Effect of Surface Finish on Mechanical and Electrical Properties of Sn-3.5Ag Ball Grid Array (BGA) Solder Joint with Multiple Reflow |
Sung, Ji-Yoon
(School of Advanced Materials Science & Engineering, Sungkyunkwan University)
Pyo, Sung-Eun (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Koo, Ja-Myeong (SAMSUNG ELECTRONICS CO., LTD) Yoon, Jeong-Won (School of Advanced Materials Science & Engineering, Sungkyunkwan University) Shin, Young-Eui (Department of mechanical Engineering, Chung-Ang University) Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University) |
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