Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
권호 표지

Effect of Surface Finish on Mechanical and Electrical Properties of Sn-3.5Ag Ball Grid Array (BGA) Solder Joint with Multiple Reflow

Sn-3.5Ag BGA 패키지의 기계적·전기적 특성에 미치는 PCB표면 처리

  • Sung, Ji-Yoon (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Pyo, Sung-Eun (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Koo, Ja-Myeong (SAMSUNG ELECTRONICS CO., LTD) ;
  • Yoon, Jeong-Won (School of Advanced Materials Science & Engineering, Sungkyunkwan University) ;
  • Shin, Young-Eui (Department of mechanical Engineering, Chung-Ang University) ;
  • Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University)
  • 성지윤 (성균관대학교 신소재공학부) ;
  • 표성은 (성균관대학교 신소재공학부) ;
  • 구자명 (삼성전자 주식회사) ;
  • 윤정원 (성균관대학교 신소재공학부) ;
  • 신영의 (중앙대학교 기계공학부) ;
  • 정승부 (성균관대학교 신소재공학부)
  • Received : 2009.01.03
  • Published : 2009.04.25
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Abstract

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

Keywords

Acknowledgement

Supported by : 한국과학재단

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