Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2008.06a
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- Pages.379-380
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- 2008
A Study on Wafer-Level Package of RF MEMS Devices Using Dry Film Resist
Dry Film Resist를 이용한 RF MEMS 소자의 기판단위 실장에 대한 연구
- Kang, Sung-Chan (School of Electrical Engineering and Computer Sciences Seoul National University) ;
- Kim, Hyeon-Cheol (School of Electrical Engineering Ulsan University) ;
- Chun, Kuk-Jin (School of Electrical Engineering and Computer Sciences Seoul National University)
- Published : 2008.06.18
Abstract
This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.
Keywords