triethoxysilan. The fiber-optic glucose/lactate sensor was then used to analyze the concentrations of glucose and lactate in blood samples. The results were compared with the results of HPLC analysis and their difference was in error by less then 5 %.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 A
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• pp.141-143
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• 1994

In this paper, an electrostatic micro-actuator is fabricated using flat p+ diaphragm. To avoid the buckling of the flat p+ diaphragm, the processes are designed appropriately. The fabrication processes of the actuator are the anisotropic etching with EPW, the boron diffusion process, Al deposition and the silicon to glass bonding using the negative photoresist. The distance between the p+ and Al electrodes is $10{\mu}m$, and the thickness of the p+ diaphragm is $2{\mu}m$. The measurement of the characteristic of the actuator is performed at 50V. The center displacement of the diaphragm is $1.5{\mu}m$ at 10Hz. In comparison with the experimental data of the actuator with corrugated diaphragm, it is confirmed that the actuator with flat diaphragm is more effective than that with corrugated one in the small deflection region.