• Title/Summary/Keyword: bonding force test

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Effect of Surface Finish on Mechanical and Electrical Properties of Sn-3.5Ag Ball Grid Array (BGA) Solder Joint with Multiple Reflow (Sn-3.5Ag BGA 패키지의 기계적·전기적 특성에 미치는 PCB표면 처리)

  • Sung, Ji-Yoon;Pyo, Sung-Eun;Koo, Ja-Myeong;Yoon, Jeong-Won;Shin, Young-Eui;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.47 no.4
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    • pp.261-266
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    • 2009
  • The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

Quasi-Static Test for Seismic Performance of R/C Bridge Piers Retrofitted with Glassfibers (준정적실험에 의한 섬유보강된 철근콘크리트 교각의 내진성능 평가)

  • 이대형;이재형;정영수;박진영
    • Proceedings of the Korea Concrete Institute Conference
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    • 2001.05a
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    • pp.871-876
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    • 2001
  • Recent earthquakes in California and Japan caused extensive damage to highway bridge structures. It is also thought that during probable earthquakes bridge structures in Korea could be failed due to the structural deficiencies, which were nonseismically designed and constructed before 1992. In these regards, innovative strengthening methods have been developed to repair reinforced concrete bridge columns, especially by glassfiber sheet bonding methods which are widely used today. The primary objective of this research is to investigate the seismic behavior of RC bridge columns retrofitted with composite straps and to propose pertinent guidelines of repair and rehabilitation method for earthquake resistant design procedure of RC bridges which are located in low or moderate seismicity regions. Six scaled-down concrete test specimens were made with test variables such as lap splice ratio, axial force ratio, confinement ratio, composite straps in the plastic hinge region. Pertinent design guidelines could be developed for the earthquake resistant design of RC bridge piers retrofitted with glassfibers in low or moderate seismic region.

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The Comparison of Collapsible Characteristics on Decomposed Granite Soil and Loess (풍화 화연토와 loess의 붕괴특성 비교)

  • 도덕현
    • Geotechnical Engineering
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    • v.2 no.1
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    • pp.7-14
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    • 1986
  • The structure of the collapsible soils, such as decomposed granite soil and loess, were examined by the odeometer test, SEM & XES analysis and static & cyclic triaxial test, and hove this structure have influences upon the collapsible behaviour under static and cyclic load was investigated. The study results obtained are as follows; 1. The macropores space of decomposed granite soil (rd=1.50g/cm3) and loess (rd=1.43g/cm3) used in this test were well developed, and showed the behaviour of collapsible soil. 2. Collapsible soil has high resistance on the strain under natural moisture content, however, the resistance on the strain was sharply decreased by the absorption and increasing load since its special structure was destructed. 3. Under the static load, the strain of collapsible soil was high by the viscous flow of the cyclic bonds with time lapse, but Infer the cyclic load, the strain of collapsible soil was low since the tinge needed to destruct the bonding force of clay was not enough. 4. The understanding about the cyclic behaviour of collapsible soil may be helpful to predict the elastic & residual strain of the foundations by the earthquake together with the damage by the additional failure.

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Investigation of bonding properties of denture bases to silicone-based soft denture liner immersed in isobutyl methacrylate and 2-hydroxyethyl methacrylate

