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Effect of Surface Finish on Mechanical and Electrical Properties of Sn-3.5Ag Ball Grid Array (BGA) Solder Joint with Multiple Reflow  

Sung, Ji-Yoon (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Pyo, Sung-Eun (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Koo, Ja-Myeong (SAMSUNG ELECTRONICS CO., LTD)
Yoon, Jeong-Won (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Shin, Young-Eui (Department of mechanical Engineering, Chung-Ang University)
Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Publication Information
Korean Journal of Metals and Materials / v.47, no.4, 2009 , pp. 261-266 More about this Journal
Abstract
The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.
Keywords
BGA; Solder joint; Pb-free solder; OSP; ENIG;
Citations & Related Records

Times Cited By Web Of Science : 4  (Related Records In Web of Science)
Times Cited By SCOPUS : 5
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1 Ja-Myeong Koo, C. Y. Lee, and S. B. Jung, Journal of the Microelectronics & Packaging Society 14, 71 (2007)
2 J. M. Koo and S. B. Jung, Microelectron. Eng. 82, 569 (2005)   DOI   ScienceOn
3 JESD22-B117, EIA/JEDEC standard, JEDEC Solid State Technology Association (2000)
4 W. D. Jr. Callister, Fundamentals of Materials Science and Engineering, 2nd ed., p.258-287, John Wiley & Sons (2005)
5 Michale Carano, Printed Circuit Fabracation 21, 134 (1998)
6 J. W. Yoon and S. B. Jung, Journal of Alloys and Compounds 448, 177 (2008)   DOI   ScienceOn
7 R. E. Reed-Hill and R. Abbascian, Physical Metalurgy Principles, 3rd ed., p.156-160, PWS Publishing Company, Boston (1992)
8 J. M. Koo and S. B. Jung., J. Electron. Mater. 37, p.118 (2008)   DOI
9 D. G. Kim and S. B. Jung, Journal of Alloys and Compounds 458, 253 (2008)   DOI   ScienceOn
10 J. Baffett, Microelectron. Relia. 38, 1277 (1998)   DOI   ScienceOn
11 Yun-Soo Ryu, Trend of Flip-chip technology and market share, http://www.eic.re.kr
12 J. M Koo and S. B. Jung, Adv. Mater. Research 15, 181 (2006)   DOI
13 J. M. Koo and S. B. Jung, 12th TMS2007 Annual Meeting and Exhibition, p.318, U.S.A. (2007)
14 Anonymous, Fragility of Pb-free Solder Joint, Article, p.4, Universal Instruments (2004)