  • Akin, Hakan;Tugut, Faik;Mutaf, Burcu;Guney, Umit
    • The Journal of Advanced Prosthodontics
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    • v.6 no.2
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    • pp.121-125
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    • 2014
  • PURPOSE. The purpose of this study was to investigate the bonding properties of denture bases to silicone-based soft denture liners immersed in isobutyl methacrylate (iBMA) and 2-hydroxyethyl methacrylate (HEMA) for various lengths of time. MATERIALS AND METHODS. Polymethyl methacrylate (PMMA) test specimens were fabricated (75 mm in length, 12 mm in diameter at the thickest section, and 7 mm at the thinnest section) and then randomly assigned to five groups (n=15); untreated (Group 1), resilient liner immersed in iBMA for 1 minute (Group 2), resilient liner immersed in iBMA for 3 minutes (Group 3), resilient liner immersed in HEMA for 1 minute (Group 4), and resilient liner immersed in HEMA for 3 minutes (Group 5). The resilient liner specimens were processed between 2 PMMA blocks. Bonding strength of the liners to PMMA was compared by tensile test with a universal testing machine at a crosshead speed of 5 mm/min. Data were evaluated by 1-way ANOVA and post hoc Tukey-Kramer multiple comparisons tests (${\alpha}$=0.05). RESULTS. The highest mean value of force was observed in Group 3 specimens. The differences between groups were statistically significant (P<.05), except between Group 1 and Group 4 (P=.063). CONCLUSION. Immersion of silicone-based soft denture liners in iBMA for 3 minutes doubled the tensile bond strength between the silicone soft liner and PMMA denture base materials compared to the control group.

Effect of Sn Decorated MWCNT Particle on Microstructures and Bonding Strengths of the OSP Surface Finished FR-4 Components Assembled with Sn58%Bi Composite Solder Joints (OSP 표면처리된 FR-4 PCB기판과 Sn58%Bi 복합솔더 접합부의 미세조직 및 접합강도에 미치는 Sn-MWCNT의 영향)

  • Park, Hyun-Joon;Lee, Choong-Jae;Min, Kyung Deuk;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.163-169
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    • 2019
  • Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

Plating of Cu layer with the aid of organic film on Si-wafer (유기박막을 이용한 Si기판상의 구리피복층 형성에 관한 연구)

  • Park Ji-hwan;Park So-yeon;Lee Jong-kwon;Song Tae-hwa;Ryoo Kun-kul;Lee Yoon-bae;Lee Mi-Young
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.5 no.5
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    • pp.458-461
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    • 2004
  • In order to improve the adhesion properties of copper, MPS(3-mercaptopropyltrimethoxysilane) organic film were employed. The plasma pretreatment in pure He or $He/O_{2}$ mixed gas environment greatly increased adhesion force. Adhesion force was measured by scratch test with nano indenter. Microstructures and surface roughness were observed with scanning electron microscope(SEM). The characteristics of MPS layer for pretreatment were studied with flourier transform infrared spectroscope(FT-IR) and contact angle tester. The heighest adhesion was achieved in the specimen pretreated with mixed plasma and NPS coating, which was 56mN. Other specimen showed lower value by $20{\%}$ to $30{\%}$. The roughness of substrate was not affected by the bonding strength of copper plating.

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Ultrasonic Bonding of Au Stud Flip Chip Bump on Flexible Printed Circuit Board (연성인쇄회로기판 상에 Au 스터드 플립칩 범프의 초음파 접합)

  • Koo, Ja-Myeong;Kim, Yu-Na;Lee, Jong-Bum;Kim, Jong-Woong;Ha, Sang-Su;Won, Sung-Ho;Suh, Su-Jeong;Shin, Mi-Seon;Cheon, Pyoung-Woo;Lee, Jong-Jin;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.4
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    • pp.79-85
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    • 2007
  • This study was focused on the feasibility of ultrasonic bonding of Au stud flip chip bumps on the flexible printed circuit board (FPCB) with three different surface finishes: organic solderability preservative (OSP), electroplated Au and electroless Ni/immersion Au (ENIG). The Au stud flip chip bumps were successfully bonded to the bonding pads of the FPCBs, irrespective of surface finish. The bonding time strongly affected the joint integrity. The shear force increased with increasing bonding time, but the 'bridge' problem between bumps occurred at a bonding time over 2 s. The optimum condition was the ultrasonic bonding on the OSP-finished FPCB for 0.5 s.

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Experimental Evaluation on Degradation Characteristics of Epoxy Coating by Using Adhesion Force and Impedance (부착력과 임피던스를 이용한 에폭시 도장재 열화 특성에 관한 실험적 평가)

  • Nah, Hwan-Seon;Kim, Noh-Yu;Kwon, Ki-Joo;Song, Young-Chol
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.7 no.2
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    • pp.149-157
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    • 2003
  • The purpose of this paper is to quantitatively investigate aging state of epoxy coating on containment structure at nuclear power plant. In order to evaluate an physical bonding of the epoxy coating, adhesion test was performed on a degraded epoxy coating on concrete specimens fabricated by accelerated aging experiment. In addition, impedance data by ultrasonic test were measured to compare with adhesion data. From almost 50 % of the specimens, aging phenomena of epoxy coating such as pin hole, blistering was discovered. To improve reliability on quality degradation of epoxy, co-relation between two kinds of different data was analyzed. By tracing co-related these data, it was possible to figure out physical state of as-built epoxy coating. The possibility to develop new methodology of time - dependent aging state on epoxy coating was found and discussed.

Development of a Lower Limb Magnet System Capable of Polarity Conversion (극성변환이 가능한 하지의지 자석락 시스템 개발)

  • Beom-ki Hong;Seung-Gi Kim;Se-Hoon Park
    • Journal of the Institute of Convergence Signal Processing
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    • v.25 no.2
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    • pp.77-85
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    • 2024
  • The suspension device that connects the prosthetic leg and the residual limb allows lower limb amputees to wear prosthetic limbs, and is the most sensitive part when using prosthetic limbs as it is always in contact with the residual limb not only while walking but also in everyday life. In this paper, using the principles of attraction and repulsion of permanent magnets, we developed a magnetic lock suspension device that can fix the amputees and prosthetic legs of lower limb amputees by changing the polarity of the magnet. The operation method of the magnetic lock is that when neodymium magnets are placed on the left and right as NNSS based on a non-magnetic brass core, the magnetic force flows outward beyond the brass core using the adsorption member as a medium to generate bonding force. When rotated 90 degrees, the magnet moves to NSNS. The principle is that as the position moves, the magnetic force flows inward and cancels out.Based on this, we conducted a bonding test using tensile strength and a short-term comparative evaluation of the prosthesis with the shuttle lock suspension system, which was a comparison group, to verify reliability and evaluate satisfaction with the prototype. As a result, the tensile strength exceeding the appropriate bonding strength was confirmed, and the magnetic lock showed higher satisfaction than the shuttle lock. In the future, we plan to conduct long-term ADL clinical trials for commercialization and develop a product that can be distributed to actual amputees.

An Experimental Study on Internal Force By Using Fiber Rope Concrete Beam (섬유로프 인장 배치 시 콘크리트 보의 내력에 관한 실험적 연구)

  • Choi, Jae-Nam;Jin, Sung-Il;Son, Ki-Sang
    • Journal of the Korean Society of Safety
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    • v.27 no.2
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    • pp.78-83
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    • 2012
  • This is a study to confirm how to improve and substitute the existing re-bar with other material such as a fiber rope, especially super fiber rope having much more strong tensile strength. 6(b) different fiber rope reinforced beam with a section of $20{\times}30cm$ have been made and tasted as variables designed in the study. The larger diameter of fiber rope, the more capacity of the beam, even though fiber reinforced beam are increased with ten(10)percent, each. Lower capacity of fiber-reinforced beam than normal RC beam has been analyzed theoretically and empirically, based on a lot of experiences of the same size beam test. Fiber rope-reinforced concrete beam does not have sufficient capacity than RC beam due to insufficient bonding capacity of fiber rope in concrete. It leads to decrease beam bearing capacity and crack around lower center of the beam. Therefore, bonding reinforcement of fiber rope beam such as pinning a triangles steel pin in each knot of fiber rope contributes to improving bearing capacity of fiber rope reinforcing beam.